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At least 73 records · Page 4

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DOE OSTI2017

In-memory interconnect protocol configuration registers

Systems, apparatuses, and methods for moving the interconnect protocol configuration registers into the main memory space of a node. The region of memory used for storing the interconnect protocol configuration registers may also be made cacheable to reduce the latency of accesses to the interconnect protocol configuration registers. Interconnect protocol configuration registers which are used during a startup routine may be prefetched into the host's cache to make the startup routine more efficient. The interconnect protocol configuration registers for various interconnect protocols may include one or more of device capability tables, memory-side statistics (e.g., to support two-level memory data mapping decisions), advanced memory and interconnect features such as repair resources and routing tables, prefetching hints, error correcting code (ECC) bits, lists of device capabilities, set and store base address, capability, device ID, status, configuration, capabilities, and other settings.

97 MATHEMATICS AND COMPUTING↗

DOE OSTI2021

Working With Your Utility Series: Interconnection Basics

This training provided information on interconnection basics for federal agencies developing distributed energy projects. Considerations covered included: Understanding interconnection processes and timelines, interconnection siting considerations, technology-specific interconnection issues, and interconnect agreements. This webinar is the first in a multi-part series on working with electric utilities to develop distributed energy projects on federal sites.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2017

Direct-Liquid-Evaporation Chemical Vapor Deposition of Nanocrystalline Cobalt Metal for Nanoscale Copper Interconnect Encapsulation

In advanced microelectronics, precise design of liner and capping layers become critical, especially when it comes to the fabrication of Cu interconnects with dimensions lower than its mean free path. Here in this paper, we demonstrate that direct-liquid-evaporation chemical vapor deposition (DLE-CVD) of Co is a promising method to make liner and capping layers for nanoscale Cu interconnects. DLE-CVD makes pure, smooth, nanocrystalline, and highly conformal Co films with highly controllable growth characteristics. This process allows full Co encapsulation of nanoscale Cu interconnects, thus stabilizing Cu against diffusion and electromigration. Electrical measurements and high-resolution elemental imaging studies show that the DLE-CVD Co encapsulation layer can improve the reliability and thermal stability of Cu interconnects. Also, with the high conductivity of Co, the DLE-CVD Co encapsulation layer have the potential to further decrease the power consumption of nanoscale Cu interconnects, paving the way for Cu interconnects with higher efficiency in future high-end microelectronics.

36 MATERIALS SCIENCE↗

DOE OSTI2022

High-Temperature RF Transmission Loss Characteristics of Platinum–Inconel 600 and Platinum–304 Steel Interconnects

Radio frequency (RF) transmission losses that occur at electronic interconnects is currently an important limitation of wireless sensors and other electronic device packages that must operate in high-temperature environments. Herein, in-situ RF transmission losses were measured for two types of interconnects: platinum (Pt) wire bonded to an Inconel 600 coaxial cable; and Pt-wire bonded to a block of 304 steel. Heating the Pt wire/Inconel interconnects at 800 °C for up to 200 hours were found to be very stable with no measurable transmission losses. In contrast, Pt wire/304 steel block interconnects examined over similar test periods at 800 °C exhibited gradual increases in transmission losses leveling off at 10, 38 and 85 mdB at 400 MHz, 700 MHz, and 1 GHz, respectively. Increasing the test temperature to 900 °C caused further elevated transmission losses of 30, 70 and 108 mdB at the same reported frequencies. By comparison, temperature cycling of the Pt wire/304 steel interconnects between room temperature and 900 °C was found to cause more significant degradation. In particular, four thermal cycles from room temperature to 900 °C resulted in losses of 75, 271, and 482 mdB at the same reported frequencies. Parabolic oxidation relative to the RF skin depth in the 304 steel block at the tested frequencies are discussed as possible reasons for the transmission losses during the isothermal soaks, whereas interconnect degradation due to differences in thermal expansion between Pt and 304 steel are primarily responsible for transmission losses caused by high temperature cycling.

