Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “CMOS”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 793 records · Page 44
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Spacecraft in switch matrix for wide band service applicatons in 30/20 GHz communications satellite systems

Bandwidth, switching speed, off-state isolation, and reliability over a ten-year mission were factors in determining the optimum available technology for satellite communications switching in 1982. A proof of concept model for a 20 x 20 coupled crossbar switch matrix designed with FET devices for microwave switching and with high speed CMOS LIS for switch crosspoint addressing was fabricated and tested. Results show the design is feasible for application in a multichannel SS-TDMA communications system. Expandibility can readily be achieved with this design. A conceptual design study for a 100 x 100 switch matrix utilizing a coupled crossbar architecture implemented with a monolithic microwave integrated circuits revealed technology needs for high capacity switch matrices.

Cory, B. J.↗
NASA NTRS1982

Development of a microwave 20 x 20 switch matrix for 30/20 GHz SS-TDMA application

The design and fabrication of a 3-8 GHz, 20 x 20 Satellite Switched-Time Division Multiple Access IF switch matrix applicable to a 30/20 GHz communications satellite are described. An assessment of switch architecture in 1980 concluded that the GaAs FET-based coupled crossbar switch matrix, incorporating high speed CMOS LSI logic for switch crosspoint addressing, would be the optimum technology available for communications satellite switching by 1982. This assessment was based on such factors as switching speed, bandwidth, off-state isolation, and reliability, over a 10-year mission life. A proof-of-concept model's construction and testing are presented.

Cory, B. J.↗
NASA NTRS1982

Test chips for custom ICs - Six kinds of test structures

Microelectronic test chips contain a number of test structures that are used for a variety of purposes in fabricating integrated circuits. For convenience, their use is divided into six groups: layout-rule evaluating, process-parameter extraction, device-parameter extraction, circuit-parameter extraction, initial-fabrication failure analysis, and reliability failure analysis. A given test structure can be used to gather information in a number of these groups. Examples are given here of the kinds of parameters that can be obtained in each of these groups. A table is included summarizing various device failures common to bulk CMOS and indicating failure mechanisms appearing after wafer fabrication and after stress.

Buehler, M. G.↗
NASA NTRS1982

The damage equivalence of electrons, protons, and gamma rays in MOS devices

The results of laboratory tests to determine the radiation damage effects induced on MOS devices from Co-60, electron, and proton radiation are reported. The tests are performed to establish the relationship between the Co-60 gamma rays and the level of damage to the MOS devices in regards to different damages which can be expected with the electron and particle bombardments experienced in space applications. CMOS devices were exposed to the Co-60 gamma rays, 1 MeV electrons, and 1 MeV protons while operating at 3, 10, and 15 V. The test data indicated that the Co-60 source was reliable for an initial evaluation of the electron damages up to 2 MeV charge. A correction factor was devised for transferring the Co-60 measurements to proton damages, independent of bias and transistor types, for any orbit or environment.

Brucker, G. J.↗
NASA NTRS1981

A low-power, high-throughput maximum-likelihood convolutional decoder chip for NASA's 30/20 GHz program

It is pointed out that the NASA 30/20 GHz program will place in geosynchronous orbit a technically advanced communication satellite which can process time-division multiple access (TDMA) information bursts with a data throughput in excess of 4 GBPS. To guarantee acceptable data quality during periods of signal attenuation it will be necessary to provide a significant forward error correction (FEC) capability. Convolutional decoding (utilizing the maximum-likelihood techniques) was identified as the most attractive FEC strategy. Design trade-offs regarding a maximum-likelihood convolutional decoder (MCD) in a single-chip CMOS implementation are discussed.

Mccallister, R. D.↗
NASA NTRS1985

Wire-Identification Instrument

Instrument automatically tests each wire in multiwire cable and identifies specified wire to be segregated or labeled and locates wire connected to specified connector pin. Instrument made with readily available CMOS integrated circuits. More efficient and reliable than conventional continuity testers and less expensive than computer controlled units.

Lonborg, J. O.↗
NASA NTRS1983

Logic Simulator Program

The source code for the SPICE 2 program was deblocked in order to isolate and compile the subroutine in an effort to provide a software simulation of discrete and combinatorial electronic components. Incompatibilities between the UNIVAC 1180 FORTRAN and the Sigma V CP-V FORTRAN 4 were resolved. The SPICE 2 model is to be used to determine gate and fan-out delays, logic state conditions, and signal race conditions for transistor array elements and circuit logic to be patterned in the (SPI) 7101 CMOS silicon gate semicustom array. The simulator is to be operable from the CP-V time sharing terminals.

Agarwal, R. K.↗
NASA NTRS1982

Baseband processor development for the Advanced Communications Satellite Program

An onboard-baseband-processor concept for a satellite-switched time-division-multiple-access (SS-TDMA) communication system was developed for NASA Lewis Research Center. The baseband processor routes and controls traffic on an individual message basis while providing significant advantages in improved link margins and system flexibility. Key technology developments required to prove the flight readiness of the baseband-processor design are being verified in a baseband-processor proof-of-concept model. These technology developments include serial MSK modems, Clos-type baseband routing switch, a single-chip CMOS maximum-likelihood convolutional decoder, and custom LSL implementation of high-speed, low-power ECL building blocks.

