NASA NTRS · 19780000592
Sealing microcircuits with adhesives
Abstract
Report describes study of adhesive-sealed packages for hybrid microcircuits. Ten commercially available adhesives were used to seal metal and ceramic packages and were tested for moisture resistance at high humidity.
Keep this discovery
Explore connections, maps & timelines
Licari, J. J., Perkins, K. L.. 1979-03-01. Sealing microcircuits with adhesives. https://ntrs.nasa.gov/citations/19780000592
Cite the original work for its findings. Save a collection to share your selection of sources.