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At least 847 records · Page 47

Development of beam lead RF integrated circuits

This paper describes the design and development of a set of multifunction VHF/UHF integrated circuits aimed at providing a major improvement in spacecraft radio reliability through low stress operation and the processing of these circuits in beam-lead form. The methods evolved for the high frequency characterization of the devices are discussed together with the design of suitable test fixtures. Typical test results and the distribution of test parameters are presented. A unique carrier for beam-lead devices is described, and the need for such a device is discussed. The application of the carrier to device screening, burn-in and drift measurements is discussed together with the incentives for providing these capabilities. An overview of the integration of the devices into the spacecraft radio is given and candidate assembly processes are discussed. The technology impact of this approach upon future spacecraft radio systems is qualitatively examined.

Kline, A. J.↗

Overload-protector/fault-indicator circuit

Circuit incorporates three-terminal current limiter (78M24) to increase overall reliability and to eliminate transistor burnouts resulting from shorted interconnection lines and other overloads. Fact-acting light emitting diodes across the limiters show status of transistor output circuits.

Paluka, J. R.↗

Plug-in circuit monitor

Intelligent electronic circuit is used to monitor other circuits within module and to warn of imminent failure of module under surveillance. Monitor is housed in rectangular connector and plugs into mating jack originally designed to terminate flat conductor cables. Device can be made from existing premolded rectangular connectors.

Stringer, E. J.↗

Packaging printed circuit boards: A production application of interactive graphics

The structure and use of an Interactive Graphics Packaging Program (IGPP), conceived to apply computer graphics to the design of packaging electronic circuits onto printed circuit boards (PCB), were described. The intent was to combine the data storage and manipulative power of the computer with the imaginative, intuitive power of a human designer. The hardware includes a CDC 6400 computer and two CDC 777 terminals with CRT screens, light pens, and keyboards. The program is written in FORTRAN 4 extended with the exception of a few functions coded in COMPASS (assembly language). The IGPP performs four major functions for the designer: (1) data input and display, (2) component placement (automatic or manual), (3) conductor path routing (automatic or manual), and (4) data output. The most complex PCB packaged to date measured 16.5 cm by 19 cm and contained 380 components, two layers of ground planes and four layers of conductors mixed with ground planes.

Perrill, W. A.↗

The practical operational-amplifier gyrator circuit for inductorless filter synthesis

A literature is reported for gyrator circuits utilizing operational amplifiers as the active device. A gyrator is a two port nonreciprocal device with the property that the input impedance is proportional to the reciprocal of the load impedance. Following an experimental study, the gyrator circuit with optimum properties was selected for additional testing. A theoretical analysis was performed and compared to the experimental results for excellent agreement.

Sutherland, W. C.↗

Ultrasonic evaluation of high voltage circuit boards

Preliminary observations indicate that an ultrasonic scanning technique may be useful as a quick, low cost, nondestructive method for judging the quality of circuit board materials for high voltage applications. Corona inception voltage tests were conducted on fiberglass-epoxy and fiberglass-polyimide high pressure laminates from 20 to 140 C. The same materials were scanned ultrasonically by utilizing the single transducer, through-transmission technique with reflector plate, and recording variations in ultrasonic energy transmitted through the board thickness. A direct relationship was observed between ultrasonic transmission level and corona inception voltage. The ultrasonic technique was subsequently used to aid selection of high quality circuit boards for the Communications Technology Satellite.

Klima, S. J.↗

A parylene coating process for hybrid circuits

The parylene coating process developed during this program consists of (1) obtaining a hybrid cover with a hole in it, (2) sealing of the circuit with a hole in the cover, (3) parylene coating through the hole with the external leads protected from parylene by appropriate fixturing, and (4) sealing of the hole by soldering a pretinned kovar tab. Development of the above process required optimization of the parylene coater parameters to obtain a uniform consistent coating which could offer adequate protection to the circuits, fixture design for packages of various types, determination of the size of the deposition hole, and the amount of dimer charge per run, a process to hermetically seal the deposition holes and establishment of quality control techniques or acceptance criteria for the deposited film.

Source record↗

Factors affecting the open-circuit voltage and electrode kinetics of some iron/titanium redox flow cells

Performance of the iron-titanium redox flow cell was studied as a function of acid concentration. Anion permeable membranes separated the compartments. Electrodes were graphite cloth. Current densities ranged up to 25 mA/square centimeter. Open-circuit and load voltages decreased as the acidity was increased on the iron side as predicted. On the titanium side, open-circuit voltages decreased as the acidity was increased in agreement with theory, but load voltages increased due to decreased polarization with increasing acidity. High acidity on the titanium side coupled with low acidity on the iron side gives the best load voltage, but such cells show voltage losses as they are repeatedly cycled. Analyses show that the bulk of the voltage losses are due to diffusion of acid through the membrane.

