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At least 73 records · Page 4

A Virtual Space Vector Model Predictive Control for a Seven-Level Hybrid Multilevel Converter

This paper proposes a virtual space vector (VSV) model predictive control (MPC) for a three-phase seven-level (7L) hybrid multilevel converter (HMC), where each phase consists of an active-neutral-point-clamped converter with a floating H-bridge. To achieve the best current tracking, which is the primary goal of the proposed algorithm, a novel geometrical positioning approach is proposed to select the optimal voltage vector among all the realspace vectors and VSVs. Then, all the possible switching sequences that belong to the optimal voltage vector are evaluated to realize the dc capacitor voltage balancing and common-mode voltage reduction. Through an external modulator, the optimal voltage vector can be synthesized by using either one-, three-, or seven-segment switching sequence. Compared with the conventional MPC, the proposed VSV-MPC can reduce not only the computational burden but also the current THD. Both simulation and experimental results obtained on silicon carbide based 7L-HMC prototype are presented to validate the feasibility and effectiveness of the proposed VSVMPC strategy.

42 ENGINEERING↗

Simplified Two-Stage Model Predictive Control for a Hybrid Multilevel Converter With Floating H-Bridge

This paper proposes a simplified two-stage model predictive control (ST-MPC) for a hybrid multilevel converter, which is an active-neutral-point-clamped converter with floating H-bridge (ANPC-H). The objective of the first stage is to select the voltage vector that has the optimal current tracking performance by using a novel geometrical positioning approach in the complex plane. The second stage selects the best switching state among all the available switching states that belong to the same voltage vector obtained in the first stage, to balance dc capacitor voltages and reduce the common mode voltage. The proposed ST-MPC can dramatically reduce the computational burden and ensure the best current tracking by the two-stage structure, such that the execution time is much shorter compared with the conventional MPC. In addition, the geometrical positioning approach in the first stage is generic and can be applicable for any multilevel converters with N-level output; thus, this ST-MPC can be applied for both sevenand nine-level operation of the hybrid ANPC-H converter under different dc voltage ratios. Both simulation results and experimental results obtained on a silicon carbide hybrid ANPC-H converter prototype validate the feasibility and effectiveness of the proposed ST-MPC strategy.

42 ENGINEERING↗

Electrical Submersible Pumps: A System Modeling Approach for Power Quality Analysis With Variable Frequency Drives

This article proposes a high-level engineering guide to develop an integrated system model for power quality analysis in electrical submersible pump (ESP) applications with variable frequency drives (VFDs). Such analyses are troublesome in the industry due to the complexity of these systems. In this article, simple steps to perform system integration analyses of such arrangements, including torsional analysis, are developed. A simplified VFD-ESP model suitable for coupled electrical and mechanical analysis in steady state is proposed in all their configurations of practical interest. Such a model can be easily implemented in common simulation software, significantly reducing engineering efforts for implementation and analysis. The focus of the proposed model is the prediction of ESP failures that might result from a poor power quality caused by VFDs. Analytical expressions of different types of harmonics in these systems, as well as their accurate locations in the frequency domain, including their interharmonics and common-mode harmonics, are derived for this purpose. Further, the effectiveness of the proposed model is verified through offline and real-time hybrid simulation results. Finally, a comparison between simulation results obtained using the proposed model and measurements collected on a down-scale laboratory prototype is carried out to demonstrate the accuracy of the suggested modeling approach.

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Hardware Design of Medium Voltage SiC-Based Modular Multilevel Converters for Grid-Tied Applications

This paper presents a design of a 10 kV silicon carbide (SiC) MOSFET based modular multilevel converter (MMC). The MMC functions as the interconnection between a 24 kV dc bus and a 13. SkV distribution grid. This paper focuses on the hardware design of the MMC and its submodules. The gate driver, auxiliary power supply and bus bur in submodules are major components that need to meet high dv/dt immunity and high insulation voltage requirements. The gate driver achieves over 200 kV/us common mode transient immunity (CMTI). Its associated auxiliary power supply is based on an on-board transformer with over 30 kV insulation capability and 1.4 pF barrier capacitance. The busbar achieves less than 11 kV/cm electric field in the air to avoid partial discharges. Validation tests of the MMC submodule were performed by double pulse tests at 5 kV and buck converter tests at3 kV, 52A (peak). Reliable operations were achieved in validation tests.

