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At least 73 records · Page 4

All sources NASA NTRS DOE OSTI

DOE OSTI2024

Multi‐Objective Optimization for Rapid Identification of Novel Compound Metals for Interconnect Applications

Abstract Interconnect materials play the critical role of routing energy and information in integrated circuits. However, established bulk conductors, such as copper, perform poorly when scaled down beyond 10 nm, limiting the scalability of logic devices. Here, a multi‐objective search is developed, combined with first‐principles calculations, to rapidly screen over 15,000 materials and discover new interconnect candidates. This approach simultaneously optimizes the bulk electronic conductivity, surface scattering time, and chemical stability using physically motivated surrogate properties accessible from materials databases. Promising local interconnects are identified that have the potential to outperform ruthenium, the current state‐of‐the‐art post‐Cu material, and also semi‐global interconnects with potentially large skin depths at the GHz operation frequency. The approach is validated on one of the identified candidates, CoPt, using both ab initio and experimental transport studies, showcasing its potential to supplant Ru and Cu for future local interconnects.

Chemistry↗

DOE OSTI2022

Queued Up: Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2021 [Slides]

Proposed large-scale electric generation and storage projects must apply for interconnection to the bulk power system via interconnection queues. While most projects that apply for interconnection are not subsequently built, data from these queues nonetheless provide a general indicator for mid-term trends in developer interest. Berkeley Lab compiled and analyzed data from all seven ISOs/RTOs in concert with 35 non-ISO utilities, representing an estimated 85% of all U.S. electricity load. We include all "active" projects in these generation interconnection queues through the end of 2021, as well as data on "operational" and "withdrawn" projects where those data are available. We find that the amount of new electric capacity in these queues is growing dramatically, with over 1,400 gigawatts (GW) of total generation and storage capacity now seeking connection to the grid (over 90% of which is for zero-carbon resources like solar, wind, and battery storage). Solar (676 GW) and battery storage (~420 GW) are – by far – the fastest growing resources in the queues; combined they accounted for nearly 85% of new capacity entering the queues in 2021. Substantial wind (247 GW) capacity is also seeking interconnection, 31% of which is for offshore projects (77 GW). In total, about 930 GW of zero-carbon generating capacity is currently seeking transmission access, as is 74 GW of natural gas capacity. Hybrids now comprise a large – and increasing – share of proposed projects, particularly in CAISO and the non-ISO West. 286 GW of solar hybrids (primarily solar+battery) and 19 GW of wind hybrids are currently active in the queues; nearly half of battery storage in the queues is paired with generation. However, much of this proposed capacity will be withdrawn from the queues and not built. Among a subset of queues for which data are available, only 23% of the projects seeking connection from 2000 to 2016 have subsequently been built. Completion percentages appear to be declining and are even lower for wind and solar than other resources. Additionally, wait times are on the rise: for the regions with available data, the typical duration from connection request to commercial operation increased from ~2.1 years for projects built in 2000-2010 to ~3.7 years for those built in 2011-2021.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2022

Fine Pitch Bonding for High Density Interconnects

CTE (coefficient of thermal expansion) mismatch between two wafers has potential for brittle failure when large areas are bonded on top of one another (wafer to wafer or wafer to die bonds). To address this type of failure, we proposed patterning a polymer around metallic interconnects. For this project, utilized benzo cyclobutene (BCB) to form the bond and accommodate stress. For the metal interconnects, we used indium. To determine the benefits of utilizing BCB, mechanical shear testing of die bonding with just BCB were compared to die bonded just with oxide. These tests demonstrated that BCB, when cured for only 30 minutes and bonded at 200°C, the BCB was able to withstand shear forces similar to oxide. Furthermore, when the BCB did fail, it experienced a more ductile failure, allowing the silicon to crack, rather than shatter. To demonstrate the feasibility of using BCB between indium interconnects, wafers were pattered with layers of BCB with vias for indium or ENEPIG (electroless nickel, electroless palladium, immersion gold). Subsequently, these wafers were pattered with a variety of indium or ENEPIG interconnect pitches, diameters, and heights. These dies were bonded under a variety of conditions, and those that held a bond, were cross-sectioned and imaged. Images revealed that certain bonding conditions allow for interconnects and BCB to achieve a void-less bond and thus demonstrate that utilizing polymers in place of oxide is a feasible way to reduce CTE stress.

