High Density Chip Interconnect Technology Using High Density Glass Interposers

Abstract

Modern particle physics experiments require “intelligent detectors” with dense interconnects and distributed intelligence in very large area detector systems. Available packaging and interconnect technologies directly limit the performance and capabilities of these systems. Interposers are interconnected elements that use through-silicon or through-glass via to replace the PC board technology currently used for connecting chips and can improve the interconnect density by more than two orders of magnitude. The goal of this project is to fabricate a thru glass via interposer that will allow top to bottom side interconnects in the tens of microns. Having a thru glass interposer with interconnects in the tens of microns will benefit the electrons industry which focuses on 3D packaging. In addition to commercial, medical applications such as the CAT scan, which have resolutions in the micron or larger range, will now be able to use these interposers to diagnose in the tens of microns.