auxiliary power supply↗

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Power semiconductor die placement on substrates used in high-power modules is generally optimized to minimize electrical parasitic (e.g., stray inductance, common-mode capacitance), taking into account the minimum spacing between semiconductor dies for thermal decoupling. The layout assumes sufficient heat spreading and transfer from dies to the cooling structure. Insulated metal substrate-based power module designs may lead to asymmetrical thermal resistance across the dies, which may cause significant temperature differences among the devices. Such unintentional thermal asymmetries can lead to oversizing the cooling system design or underusing the semiconductor power processing capability. This article proposes a thermal imbalance mitigation method that uses evolutionary optimized liquid-cooled heat sinks to improve the thermal loading among devices.

42 ENGINEERING↗

Independence of Environmental and Mechanical Damages on Silicone Adhesive Stored in a Thermo-Oxidative Environment

Abstract Elastomeric polymer materials hold a special place in today’s industrial sectors with respect to structural application needs. Low quality materials are detrimental to industries like aerospace, and automotive engineering. Assessment of the durability of elastomers for structural applications has been of much interest among the literary circles for decades and new materials keep outperforming the existing ones. Polymeric adhesives are one of the most abundantly used materials in these industries. All polymeric materials get damaged when in contact with aggressive environments in presence of high temperature and oxygen. Commonly referred to as thermo-oxidation, this environment exposes the material to heat and oxidation reactions in presence of oxygen. Resultantly, during service life, the damage to the polymer matrix is primarily caused by two factors: mechanical damage and environmental aging. Environmental aging is an irreversible phenomenon caused by changes in the molecular structure while mechanical damage maintains the shape of the polymer matrix, and the deterioration is mostly due to polymer chain mobility. Environmental aging can be caused by a single environmental agent or by a synergized impact of several environmental elements. Increasing temperature is found to be proportional to decreasing tensile strength and toughness of material. The rate and extent of degradation can be accessed by scrutinizing the changes in constitutive behavior of material through mechanical and chemical properties. Accelerated thermal aging is among the most common modes of process related degradation, leading generally to chain scission, and crosslinking phenomena and reduced resistance to fracture stress, and strain. In this experimental study, our goal is to separate the environmental degradation from mechanical damage. A silicone-based adhesive was aged in thermo-oxidative at (0%RH) aging environment. The damage and decay mechanisms have been used to draw a distinction between environmental degradation and mechanical damage. Material characterization included uniaxial tensile test (failure and cyclic) and scanning electron microscopy (SEM) tests on as-received and aged samples. Aging was conducted at three different temperatures (60°C, 80°C and 95°C) and six different exposure durations (1, 3, 10, 30, 90 and 200 days). This work confirms that environmental damage is superposed on top of the mechanical damage, and thus, they are separable. The total mechanical and environmental damage is a synergized effect of all exposure conditions and parameters involved i.e., aging time, temperature, and oxygen. The chemistry and mechanics of the polymer degradation were found to be in good agreement with each other.

Alazhary, Sharif↗

Single-element balanced detector giving 65 dB CMRR at 30 MHz

We present a simple design for a single-element balanced detector (BD) that utilizes optical fibers in the sensing and reference channels with path length differences set to detect the differential signal at a desired frequency. With this approach, we easily achieve a common-mode rejection ratio of 65 dB, corresponding to the shot-noise limit of our setup. The CMRR demonstration is made in the MHz frequency range but could be extended to the kHz or GHz range. Using a single detector, the BD achieves stable CMRR over extended periods and does not require careful matching of detectors and amplification electronics. We demonstrate the single-element balanced detector design using the optical Kerr effect induced by a 30 MHz pulsed laser, showing a significant improvement over similar experiments using a commercial balanced detector.