304 steel↗

DOE OSTI2022

Graphene-Based Interconnect Exploration for Large SRAM Caches for Ultrascaled Technology Nodes

Graphene-based interconnects are considered promising replacements for traditional copper (Cu) interconnect due to their great electric properties. In this article, an interconnect-memory co- design framework is developed to efficiently optimize various graphene-based interconnect technologies. Four interconnect materials and heterogeneous design schemes are benchmarked against their traditional Cu counterparts to optimize large cache-level SRAM performance in terms of delay and energy per access, energy-delay product (EDP), and energy-delay-area product (EDAP). Here, a large design space exploration is performed based on realistic subarray design and device technology. Various interconnect- and array-level design parameters are studied to quantify the true potential of graphene-based wires for optimal memory performance.

42 ENGINEERING↗

DOE OSTI2017

Comparative Analysis and Considerations for PV Interconnection Standards in the United States and China

The main objectives of this report are to evaluate China's photovoltaic (PV) interconnection standards and the U.S. counterparts and to propose recommendations for future revisions to these standards. This report references the 2013 report Comparative Study of Standards for Grid-Connected PV System in China, the U.S. and European Countries, which compares U.S., European, and China's PV grid interconnection standards; reviews various metrics for the characterization of distribution network with PV; and suggests modifications to China's PV interconnection standards and requirements. The recommendations are accompanied by assessments of four high-penetration PV grid interconnection cases in the United States to illustrate solutions implemented to resolve issues encountered at different sites. PV penetration in China and in the United States has significantly increased during the past several years, presenting comparable challenges depending on the conditions of the grid at the point of interconnection; solutions are generally unique to each interconnected PV installation or PV plant.

14 SOLAR ENERGY↗

DOE OSTI2018

Review of Interconnection Practices and Costs in the Western States

The objective of this report is to evaluate the nature of barriers to interconnecting distributed PV, assess costs of interconnection, and compare interconnection practices across various states in the Western Interconnection. The report addresses practices for interconnecting both residential and commercial-scale PV systems to the distribution system. This study is part of a larger, joint project between the Western Interstate Energy Board (WIEB) and the National Renewable Energy Laboratory (NREL), funded by the U.S. Department of Energy, to examine barriers to distributed PV in the 11 states wholly within the Western Interconnection.

14 SOLAR ENERGY↗

DOE OSTI2019

New Approaches to Distributed PV Interconnection: Implementation Considerations for Addressing Emerging Issues

As the cost of installing distributed solar photovoltaics (PV) has fallen, the number of requests to interconnect PV systems to distribution grids has risen substantially in many utility service areas. In response, states and utilities are modifying their interconnection practices to address new DER challenges. This report examines emerging issues associated with interconnecting residential- and commercial-scale PV to facilitate sharing of lessons learned and best practices across jurisdictions. It covers issues related to allocating and understanding costs, understanding grid conditions to inform PV siting, interconnecting storage, automating processes, and requiring the availability of advanced inverter functions that can help increase PV hosting capacity. This report builds on an earlier study that reviews interconnection practices and costs across the western states (Bird et al. 2018). Both reports were developed as part of a larger, joint project between the Western Interstate Energy Board and the National Renewable Energy Laboratory, funded by the U.S. Department of Energy's Solar Energy Technologies Office, that examines barriers to distributed PV in the 11 states within the Western Interconnection.

14 SOLAR ENERGY↗

DOE OSTI2019

Software Defined Networking for HPC Interconnects and its Extension across Domains (Final Technical Report for DE-SC0016039)

This project seeks to incorporate OpenFlow-style Software Defined Networking capability into existing High Performance Computing (HPC) interconnect technology, InfiniBand, and to extend such capability beyond one domain. We develop SDN-enhanced InfiniBand that supports OpenFlow functionality for HPC interconnects, investigate the required techniques and the potential benefits for applying SDN on different types of HPC interconnects, and develop software to control the network and expose SDN capability to external networks through the OpenFlow interface. We have also developed techniques to evaluate communication characteristics of parallel applications, which determines the workload on interconnects, investigated newly proposed Interconnection network technologies including new network topologies and routing schemes, and designed novel interconnect routing and modeling techniques. Major activities and findings are summarized as follows.

