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Experimental polyimide resins have been developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of 'Kapton'/'Kapton' bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/'Kapton' bondlines were monitored by thermomechanical analysis.
PPQ (polyphenylquinoxaline) cures at room temperature, but withstands temperatures between -186 and +402 deg C. Adhesive is applied in chloroform solution. Bond forms as solvent evaporates.
A procedure is described for using argon and oxygen plasmas to promote adhesion of parylene coatings upon many difficult-to-bond substrates. Substrates investigated were gold, nickel, kovar, teflon (FEP), kapton, silicon, tantalum, titanium, and tungsten. Without plasma treatment, 180 deg peel tests yield a few g/cm (oz/in) strengths. With dc plasma treatment in the deposition chamber, followed by coating, peel strengths are increased by one to two orders of magnitude.
Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/"Kapton" bondlines were monitored by thermomechanical analysis.
An experimental effort has been undertaken to examine the effect of plasma pretreatment of various substrate materials coated with a polymer in the parylene family. This report describes the procedure and discusses initial data which indicate using plasmas of argon and oxygen to promote adhesion of parylene coatings upon many difficult-to-bond substrates. Substrates investigated were gold, nickel, kovar, teflon (FEP), kapton, silicon, tantalum, titanium, and tungsten. Without plasma treatment, 180 deg peel tests yield a few g/cm (oz/in) strengths. With dc plasma treatment in the deposition chamber, followed by coating, peel strengths are increased by one to two orders of magnitude.
This paper presents an analytical study of interface crack problems in adhesively bonded lap shear joints. A convenient and accurate method of analysis is developed on the basis of conservation laws in elasticity and of the fundamental relationships in fracture mechanics of interface crack problems. The problem is eventually reduced to a system of linear algebraic equations of mixed-mode stress intensity factor solutions. One of the salient features of the present approach is that the interface crack-tip stress intensity solutions can be determined accurately and directly by the information extracted from the far field. Solutions of the interface crack problems in lap shear joints have been obtained for the cases of various adhesive/adherend material systems and geometric configurations of the crack and the joint. Of particular interest is the evaluation of the mixed-mode stress intensity factors and the associated energy release rates. They are determined explicitly to illustrate the fundamental nature of the joint fracture problem.
Selection and evaluation of candidate adhesives for bonding composites are described. These are based on mechanical property tests (lap shear and flatwise tensile) and processibility. Consideration is given to composite-to-composite, composite-to-titanium, and honeycomb sandwich structures.
T-Peel strengths of adhesive/Titanium bonds are compared for LARC-13 with and without elastomer additives. Elastomer toughening (incorporation of small amounts of rubber into polymer matrix) has been one of the most successful methods for modifying polymer toughness. Addition polyimides are currently under consideration as high-temperature adhesives for bonding composite materials such as titanium.
Sliding friction experiments were conducted with the metals yttrium, titanium, tantalum, zirconium, vanadium, neodymium, iron, cobalt, nickel, tungsten, platinum, rhenium, ruthenium, and rhodium in sliding contact with single crystal diamond, silicon carbide, pyrolytic boron nitride, and ferrite. Auger electron spectroscopy analysis was conducted with the metals and nonmetals to determine the surface chemistry and the degree of surface cleanliness. The results of the investigation indicate the adhesion and friction of the transition metals in contact with diamond, silicon carbide, boron nitride, and ferrite are related to the relative chemical activity of the metals. The more chemically active the metal, the higher the coefficient of friction and the greater amount of transfer to the nonmetals.
New tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in the presence of a water or lower alkanol miscible ether solvent to produce an intermediate polyamic acid. The polyamic acid is then converted to the thermally stable, metal ion-filled polyimide by heating in the temperature range of 300 C to produce a flexible, high temperature adhesive.
The use of ion beams in the electronic stopping region to improve the adhesion of insulators to other materials is described. In particular, the bonding of Au films to Teflon, ferrite, and SiO2 was improved by bombarding them with He and Cl, respectively. Improvements in bonding were also observed for Au on glass, Au and Cu on sapphire, and Si3N4 on Si. The mechanism is apparently associated with sputtering and track forming processes occurring in the electronic stopping region. Some applications are discussed.
Conservation laws of elasticity for nonhomogeneous materials were developed and were used to study the crack behavior in adhesively bonded lap shear joints. By using these laws and the fundamental relationships in fracture mechanics of interface cracks, the problem is reduced to a pair of linear algebraic equations, and stress intensity solutions can be determined directly by information extracted from the far field. The numerical results obtained show that: (1) in the lap-shear joint with a given adherend, the opening-mode stress intensity factor, (K sub 1) is always larger than that of the shearing-mode (K sub 2); (2) (K sub 1) is not sensitive to adherent thickness abut (K sub 2) increases rapidly with increasing thickness; and (3) (K sub 1) and (K sub 2) increase simultaneously as the interfacial crack length increases.
Basic damage tolerance properties of Ti-6A1-4V titanium plate can be improved by laminating thin sheets of titanium with adhesives. Compact tension and center cracked tension specimens made from thick plate, thin sheet, and laminated plate (six plies of thin sheet) were tested. The fracture toughness of the laminated plate was 39 percent higher than the monolithic plate. The laminated plate's through the thickness crack growth rate was about 20 percent less than that of the monolithic plate. The damage tolerance life of the surface cracked laminate was 6 to over 15 times the life of a monolithic specimen. A simple method of predicting crack growth in a crack ply of a laminate is presented.
An investigation was conducted to examine the adhesion and friction of single-crystal diamond in contact with various transition metals and the nature of metal transfer to diamond. Sliding friction experiments were conducted with diamond in sliding contact with the metals yttrium, titanium, zirconium, vanadium, iron, cobalt, nickel, tungsten, platinum, rhenium and rhodium. All experiments were conducted with loads of 0.05 to 0.3 N, at a sliding velocity of 0.003 m per minute, in a vacuum of 10 to the -8th Pa, at room temperature, and on the (111) plane of diamond with sliding in the 110 line type direction. The results of the investigation indicate that the coefficient of friction for diamond in contact with various metals is related to the relative chemical activity of the metals in high vacuum. The more active the metal, the higher the coefficient of friction. All the metals examined transferred to the surface of diamond in sliding.
Electrical eraser removes butyl cement from protective coveralls. Method used to remove other adhesives from different surfaces.
A geometrically nonlinear finite element analysis of cohesive failure in typical joints is presented. Cracked-lap-shear joints were chosen for analysis. Results obtained from linear and nonlinear analysis show that nonlinear effects, due to large rotations, significantly affect the calculated mode 1, crack opening, and mode 2, inplane shear, strain-energy-release rates. The ratio of the mode 1 to mode 2 strain-energy-relase rates (G1/G2) was found to be strongly affected by he adhesive modulus and the adherend thickness. The ratios between 0.2 and 0.8 can be obtained by varying adherend thickness and using either a single or double cracked-lap-shear specimen configuration. Debond growth rate data, together with the analysis, indicate that mode 1 strain-energy-release rate governs debond growth. Results from the present analysis agree well with experimentally measured joint opening displacements.
Potential-energy relations involving a few parameters in simple analytic forms have been found to represent well the energetics of a wide variety of diatomic molecules. However, such two-atom potential functions are not appropriate for metals. It is well known that, in the case of metals, there exist strong volume-dependent forces which can never be expressed as pairwise interactions. The present investigation has the objective to show that, in spite of the observation concerning metals, a single binding-energy relation can be found which accurately describes diatomic molecules as well as adhesion, cohesion, and chemisorption on metals. This universality reveals a commonality between the molecular and metallic bond.