Badilla-Nunez, Kelly [Georgia Institute of Technol↗

Evaluation of the Nanometrics Centaur Digitizer

Sandia National Laboratories has tested and evaluated a new digitizer, the Centaur, manufactured by Nanometrics, Inc. This digitizer is used to record sensor output for seismic and infrasound monitoring applications. The purpose of the digitizer evaluation was to measure the performance characteristics in such areas as power, sensitivity, self-noise, dynamic range, system noise, modified noise power ration, relative transfer function, analog bandwidth, harmonic distortion, common mode, cross talk, timing tag accuracy and timing drift. The Centaur provides six channels of 24 bit digitization, three of which may be transmitted utilizing CD1.1 protocol.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Kinemetrics Q330M+ Digitizer Evaluation

Sandia National Laboratories has tested and evaluated a new digitizer, the Q330M+, manufactured by Quanterra, a division of Kinemetrics Inc. This digitizer is used to record sensor output for seismic and infrasound monitoring applications. The purpose of the digitizer evaluation was to measure the performance characteristics in such areas as sensitivity, input impedance, power consumption, self noise, dynamic range, system noise, relative transfer function, analog bandwidth, modified noise power ratio, harmonic distortion, common mode, cross talk, timing tag accuracy and timing drift. The Q330M+ provides six channels of 24 bit digitization, all of which may be transmitted utilizing CD1.1 protocol, at multiple sample rates.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Guralp Affinity Digitizer Evaluation

Sandia National Laboratories has tested and evaluated a new digitizer, the Affinity, manufactured by Guralp Systems. This digitizer is used to record sensor output for seismic and infrasound monitoring applications. The purpose of the digitizer evaluation was to measure the performance characteristics in such areas as sensitivity, power, self-noise, dynamic range, system noise, relative transfer function, modified noise power ratio, analog bandwidth, harmonic distortion, common mode, cross talk, timing tag accuracy and timing drift. The Affinity provides eight, rather the typical six, channels of 24 bit high sample rate digitization, all of which may be transmitted utilizing the CD1.1 protocol, at multiple sample rates.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Broadband Characterization and Circuit Model Development of Transmission-Scale Transformers

This report describes broadband measurements of transmission-scale transformers typical in the electric power grid. This work was performed as part of the EMP Resilient Grid LDRD project at Sandia National Laboratories to generate circuit models that can be used for high-altitude electromagnetic pulse (HEMP) coupling simulations and response predictions. The objective of the work was to obtain characterization data of substation yard equipment across a frequency range relevant to HEMP. Vector network analyzer measurements up to 100 MHz were performed on two power transformers at ABB-Hitachi and a single ITEC potential transformer. Custom cable breakouts were designed to interface with the transformer terminals and provide ground connections to the chassis at the base of the transformer bushings. The three-phase terminals of the power transformers were measured as a common mode impedance using a parallel resistive splitter, and the single-phase terminals of the potential transformer were measured directly. A vector fitting algorithm was used to empirically fit circuit models to the resulting two-port networks and input impedances of the measured objects. Simplified circuit representations of the input impedances were also generated to assess the degree of precision needed for high-altitude electromagnetic pulse response predictions, which were performed in Sandia's XYCE circuit simulator platform. HEMP coupling simulations using the transformer models showed significant reduction in the voltage peak and broadening in the pulse width seen at the power transformer compared to the traveling wave voltage. This indicated the importance of the load condition when defining the coupled insult in an electric power substation. Simplified circuit models showed a similar voltage at the transformer with a smoothed waveform. The presence of potential transformers in the simulation did not significantly change the simulated voltage at the power transformer. Single-port input impedance models were also developed to define load conditions when transfer characteristics were not necessary.

