Integrated circuit process and design rule evaluation techniques

Abstract

A technique is described for determining the applicability of a particular process for the fabrication of large-scale integrated (LSI) circuits. Test arrays were developed to isolate various critical processing steps in a fabrication sequence and a statistical evaluation of these steps was carried out that related yield or success in achieving a desired result to the number of times the results were attempted. It was found that, in general, yield is a sensitive function of physical dimensions as is the packing density of a particular array. It is, therefore, possible to generate an optimum set of physical dimensions or design rules that maximize the expected number of working circuits on a wafer.