Moat, D.↗
NASA NTRS1983

Annual Conference on Nuclear and Space Radiation Effects, Gatlinburg, TN, July 18-21, 1983, Proceedings

Topics discussed include radiation effects in devices; the basic mechanisms of radiation effects in structures and materials; radiation effects in integrated circuits; spacecraft charging and space radiation effects; hardness assurance for devices and systems; and radiation transport, energy deposition and charge collection. Papers are presented on the mechanisms of small instabilities in irradiated MOS transistors, on the radiation effects on oxynitride gate dielectrics, on the discharge characteristics of a simulated solar cell array, and on latchup in CMOS devices from heavy ions. Attention is also given to proton upsets in orbit, to the modeling of single-event upset in bipolar integrated circuits, to high-resolution studies of the electrical breakdown of soil, and to a finite-difference solution of Maxwell's equations in generalized nonorthogonal coordinates.

Source record↗
NASA NTRS1984

Microprocessor implementation of an FFT for ionospheric VLF observations

A fast Fourier transform algorithm is implemented on a CMOS microprocessor for application to very low-frequency electric fields (less than 10 kHz) sensed on high-altitude scientific balloons. Two FFT's are calculated simultaneously by associating them with conjugate symmetric and conjugate antisymmetric results. One goal of the system was to detect spectral signatures associated with fast time variations present in natural signals such as whistlers and chorus. Although a full evaluation of the system was not possible for operational reasons, a measure of the system's success has been defined and evaluated.

Elvidge, J.↗
NASA NTRS1983

Lead sulfide - Silicon MOSFET infrared focal plane development

A process for directly integrating photoconductive lead sulfide (PbS) infrared detector material with silicon MOS integrated circuits has been developed primarily for application in long (greater than 10,000 detector elements) linear arrays for pushbroom scanning applications. The processing technology is based on the conventional PMOS and CMOS technologies with a variation in the metallization. Results and measurements on a fully integrated eight-element multiplexer are shown.

Barrett, J. R.↗
NASA NTRS1983

Pinhole array capacitor for oxide integrity analysis

The integrity of the metal-poly oxide and the gate oxide was evaluated for several 5-micron CMOS-bulk processes. The pinhole array capacitor consists of diffused and poly fingers that form a network of MOS transistors (elements), which are capped by a deposited oxide and metal layer. The smallest structure used in this study contained about 15,000 elements and the largest structure contained about 68,000 elements. Each structure was divided into several subarrays. The structures are placed a number of times on each wafer. From a yield analysis of the subarrays, the elements per defect were found to be typically in excess of 50,000 elements/defect for the metal-poly oxide and 100,000 elements/defect for the gate oxide. From the switching behavior of the transistors, the gate oxide defects were tentatively identified as gate-to-body shorts rather than gate-to-diffusion shorts.

Buehler, M. G.↗
NASA NTRS1985

Designing Test Chips for Custom Integrated Circuits

Collection of design and testing procedures partly automates development of built-in test chips for CMOS integrated circuits. Testchip methodology intended especially for users of custom integratedcircuit wafers. Test-Chip Designs and Testing Procedures (including datareduction procedures) generated automatically by computer from programed design and testing rules and from information supplied by user.

Buehler, M. G.↗
NASA NTRS1985

FIFO Buffer for Asynchronous Data Streams

Variable-rate, asynchronous data signals from up to four measuring instruments or other sources combined in first-in/first-out (FIFO) buffer for transmission on single channel. Constructed in complementary metal-oxide-semiconductor (CMOS) logic, buffer consumes low power (only 125 mW at 5V) and conforms to aerospace standards of reliability and maintainability.

Bascle, K. P.↗
NASA NTRS1986

Function Generator for Image Processor

Basic elements of function generator are memory chips and interpolator chip, which incorporates multipliers and adders. Memory includes CMOS static random-access devices. 120 ns cycle time of devices allows real-time processing of image data.

Gennery, D. B.↗
NASA NTRS1985

Total integrated dose testing of solid-state scientific CD4011, CD4013, and CD4060 devices by irradiation with CO-60 gamma rays

The total integrated dose response of three CMOS devices manufactured by Solid State Scientific has been measured using CO-60 gamma rays. Key parameter measurements were made and compared for each device type. The data show that the CD4011, CD4013, and CD4060 produced by this manufacturers should not be used in any environments where radiation levels might exceed 1,000 rad(Si).

Dantas, A. R. V.↗
NASA NTRS1984

Space Shuttle flight test results of the Cosmic Ray Upset Experiment

CRUX is the first engineering flight experiment designed to test for the incidence of upsets in microcircuits by energetic particles. Harris HM 6504 4K x 1 static CMOS RAM's were used as the test device types in a 1.3 megabit memory which flew on two Shuttle flights. Ground (cyclotron) test information led to a prediction of about one error every 1000 days. No errors were experienced in 10 days of flight. While data were not in conflict with the error prediction and do support it, quantitative validation of the modeling for upsets is not statistically possible. Follow-on hardware (CRUX III) incorporates five different state-of-the-art microcircuits, and is scheduled for flight in October 1984.

Adolphsen, J. W.↗
NASA NTRS1984

Electron trapping in rad-hard RCA IC's irradiated with electrons and gamma rays

Enhanced electron trapping has been observed in n-channels of rad-hard CMOS devices due to electron and gamma-ray irradiation. Room-temperature annealing results in a positive shift in the threshold potential far beyond its initial value. The slope of the annealing curve immediately after irradiation was found to depend strongly on the gate bias applied during irradiation. Some dependence was also observed on the electron dose rate. No clear dependence on energy and shielding over a delidded device was observed. The threshold shift is probably due to electron trapping at the radiation-induced interface states and tunneling of electrons through the oxide-silicon energy barrier to fill the radiation-induced electron traps. A mathematical analysis, based on two parallel annealing kinetics, hole annealing and electron trapping, is applied to the data for various electron dose rates.

Danchenko, V.↗