36 MATERIALS SCIENCE↗

NASA NTRS1984

Solar-cell interconnect design for terrestrial photovoltaic modules

Useful solar cell interconnect reliability design and life prediction algorithms are presented, together with experimental data indicating that the classical strain cycle (fatigue) curve for the interconnect material does not account for the statistical scatter that is required in reliability predictions. This shortcoming is presently addressed by fitting a functional form to experimental cumulative interconnect failure rate data, which thereby yields statistical fatigue curves enabling not only the prediction of cumulative interconnect failures during the design life of an array field, but also the quantitative interpretation of data from accelerated thermal cycling tests. Optimal interconnect cost reliability design algorithms are also derived which may allow the minimization of energy cost over the design life of the array field.

Mon, G. R.↗

NASA NTRS1989

Optical backplane interconnect switch for data processors and computers

An optoelectronic integrated device design is reported which can be used to implement an all-optical backplane interconnect switch. The switch is sized to accommodate an array of processors and memories suitable for direct replacement into the basic avionic multiprocessor backplane. The optical backplane interconnect switch is also suitable for direct replacement of the PI bus traffic switch and at the same time, suitable for supporting pipelining of the processor and memory. The 32 bidirectional switchable interconnects are configured with broadcast capability for controls, reconfiguration, and messages. The approach described here can handle a serial interconnection of data processors or a line-to-link interconnection of data processors. An optical fiber demonstration of this approach is presented.

Hendricks, Herbert D.↗

NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗

NASA NTRS2011

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Strickland, S. M.↗

DOE OSTI2023

Radio frequency tuning using a multichip module electrical interconnect structure

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

Young, Barbara Diane↗

DOE OSTI2024

Communication engine for hybrid interconnect technologies

Systems, apparatuses, and methods for dynamically selecting between wired and wireless interconnects for sending packets are disclosed. A system includes at least a hybrid communication engine and a plurality of interconnects for connecting to various end-points. The communication engine dynamically discovers and utilizes the best interconnect technology available in between given end-points. The communication engine dynamically chooses the physical interconnect that is best suited at any given time to send data from one source to one or multiple destinations. This communication can be either on-chip or across nodes. The communication engine makes a decision based on a set of predetermined parameters that can be re-adjusted by the application layer, such as latency of the transmission, message data size, physical distance from source to destination, the energy cost, and the current congestion on the alternative interconnects.

Blagodurov, Sergey↗

DOE OSTI2024

Defining Safe and Efficient Interconnection Policies for Energy Storage and Solar + Storage to Improve Integration and Reduce Costs

Energy storage has a unique and pivotal role to play in the transition to a low-carbon economy because it can help the electric grid accommodate more renewable energy. However, a number of barriers currently impede the process of connecting energy storage systems to the distribution grid. The Toolkit and Guidance for the Interconnection of Energy Storage and Solar-Plus-Storage (the “BATRIES Toolkit”), which is the publication subject to this Final Technical / Scientific Report, provides vetted solutions to eight regulatory and technical barriers to the interconnection of standalone storage and solar-plus-storage systems (referred to as “energy storage”) to the distribution grid. These recommendations are based on over a year of research and analysis by utility and industry experts. The BATRIES Toolkit also includes model language that utilities and utility regulators can use to update state interconnection rules to reduce the costs and time to safely interconnect energy storage and solar-plus-storage systems. The solutions are nationally applicable and can be applied in diverse states and markets across the U.S.

14 SOLAR ENERGY↗

DOE OSTI2020

Evolution of Distributed Energy Resource Grid Interconnection Standards for Integrating Emerging Storage Technologies

Grid interconnection standards facilitate safe and reliable grid integration of distributed energy resources (DERs). Evolution of a standard for DERs is expected to capture and accommodate widely different characteristics of DER and minimize unique grid integration challenges. This makes development of a uniform grid interconnection standard for all types of DERs a challenging and an ever-evolving consideration. This paper presents a detailed timeline of evolution, from the early 2000s to 2018, of DER interconnection standards and the research that informed their development. This is followed by a review of the research topics being considered in the grid integration of Energy Storage Systems (ESSs) which are expected to have the most significant growth amongst all DER types. These help in highlighting the need for a new standard to accommodate the unique characteristics of ESSs, and where the existing DER interconnection standard frameworks may be leveraged.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2024

Evaluating Interconnection Queue Impacts Using Hosting Capacity Analysis

The interconnection queue has been identified as a bottleneck in the efforts to shift the nations generation resources towards renewable sources and meet various state and federal goals. Efforts such as the interconnection innovation e-Xchange (i2X) are therefore trying to come up with ways in which the queue could be altered to make interconnection faster, cheaper, and fairer. This paper proposes using hosting capacity analysis methods to simulate the evolution of a power system as new resources are added. Modeling the interconnection process in this way enables simulation based study of various policy decisions for queue management and cost allocation. Sample results are presented to illustrate how some queue modifications might play out both in distribution and transmission systems.