Reid, M. A.↗

Semicustom integrated circuits and the standard transistor array radix (STAR)

The development, application, pros and cons of the semicustom and custom approach to the integration of circuits are described. Improvements in terms of cost, reliability, secrecy, power, and size reduction are examined. Also presented is the standard transistor array radix, a semicustom approach to digital integrated circuits that offers the advantages of both custom and semicustom approaches to integration.

Edge, T. M.↗

Clearance of short circuited ion optics electrodes by capacitive discharge

The ion optics electrodes of low specific impulse (3000 sec) mercury electron bombardment ion thrusters are vulnerable to short circuits by virtue of their relatively small interelectrode spacing (0.5 mm). Metallic flakes from backsputtered deposits are the most probable cause of such 'shorts' and 'typical' flakes have been simulated here using refractory wire that has a representative, but controllable, cross section. Shorting wires can be removed by capacitive discharge without significant damage to the electrodes. This paper describes an evaluation of 'short' removal versus electrode damage for several combinations of capacitor voltage, stored energy, and short circuit conditions.

Poeschel, R. L.↗

Ultrasonic evaluation of high voltage circuit boards

Preliminary observations indicate that an ultrasonic scanning technique may be useful as a quick, low cost, nondestructive method for judging the quality of circuit board materials for high voltage applications. Corona inception voltage tests were conducted on fiberglass-epoxy and fiberglass-polyimide high pressure laminates from 20 to 140 C. The same materials were scanned ultrasonically by utilizing the single transducer, through-transmission technique with reflector plate, and recording variations in ultrasonic energy transmitted through the board thickness. A direct relationship was observed between ultrasonic transmission level and corona inception voltage. The ultrasonic technique was subsequently used to aid selection of high quality circuit boards for the Communications Technology Satellite.

Klima, S. J.↗

Synchronous transfer circuits for redundant systems

Circuit arrangements for flip-flops, counters, and clock drivers in redundant systems ensure that control is synchronously transferred to surviving components when failure occurs. In addition to original application to spacecraft systems, redundant circuits have terrestrial uses in power generators, solar-energy converters, computers, vehicle controllers, and other systems demanding high reliability.

Nagano, S.↗

Simple digital pulse-programing circuit

Pulse-sequencing circuit uses only shift register and Exclusive-OR gates. Circuit also serves as date-transition edge detector (for rising or falling edges). It is used in sample-and-hold, analog-to-digital conversion sequence control, multiphase clock logic, precise delay control computer control logic, edge detectors, other timing applications, and provides simple means to generate timing and control signals for data transfer, addressing, or mode control in microprocessors and minicomputers.

Langston, J. L.↗

Testing integrated circuits by photoexcitation

System for testing integrated circuits uses photoexcitation to determine quality of internal elements inaccessible to electrical tests. Approach prevents direct monitoring of internal operation of circuit by measurements at external terminals and is superior to electron beam scanning due to nondestructiveness.

Erickson, J. J.↗

Hybrid temperature-monitoring circuit

Hybrid circuit developed for use in hand-held vital signs monitor converts resistance of thermistor probe to 3 1/2 digit BCD (binary-coded-decimal) temperature readout. If used alone circuit can form 'stand alone' temperature monitor or can transmit temperature data via telemetry to data acquisition systems.

Rinard, G. A.↗

Measurement of material parameters that limit the open-circuit voltage in P-N-junction silicon solar cells

The greatest gains in solar energy conversion efficiency of p-n-junction silicon solar cells come from increasing the open-circuit voltage V sub OC; it is important to understand and characterize the material parameters that limit the V sub OC. Strong experimental evidence exists to support the assertion that either an anomalously large minority carrier charge storage or an anomalously small minority carrier lifetime in the quasi-neutral emitter region limits the open circuit voltage. A method is presented for measuring charge storage and effective lifetime. Static and transient measurements are analyzed using physical models of the solar cell characteristics. This analysis yields the emitter charge storage and life-time, which then can be related to the various physical mechanisms, such as energy band gap shrinkage, that have been proposed earlier as responsible for limiting V sub OC.

Lindholm, F. A.↗

Integrated circuit process and design rule evaluation techniques

A technique is described for determining the applicability of a particular process for the fabrication of large-scale integrated (LSI) circuits. Test arrays were developed to isolate various critical processing steps in a fabrication sequence and a statistical evaluation of these steps was carried out that related yield or success in achieving a desired result to the number of times the results were attempted. It was found that, in general, yield is a sensitive function of physical dimensions as is the packing density of a particular array. It is, therefore, possible to generate an optimum set of physical dimensions or design rules that maximize the expected number of working circuits on a wafer.

Ipri, A. C.↗