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A Diamagnetic-Loop-Based Beam Radius Monitor (BRM)

We describe a non-interceptive beam radius monitor that employs a diamagnetic loop. In order to increase the signal strength, the diamagnetic loop radius is considerably smaller than the outer wall radius, the device is placed inside a specially built solenoid magnet to allow independent adjustment of the guide magnetic field strength, and there are two counter-wound diamagnetic loops to double the signal strength and to eliminate common mode signals. This device is calibrated and the magnitude of the electron beam offset/tilt contribution to the measured radius estimated. This device is ready to be validated on an electron induction LINAC such a DARHT-I or DARHT-II.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Ensuring a Nuclear Power Plant Safe State Following an EMP Event - Task 7 Deliverable: EMP Testing of Secondary Coupling to Instrumentation Cables

Sandia National Laboratories performed tests to address the potential vulnerability concerns of a coupled High-Altitude Electromagnetic Pulse (HEMP) inducing secondary coupling onto critical instrumentation and control cables in a nuclear power plant, with specific focus on early-time HEMP. Three types of receiving cables in nine configurations were tested to determine transfer functions between two electrically separated cables referenced to the common mode input current on the transmitting cable. One type of transfer function related the input short circuit current and resulting open circuit voltage on the receiving cable. The other transfer function related the input short circuit current and the resulting short circuit current on the receiving cable. A 500 A standard HEMP waveform was input into the transfer functions to calculate peak coupling values on the receiving cables. The highest level of coupling using the standard waveform occurred when cables were in direct contact, with a peak short circuit current of 85 A and open circuit voltage of 9.8 kV, while configurations with separated cables predicted coupling levels of less than 5 A or 500 V.

21 SPECIFIC NUCLEAR REACTORS AND ASSOCIATED PLANTS↗

Short Circuit Detection and Voltage Sense for High Voltage Ionization Tube Power Supplies

Fermilab's PIP-II upgrade requires new rack-mounted power supplies for Beam Loss Monitor (BLM) ionization tubes compatible with the microTCA 4.1 standard, supporting high-side current measurement for short circuit detection, voltage sense telemetry, and low-side current measurement for beam loss readout. This work presents the design and preliminary schematic of such a supply. A resistive current sensing approach was chosen over inductive, optical, and Hall-effect alternatives for its independence from cable length and component availability. A 500 mΩ inline shunt steps the 2 kV common mode voltage down to roughly 70 V, producing a ~27 μV pulse during a short, which is amplified 500x, compared against a 14-bit DAC threshold, and latched to drive a fault line. Voltage sense steps the 2 kV output down at a 1V/1000V ratio, buffers it with a low bias current amplifier, and digitizes it via a 24-bit ADC over SPI. Onboard power is regulated from 12 V down to isolated 5 V and 3.3 V rails, with capacitive isolation on FPGA communication lines. Lumped parameter models were developed for the ionization tube (0.327 nF, 20 to 200 GΩ dynamic resistance) and the RG-58 coaxial cable to support the design. Component selection is complete and a preliminary schematic has been drawn in Altium Designer, forming the foundation for future prototyping and validation.

Yu, Kellen [Cornell U.]↗

Entropy Analysis of FPGA Interconnect and Switch Matrices for Physical Unclonable Functions

Random variations in microelectronic circuit structures represent the source of entropy for physical unclonable functions (PUFs). In this paper, we investigate delay variations that occur through the routing network and switch matrices of a field-programmable gate array (FPGA). The delay variations are isolated from other components of the programmable logic, e.g., look-up tables (LUTs), flip-flops (FFs), etc., using a feature of Xilinx FPGAs called dynamic partial reconfiguration (DPR). A set of partial designs is created to fix the placement of a time-to-digital converter (TDC) and supporting infrastructure to enable the path delays through the target interconnect and switch matrices to be extracted by subtracting out common-mode delay components. Delay variations are analyzed in the different levels of routing resources available within FPGAs, i.e., local routing and across-chip routing. Data are collected from a set of Xilinx Zynq 7010 devices, and a statistical analysis of within-die variations in delay through a set of the randomly-generated and hand-crafted interconnects is presented.

97 MATHEMATICS AND COMPUTING↗

Quantum random number generators

Random number generators include a thermal optical source and detector configured to produce random numbers based on quantum-optical intensity fluctuations. An optical flux is detected, and signals proportional to optical intensity and a delayed optical intensity are combined. The combined signals can be electrical signals or optical signals, and the optical source is selected so as to have low coherence over a predetermined range of delay times. Balanced optical detectors can be used to reduce common mode noise, and in some examples, the optical flux is directed to only one of a pair of balanced detectors.

