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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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HF microcircuits packaging inside magnetic cores, discussing inherent advantages of RF interference and radiation shielding and heat transfer properties
Thick film microcircuit DC-TO-DC converter electronics design for TOPS spacecraft power subsystem
Document is summary of approaches that may be taken in designing hybrid microcircuits similar to those for aerospace application.
Research, design, development, and fabrication of a two-stage, solid-state, microcircuit power amplifier operating in the 2.25 GHz region of the S-band are summarized. Output is typically 7.0 watts for an input of approximately 400 mw. Input stage is an MSC 3001 transistor; output stage is an MSC 3005 transistor. Input VSWR is 1.4:1.0, or less. Efficiency of 33.3 percent or more is achieved. Second and third harmonic suppression is 30 db. Operating power is 28 VDC. The entire unit has a length of 3.80 inches, a width of 2.08 inches, and a height of 1.00 inch.
The interdiffusion of platimum and gold films, a couple utilized in beam lead microcircuits, has been studied for temperatures up to 550 C. Gold-on-platinum couples and separate platimum and gold films 80-450 nm thick, were deposited by electron beam evaporation onto oxidized (111) silicon substrates. Diffusion was monitored by means of spectral reflectance versus wavelength in the band 500-1000 nm. The separate metal films showed good adhesion and stable reflectances (after an initial change) for at least 6 h at diffusion temperatures, in contrast to the couples. Analysis of platinum diffusion through the gold films yielded an activation energy about 38 kcal/g-atom and a pre-exponential factor of the order 0.001 sq cm/sec, values close to those for volume diffusion. The pre-exponential factor especially is dependent upon film deposition conditions.
Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.
Technique increases size and clarity of microcircuit montage pictures.
The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed.
Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided.
Failures, failure modes and failure mechanisms related to the formation of migrated-gold resistive shorts (MGRS) in gold-metallized microcircuits will be described. Also, three different methods of screening devices for MGRS will be presented and the impact MGRS can have on device reliability will be discussed.
Circuit shaker removes loose particles from hybrid microcircuit packages. Machine can reduce rejections from particle impact noise determination (PIND) tests to less than 7 percent. Shaker is easily constructed and could be manufactured for distribution as kit.
Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.
A hybrid microcircuit standard was developed after a thorough review of applicable NASA, military, industry, and technical society specifications and standards and compilation of comments from technical reviewers throughout the hybrid industry. The draft of the standard submitted to the technical reviewers, the comments from the reviewers, and the completed standard are discussed.
Cyclic temperature and low temperature operating life tests, and pre-/post-life device evaluations were used to determine the degrading effects of thermal environments on microcircuit reliability. Low power transistor-transistor-logic gates and linear devices were included in each test group. Device metallization systems included aluminum metallization/aluminum wire, aluminum metallization/gold wire, and gold metallization/gold wire. Fewer than 2% electrical failures were observed during the cyclic and low temperature life tests and the post-life evaluations revealed approximately 2% bond pull failures. Reconstruction of aluminum die metallization was observed in all devices and the severity of the reconstruction appeared to be directly related to the magnitude of the temperature excursion. All types of bonds except the gold/gold bonds were weakened by exposure to repeated cyclic temperature stress.
Silicone resin of elastomer overcoatings are removed more quickly from microcircuit chips with hot concentrated sulfuric acid. Process takes few minutes as compared to day or two, using commercial solvents based on toluene, xylene, and like. Overcoatings are removed to expose circuit for failure analysis.
Results of study of hybrid microcircuit packages tested in temperature/humidity environments ranging from 25 C at 98 percent relative humidity (RH) to 85 C at 85 percent RH shows that package susceptibility to moisture is affected more by high temperature than humidity, and room temperature tests are inadequate for testing package seal integrity.
An approach for the development of the optical scanner as a screening inspection instrument for microcircuits involves comparing the quantitative differences in photoresponse images and then correlating them with electrical parameter differences in test devices. The existing optical scanner was modified so that the photoresponse data could be recorded and subsequently digitized. A method was devised for applying digital image processing techniques to the digitized photoresponse data in order to quantitatively compare the data. Electrical tests were performed and photoresponse images were recorded before and following life test intervals on two groups of test devices. Correlations were made between differences or changes in the electrical parameters of the test devices.
This report covers the time period from May 1976 to December 1979 and encompasses the three phases of accelerated testing: Phase 1, the 250 C testing; Phase 2, the 200 C testing; and Phase 3, the 125 C testing. The duration of the test in Phase 1 and Phase 2 was sufficient to take the devices into the wear out region. The wear out distributions were used to estimate the activation energy between the 250 C and the 200 C test temperatures. The duration of the 125 C test, 20,000 hours, was not sufficient to bring the test devices into the wear out region; consequently the third data point at 125 C for determining the consistency of activation energy could not be obtained. It was estimated that, for the most complex of the three device types, the activation energy between 200 C and 125 C should be at least as high as that between 250 C and 200 C. The practicality of the use of high temperature for the accelerated life tests from the point of view of durability of equipment was assessed. Guidelines for the development of accelerated life test conditions were proposed. The use of the silicon nitride overcoat to improve the high temperature accelerated life test characteristics of CMOS microcircuits was explored in Phase 4 of this study and is attached as an appendix to this report.