97 MATHEMATICS AND COMPUTING↗

DOE OSTI2023

Characterization of Interconnects

Combined-accelerated stress testing (C-AST) simultaneously combines stress factors of the natural environment (including UV radiation, temperature, humidity, electrical current, and external mechanical force) into a single test that requires fewer modules, fewer chambers, and makes it possible to discover weaknesses in new designs that are not known a-priori. C-AST reduces risk, accelerates time to market, and improves bankability by reducing costly overdesign using test levels not exceeding those seen in the natural environment. This project seeks to evaluate strengths and weaknesses of modern cell interconnect designs with combined-accelerated stress testing (C-AST) to screen multiple climates along with finite element and failure analysis to determine the potential for a 50-year life. Supporting this, we seek to develop methods of characterization to assess the degradation of interconnects, enable predictive rate models with material forensics and FEA and show C-AST's ability to find interconnect failures and benchmark it relative to other accelerated stress test methods like temperature cycling and cyclic dynamic mechanical loading. Examples of modern interconnect designs covered are Canadian Solar Hetero Technology ribbon enabling closer cell interconnections, SmartWire (eg. Meyer-Berger technology), and shingled cells with new interconnect materials.

C-AST↗

DOE OSTI2022

Optimal interconnection of three-terminal tandem solar cells

Three-terminal (3T) tandem solar cells require an adapted module integration scheme in order to explore their full efficiency potential. The three terminals allow to extract the power of the top and bottom cell separately. In a cell string, the wide bandgap top cells are interconnected in parallel to multiple bottom cells resulting in a parallel/series interconnection. This interconnection scheme affects the operation of the subcells, the resulting current path between the subcells, the layout of the cell interconnects, and the system level. Here, we analyze by simulations and experiments the aspects of the module integration of series- and reverse-connected 3T cells with their practical impact on module processes and performance as well as the effect of varying voltage ratios on the string-end losses. If the subcells are connected in series, the module integration requires insulation layers and significantly longer interconnects compared to devices with reverse-connected subcells. Tandem devices with a reverse connection and a voltage ratio between top and bottom cell of 2:1 allow a lean interconnection design and low integration losses. Here, we present an approach for the integration of bypass diodes for the protection against shading effects that allow to minimize string-end and shading losses for a system of modules featuring 3T cells.

14 SOLAR ENERGY↗

DOE OSTI2017

Cantilever testing of sintered-silver interconnects

Cantilever testing is an underutilized test method from which results and interpretations promote greater understanding of the tensile and shear failure responses of interconnects, metallizations, or bonded joints. The use and analysis of this method were pursued through the mechanical testing of sintered-silver interconnects that joined Ni/Au-plated copper pillars or Ti/Ni/Ag-plated silicon pillars to Ag-plated direct bonded copper substrates. Sintered-silver was chosen as the interconnect test medium because of its high electrical and thermal conductivities and high-temperature capability—attractive characteristics for a candidate interconnect in power electronic components and other devices. Deep beam theory was used to improve upon the estimations of the tensile and shear stresses calculated from classical beam theory. The failure stresses of the sintered-silver interconnects were observed to be dependent on test-condition and test-material-system. In conclusion, the experimental simplicity of cantilever testing, and the ability to analytically calculate tensile and shear stresses at failure, result in it being an attractive mechanical test method to evaluate the failure response of interconnects.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Interconnected Nanoporous Polysulfone by the Self-Assembly of Randomly Linked Copolymer Networks and Linear Multiblocks