Distributed Energy Resources, Interconnection↗

DOE OSTI2022

Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Conceptual Framework

This report explores one integrated technical and process concept designed to manage interconnection costs and streamline interconnection timelines to support near-term renewable energy deployment. We describe a new agreement between renewable energy developers and utilities, informed by the technical analysis. The agreement defines the operational parameters for a renewable energy system, with the goal of reducing risk and cost to all parties. This work provides a foundation upon which other states and utilities may build proof of concept. This report is supported by a technical analysis that is detailed in a companion report, "Use of Operating Agreements and Energy Storage to Reduce Photovoltaic Interconnection Costs: Technical and Economic Analysis" (McLaren et al. 2022).

14 SOLAR ENERGY↗

DOE OSTI2026

Regional inertia dynamics of U.S. interconnections: An event-based measurement approach

Power grid inertia plays a vital role in frequency stability following large disturbances, yet its distribution across the U.S. grid is highly uneven. While interconnection-wide inertia benchmarks are useful, they can mask regional variability driven by resource mix, network coupling, and geographic separation. This paper extends event-driven inertia estimation to the regional scale using field measurements from the Frequency Monitoring Network (FNET/GridEye). Starting from balancing authority and independent system operator footprints, candidate regions are refined using a composite coherency score that combines frequency-trajectory shape similarity, timing spread, and lead/lag behavior to ensure dynamic consistency. A filtered sliding difference method (FSDM) is then used to construct regional frequency trajectories, detect disturbance onset, and compute robust regional rate-of-change of frequency (RoCoF). Regional, local, and interconnection inertia are estimated by combining RoCoF with event power imbalance, and additional indicators (regional-to-system inertia ratio and inertial-support arrival time) quantify regional-to-interconnection coupling and relative regional contributions. The method is demonstrated on eleven regions across the Eastern Interconnection (EI) and the Western Electricity Coordinating Council (WECC), with the Electric Reliability Council of Texas (ERCOT) used for validation. In ERCOT, estimates compared against energy management system (EMS) values achieve a mean absolute percentage error of 17.94%. WECC exhibits consistently shorter inertial-support arrival times (0.15–0.3 s) than EI (0.7–1.1 s), highlighting contrasting coupling and disturbance-propagation behavior. Overall, the results reveal pronounced spatial heterogeneity in inertia and coupling, underscoring the value of regional monitoring for both operational decision-making and long-term system planning.

Disturbance events↗

DOE OSTI2023

High-bandwidth density silicon photonic resonators for energy-efficient optical interconnects

The growth of artificial intelligence applications demands ever larger and more complex deep learning models, dominating today's—and tomorrow's—data center and high-performance computing systems. While traditional electronics are failing to keep pace with application demands, silicon photonic (SiPh) interconnects have emerged as a necessary technology to support these systems. SiPh-driven wavelength-division multiplexing (WDM) offers a particularly promising path toward supporting incredibly high-aggregate link bandwidth in a compact and efficient form factor. One of the basic building blocks of these integrated WDM interconnects is the SiPh resonator. Their inherent wavelength selectivity and compact footprint allow for efficient data transmission multiplexed across dozens of carrier wavelengths. Used as add-drop (AD) filters, SiPh resonators are critical to constructing integrated tunable wavelength-selective optical circuit switches as well as for demultiplexing the different carrier wavelengths toward independent wavelength-insensitive photodiodes in a dense wavelength-division multiplexing receiver. Resonators in the all-pass (AP) configuration are widespread as well, allowing for wavelength-selective modulation to drive aggregate link bandwidths far beyond the individual channel data rate. Unlike SiPh Mach–Zehnder modulators (MZM), resonant modulators can be driven using low, complementary metal-oxide-semiconductor drive voltages, allowing for tight co-integration between photonic integrated circuits, fabricated with larger process node technologies, and electronic integrated circuits, designed to exploit the advantages of the latest node. To push toward practical peta-scale interconnects, a comprehensive review of SiPh resonators is required, addressing bottlenecks and design constraints at both the architecture and device levels. We first describe the predominant integrated link architectures and identify their limits. We then discuss the device-level design considerations that can be made for both AD and AP configuration resonators to overcome the system level limits with novel resonator device designs. Analytical models and numerical simulation of resonators are validated by experimental measurement of devices fabricated in a commercial 300-mm foundry, showing a clear path toward volume manufacturing. The demonstrated resonant modulators and filters support the feasibility of increasing the aggregate bandwidth of resonator-driven SiPh interconnects into the peta-scale regime.