97 MATHEMATICS AND COMPUTING↗

Optimizing Insulation Design for Transformers in Medium Voltage Power Conversion Systems

Medium-frequency transformers (MFTs) play a crucial role in medium-voltage (MV) solidstate transformer (SST) systems, particularly in extreme fast charging applications. Achieving partial discharge (PD)-free operation while maintaining high power density is a significant challenge due to the high electric field (E-field) stresses inherent in MV applications. This dissertation focuses on the insulation design and optimization of MFTs used in both the main power electronics circuits and auxiliary power supplies. The study begins with an overview of insulation testing methodologies, including high potential tests, basic insulation level tests, and PD tests, which are critical for evaluating MFT insulation reliability. Given the importance of PD-free operation for long-term reliability, particular emphasis is placed on understanding PD mechanisms, including void, corona, and surface discharge, and their mitigation strategies. A high voltage isolated auxiliary power supply is then introduced, utilizing a gapped transformer encapsulated in silicone gel. This design achieves PD-free insulation up to 18 kV RMS while maintaining low coupling capacitance to minimize common-mode current. The proposed solution ensures reliable operation in MV environments and offers a scalable approach for auxiliary power in cascaded SST architectures. To improve MFT insulation in main power conversion circuits, a novel structure is developed using polypropylene sheets and potting compounds to create a void-free air gap, effectively mitigating E-field intensity. A prototype transformer with this insulation structure is built and achieves PD-free operation up to 30 kV RMS. This design is experimentally validated in a resonant converter operating at 46 kW, demonstrating its feasibility for MV SST applications. Further optimization is implemented to enhance MFT performance for dual-active-bridge(DAB) converters by integrating a semiconductive shielding layer within the insulation structure. This shielding layer improves the magnetic coupling coefficient while effectively confining the E-field within high insulation materials, thereby reducing eddy current losses. The optimized MFT achieves PD-free operation at 12.6 kV RMS and is successfully tested in a DAB converter operating at 43 kW, which meets the insulation requirements for a 13.2 kV SST system. This dissertation advances MFT insulation design by introducing and experimentally validating novel approaches that improve high voltage insulation while optimizing magnetic coupling and manufacturability. The proposed insulation structures enable PD-free operation while minimizing insulation material usage and simplifying assembly, making them ideal for high power, high voltage applications.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Modeling and analyzing parasitic parameters in high frequency converters

This research focuses on electromagnetic interference (EMI) / electromagnetic compatibility (EMC) design and analysis in power electronics systems. To limit the EMI under the standards, different methods and strategies are investigated. Parasitic parameters of high frequency (HF) transformer are analyzed using a novel analytical method, finite element method (FEM), and experimental measurements for different structures and windings arrangements. Also, the magnetic field, electric field, electric displacement, and electric potential distribution are simulated and analyzed. Moreover, a high voltage system is considered and analyzed to improve the EMC. The EMI propagation paths are analyzed. The EMI noise level of the system is obtained and compared to the IEC61800-3 standard. To improve the EMC, the parasitic parameters of the transformer, as the main path of EMI circulation, are analyzed and optimized to block the propagation. Furthermore, the geometry structure of the HF transformer is optimized to lower the parasitics in the system. Three pareto-optimal techniques are investigated for the optimization. The models and results are verified by 3D-FEM and experimental results for several given scenarios. Furthermore, the EMC modeling and conducted EMI analysis are developed for a system including an AC-DC-DC power supply (rectifier and dual active bridge (DAB) converter). Moreover, the common mode (CM) EMI noise propagation through the system is discussed and the noise sources and effect of components on the noise are analyzed. Additionally, the CM impedance of different parts of the system and the noise levels are discussed. Finally, EMI attenuation techniques were applied to the system.

24 POWER TRANSMISSION AND DISTRIBUTION↗