Porous materials have attracted considerable attention due to their versatile applications, especially in water purification. Interconnected nanoporous structures are distinguished by their high degree of porosity and resistance to clogging, as well as their insensitivity to nanostructural orientation. Previous works on randomly linked copolymer systems have shown that they can effectively produce disordered cocontinuous nanostructures, which upon removal of one component yield interconnected nanoporous materials. However, the cocontinuous nanomaterials previously developed using polystyrene (PS) and poly(d,l-lactic acid) (PLA) strands, and the resulting interconnected nanoporous PS monoliths, were far too brittle to enable practical use as membranes. Here, we study the self-assembly of randomly linked copolymer networks prepared using blocks of the engineering polymer polysulfone (PSU). A wide cocontinuous regime (spanning 40 wt %) was found for randomly end-linked copolymer networks (RECNs) constructed from PSU and PLA strands, via a combination of mechanical testing, gravimetry, small-angle X-ray scattering, and scanning electron microscopy. The PSU/PLA cocontinuous nanomaterial with symmetric composition showed 2.4 times higher Young’s modulus and ~100 times greater toughness than the corresponding PS/PLA sample. The interconnected nanoporous PSU fabricated after etching of PLA even exhibited 1.6 times greater toughness than PS/PLA prior to PLA removal. To facilitate the production of thin films of cocontinuous nanomaterials, we applied solution-processable randomly linked linear PSU/PLA multiblock polymers onto ultrafiltration membranes. Here, the interconnected nanoporous PSU thin film generated by etching PLA was found to effectively reject 50 nm diameter particles without significantly compromising permeability. This discovery presents a valuable addition to the existing techniques used to fabricate PSU membranes. In contrast to traditional methods, which are sensitive to processing conditions, produce a wide range of pore sizes, and offer limited adjustability of pore size, the current technique is anticipated to enable interconnected PSU membranes with more uniform and tailorable porosity.

36 MATERIALS SCIENCE↗

DOE OSTI2021

Development of Quantum Interconnects (QuICs) for Next-Generation Information Technologies

Just as “classical” information technology rests on a foundation built of interconnected information-processing systems, quantum information technology (QIT) must do the same. A critical component of such systems is the “interconnect,” a device or process that allows transfer of information between disparate physical media, for example, semiconductor electronics, individual atoms, light pulses in optical fiber, or microwave fields. While interconnects have been well engineered for decades in the realm of classical information technology, quantum interconnects (QuICs) present special challenges, as they must allow the transfer of fragile quantum states between different physical parts or degrees of freedom of the system. The diversity of QIT platforms (superconducting, atomic, solid-state color center, optical, etc.) that will form a “quantum internet” poses additional challenges. As quantum systems scale to larger size, the quantum interconnect bottleneck is imminent, and is emerging as a grand challenge for QIT. For these reasons, it is the position of the community represented by participants of the NSF workshop on “Quantum Interconnects” that accelerating QuIC research is crucial for sustained development of a national quantum science and technology program. Given the diversity of QIT platforms, materials used, applications, and infrastructure required, a convergent research program including partnership between academia, industry, and national laboratories is required.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗

DOE OSTI2018

Double-Sided Pressureless-Sintered-Silver Interconnects Fabricated by Reflow-Oven-Processing

A significant amount of development with sintered-silver as an alternative interconnect (or attachment or attach) material in power electronic devices has occurred since ~ 2010 at Oak Ridge National Laboratory's National Transportation Research Center. Continuous sponsorship of the work enabled improvements and understanding of several sequential processing steps which otherwise would not have occurred with a short duration or an intermittently funded project. The majority of that work has occurred with a focus on improving its processing and consequential mechanical reliability of the interconnect while promoting adaptability to power elect ronic device manufacturing. The work includes determining application issues of silver-sintering and the developing processes that would make it amenable for use with reflow oven sintering. As part of that work, co-development of maximum interconnect strength of the sintered-silver interconnect occurred, and that also involved examining candidate plating materials that could be used in concert with them for the "interconnect system". All of this work involved the consideration of a single sintered-silver interconnect.

36 MATERIALS SCIENCE↗

DOE OSTI2019

High Density Chip Interconnect Technology Using High Density Glass Interposers

Modern particle physics experiments require “intelligent detectors” with dense interconnects and distributed intelligence in very large area detector systems. Available packaging and interconnect technologies directly limit the performance and capabilities of these systems. Interposers are interconnected elements that use through-silicon or through-glass via to replace the PC board technology currently used for connecting chips and can improve the interconnect density by more than two orders of magnitude. The goal of this project is to fabricate a thru glass via interposer that will allow top to bottom side interconnects in the tens of microns. Having a thru glass interposer with interconnects in the tens of microns will benefit the electrons industry which focuses on 3D packaging. In addition to commercial, medical applications such as the CAT scan, which have resolutions in the micron or larger range, will now be able to use these interposers to diagnose in the tens of microns.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2021