42 ENGINEERING↗

DOE OSTI2024

Inertia Estimation and Trend Analysis of the United States Power Grid Interconnections

The transition from conventional to modern power systems is causing an increase in integration of inverter-based resources (IBRs). This generally leads to a decrease in total system inertia, which in-turn increases the system’s rate-of-change-of-frequency (RoCoF) during disturbances. This poses a threat to the frequency stability of the system and may falsely trigger protective devices. To monitor system status and plan for integrating renewable energy sources like photovoltaic, wind, and energy storage systems, a realistic study of inertia estimation and analysis in the United States (US) over the past decade is needed. This paper uses field-measured phasor measurement unit (PMU) data collected throughout the US from 2013 to 2023 via the Frequency Monitoring Network (FNET/GridEye) operated by the University of Tennessee, Knoxville (UTK) and Oak Ridge National Laboratory (ORNL). The collected PMU frequency data is utilized to estimate the system inertia of the three US interconnections: Eastern, Western, and Texas. Various RoCoF time windows are investigated for estimating the inertia of each interconnection by maximizing the correlation coefficient between the measured RoCoF and power mismatch. The resulting inertia trends over the past decade show approximately a 6% decline in inertia in the Eastern interconnection, a 15% decline in inertia in the Western interconnection, and a 16% increase in inertia in Texas. Key insights into how inertia is changing amidst the complex energy landscape are extracted using the fuel mix trend data. This provides valuable information for future energy strategies and planning.

30 DIRECT ENERGY CONVERSION↗

DOE OSTI2023

Resilient Communication Scheme for Distributed Decision of Interconnecting Networks of Microgrids

Networking of microgrids can provide the operational flexibility needed for the increasing number of DERs deployed at the distribution level and supporting end-use demand when there is loss of the bulk power system. But, networked microgrids are vulnerable to cyber-physical attacks and faults due to the complex interconnections. As such, it is necessary To design resilient control systems to support the operations of networked microgrids in responses to cyber-physical attacks and faults. This paper introduces a resilient communication scheme for interconnecting multiple microgrids to support critical demand, in which the interconnection decision can be made distributedly by each microgrid controller even in the presence of cyberattacks to some communication links or microgrid controllers. This scheme blends a randomized peer-to-peer communication network for exchanging information among controllers and resilient consensus algorithms for achieving reliable interconnection agreement. The network of 6 microgrids divided from a modified 123-node test distribution feeder is used to demonstrate the effectiveness of the proposed resilient communication scheme.

Vu, Thanh Long↗

DOE OSTI2023

Automating the Solar Interconnection Technical Evaluation Process: PREconfiguring and Controlling Inverter SEt-Points (PRECISE)

Utilities are receiving an increasing number of interconnection requests for distributed solar photovoltaic (PV) systems from their customers, requiring a solution to quickly and intelligently perform technical assessments of these requests and to manage these new renewable energy assets. In this paper, we present a stand-alone interconnection tool, PREconfiguring and Controlling Inverter SEt-points (PRECISETM), and how it overcomes the challenges of accelerating technical evaluations and leverages smart inverter functionality to provide local voltage support on an as-needed basis. The paper details the purpose and architecture of PRECISE, including tools, data source requirements, the model-based interconnection evaluation process, and technical results. PRECISE is an integrated software tool that customizes PV inverter settings for utilities by modeling and assessing impacts on local voltages and the need for advanced inverter functions (AIFs) (e.g., volt-VAR and volt-watt). PRECISE maximizes the use of readily available utility data sets to make fast online assessments of incoming PV interconnection requests and makes accept/reject recommendations along with custom settings for AIFs.

ENERGY PLANNING, POLICY, AND ECONOMY,SOLAR ENERGY↗