Considerations for Distributed Energy Resource Integration in Puerto Rico: DOE Multi-Lab Grid Modeling Support for Puerto Rico; Analytical Support for Interconnection and IEEE Std 1547-2018 National Renewable Energy Laboratory (Task 3.0)

To ensure the sustainable long-term recovery of Puerto Rico's electric power grid from hurricanes María and Irma and to build capacity to manage future potential natural disasters in the most secure and resilient way, the U.S. Department of Energy (DOE) convened experts from multiple national laboratories to develop a comprehensive set of data, models, analytic tools, and studies, considering inputs from a wide variety of stakeholder groups, to support technically sound recommendations for Puerto Rico's energy investment decisions. A resilient electric grid is vital to Puerto Rico's security, economy, and way of life, and it will provide the foundation for essential services that people and businesses on the island rely on every day. This report shows progress for a grid modeling task under the DOE-sponsored project that is a collaboration among the National Renewable Energy Laboratory (NREL) and other national laboratories. In Phase 1 of the multilab effort to support Puerto Rico's recovery, NREL provided the utility company Puerto Rico Electric Power Authority (PREPA) recommendations for a new framework of interconnection standards to accelerate the integration of utility-scale, transmission-connected renewable electrical generation and energy storage that ensure cross-technology compatibility and enable high deployment levels without compromising grid reliably, safety, or security. This Phase 2 report focuses on the interconnection of distributed energy resources (DERs) to the electric distribution system in Puerto Rico. This report is intended to familiarize the reader with Puerto Rico's distribution infrastructure and operational practices and procedures that are relevant to DER interconnection. The report also provides considerations for streamlining the interconnection process given the expected increase in deployments resulting from Puerto Rico's renewable portfolio standard (RPS) goal of 100% renewables by 2050. Accordingly, the report identifies considerations and concerns associated with the increase in intermittent generation, strategies for DER interconnection best practices, and the potential use of the latest technological solutions identified in the latest revision of the Institute of Electrical and Electronics Engineers (IEEE) 1547-2018 interconnection standard.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2023

Queued Up: Characteristics of Power Plants Seeking Transmission Interconnection As of the End of 2022 [Slides]

Proposed large-scale electric generation and storage projects must apply for interconnection to the bulk power system via interconnection queues. While most projects that apply for interconnection are not subsequently built, data from these queues nonetheless provide a general indicator for mid-term trends in developer interest. Berkeley Lab compiled and analyzed data from all seven ISOs/RTOs in concert with 35 non-ISO utilities, representing an estimated 85% of all U.S. electricity load. We include all "active" projects in these generation interconnection queues through the end of 2022, as well as data on "operational" and "withdrawn" projects where those data are available. We find that the amount of new electric capacity in these queues is growing dramatically, with over 2,000 gigawatts (GW) of total generation and storage capacity now seeking connection to the grid (over 95% of which is for zero-carbon resources like solar, wind, and battery storage). Solar (947 GW) and battery storage (~680 GW) are – by far – the fastest growing resources in the queues; combined they accounted for over 80% of new capacity entering the queues in 2022. Substantial wind (300 GW) capacity is also seeking interconnection, 38% of which is for offshore projects (113 GW). In total, about 1,250 GW of zero-carbon generating capacity is currently seeking transmission access, as is 82 GW of natural gas capacity. Hybrids projects (co-locating multiple generation and/or storage types) comprise a large – and increasing – share of proposed projects, particularly in CAISO and the non-ISO West. 457 GW of solar hybrids (primarily solar+battery) and 24 GW of wind hybrids are currently active in the queues; over half of battery storage in the queues is paired with generation. However, much of this proposed capacity will be withdrawn from the queues and not built. Among a subset of queues for which data are available, only 21% of the projects (and 14% of capacity) seeking connection from 2000 to 2017 have been built as of the end of 2022. Additionally, interconnection wait times are on the rise: The typical duration from connection request to commercial operation increased from <2 years for projects built in 2000-2007 to nearly 4 years for those built in 2018-2022 (with a median of 5 years for projects built in 2022).

24 POWER TRANSMISSION AND DISTRIBUTION↗