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At least 703 records · Page 39

Life and reliability modeling of bevel gear reductions

A reliability model is presented for bevel gear reductions with either a single input pinion or dual input pinions of equal size. The dual pinions may or may not have the same power applied for the analysis. The gears may be straddle mounted or supported in a bearing quill. The reliability model is based on the Weibull distribution. The reduction's basic dynamic capacity is defined as the output torque which may be applied for one million output rotations of the bevel gear with a 90 percent probability of reduction survival.

Savage, M.↗

Effect of design variables, temperature gradients and speed of life and reliability of a rotating disk

A generalized methodology to predict the fatigue life and reliability of a rotating disk such as used for aircraft engine turbines and compressors is advanced. The approach incorporates the computed life of elemental stress volumes to predict system life and reliability. Disk speed and thermal gradients as well as design variables such as disk diameter and thickness and bolt hole size, number and location are considered.

Zaretsky, E. V.↗

Crystalline-silicon photovoltaics summary module design and reliability

The evolution of the design and reliability of solar modules was described. Design requirements involved 14 different considerations, including residential building and material electrical codes, wind-loading, hail impact, operating temperature levels, module flammability, and interfaces for both the array structure and the operation of the system. Reliability research involved in diverse investigations including glass-fracture strength, soiling levels, electrochemical corrosion, and bypass-diode qualification tests. Based on these internationally recognized studies, performance assessments, and failure analyses, the Flat-plate Solar Array Project in its 11-year duration served to nuture the development of 45 different solar module designs from 15 PV manufacturers.

Ross, R. G., Jr.↗

Flat-plate solar array project. Volume 6: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety, and reliability requirements of large scale terrestrial photovoltaic systems applications are reported. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis of define design shortfalls and, thus, areas requiring additional research and development. A summary of the approach and technical outcome of these activities are provided along with a complete bibliography of the published documentation covering the detailed accomplishments and technologies developed.

Ross, R. G., Jr.↗

Software development predictors, error analysis, reliability models and software metric analysis

The use of dynamic characteristics as predictors for software development was studied. It was found that there are some significant factors that could be useful as predictors. From a study on software errors and complexity, it was shown that meaningful results can be obtained which allow insight into software traits and the environment in which it is developed. Reliability models were studied. The research included the field of program testing because the validity of some reliability models depends on the answers to some unanswered questions about testing. In studying software metrics, data collected from seven software engineering laboratory (FORTRAN) projects were examined and three effort reporting accuracy checks were applied to demonstrate the need to validate a data base. Results are discussed.

Basili, Victor↗

Fracture mechanics concepts in reliability analysis of monolithic ceramics

Basic design concepts for high-performance, monolithic ceramic structural components are addressed. The design of brittle ceramics differs from that of ductile metals because of the inability of ceramic materials to redistribute high local stresses caused by inherent flaws. Random flaw size and orientation requires that a probabilistic analysis be performed in order to determine component reliability. The current trend in probabilistic analysis is to combine linear elastic fracture mechanics concepts with the two parameter Weibull distribution function to predict component reliability under multiaxial stress states. Nondestructive evaluation supports this analytical effort by supplying data during verification testing. It can also help to determine statistical parameters which describe the material strength variation, in particular the material threshold strength (the third Weibull parameter), which in the past was often taken as zero for simplicity.

Manderscheid, Jane M.↗

SCARE - A postprocessor program to MSC/NASTRAN for reliability analysis of structural ceramic components

A computer program was developed for calculating the statistical fast fracture reliability and failure probability of ceramic components. The program includes the two-parameter Weibull material fracture strength distribution model, using the principle of independent action for polyaxial stress states and Batdorf's shear-sensitive as well as shear-insensitive crack theories, all for volume distributed flaws in macroscopically isotropic solids. Both penny-shaped cracks and Griffith cracks are included in the Batdorf shear-sensitive crack response calculations, using Griffith's maximum tensile stress or critical coplanar strain energy release rate criteria to predict mixed mode fracture. Weibull material parameters can also be calculated from modulus of rupture bar tests, using the least squares method with known specimen geometry and fracture data. The reliability prediction analysis uses MSC/NASTRAN stress, temperature and volume output, obtained from the use of three-dimensional, quadratic, isoparametric, or axisymmetric finite elements. The statistical fast fracture theories employed, along with selected input and output formats and options, are summarized. An example problem to demonstrate various features of the program is included.

Gyekenyesi, J. P.↗

Reliability and mass analysis of dynamic power conversion systems with parallel or standby redundancy

A combinatorial reliability approach was used to identify potential dynamic power conversion systems for space mission applications. A reliability and mass analysis was also performed, specifically for a 100-kWe nuclear Brayton power conversion system with parallel redundancy. Although this study was done for a reactor outlet temperature of 1100 K, preliminary system mass estimates are also included for reactor outlet temperatures ranging up to 1500 K.

Juhasz, Albert J.↗

Experiments in fault tolerant software reliability

The reliability of voting was evaluated in a fault-tolerant software system for small output spaces. The effectiveness of the back-to-back testing process was investigated. Version 3.0 of the RSDIMU-ATS, a semi-automated test bed for certification testing of RSDIMU software, was prepared and distributed. Software reliability estimation methods based on non-random sampling are being studied. The investigation of existing fault-tolerance models was continued and formulation of new models was initiated.

Mcallister, David F.↗

Stability, reliability and cross-mode correlations of tests in a recommended 8-minute performance assessment battery

A need exists for an automated performance test system to study drugs, agents, treatments, and stresses of interest to the aviation, space, and environmental medical community. The purpose of this present study is to evaluate tests for inclusion in the NASA-sponsored Automated Performance Test System (APTS). Twenty-one subjects were tested over 10 replications with tests previously identified as good candidates for repeated-measure research. The tests were concurrently administered in paper-and-pencil and microcomputer modes. Performance scores for the two modes were compared. Data from trials 1 to 10 were examined for indications of test stability and reliability. Nine of the ten APT system tests achieved stability. Reliabilities were generally high. Cross-correlation of microbased tests with traditional paper-and-pencil versions revealed similarity of content within tests in the different modes, and implied at least three cognition and two motor factors. This protable, inexpensive, rugged, computerized battery of tests is recommended for use in repeated-measures studies of environmental and drug effects on performance. Identification of other tests compatible with microcomputer testing and potentially capable of tapping previously unidentified factors is recommended. Documentation of APTS sensitivity to environmental agents is available for more than a dozen facilities and is reported briefly. Continuation of such validation remains critical in establishing the efficacy of APTS tests.

Wilkes, R. L.↗

The implementation and use of Ada on distributed systems with high reliability requirements

The use and implementation of Ada were investigated in distributed environments in which reliability is the primary concern. In particular, the focus was on the possibility that a distributed system may be programmed entirely in Ada so that the individual tasks of the system are unconcerned with which processors are being executed, and that failures may occur in the software and underlying hardware. A secondary interest is in the performance of Ada systems and how that performance can be gauged reliably. Primary activities included: analysis of the original approach to recovery in distributed Ada programs using the Advanced Transport Operating System (ATOPS) example; review and assessment of the original approach which was found to be capable of improvement; development of a refined approach to recovery that was applied to the ATOPS example; and design and development of a performance assessment scheme for Ada programs based on a flexible user-driven benchmarking system.

Knight, J. C.↗

Digital avionics design and reliability analyzer

The description and specifications for a digital avionics design and reliability analyzer are given. Its basic function is to provide for the simulation and emulation of the various fault-tolerant digital avionic computer designs that are developed. It has been established that hardware emulation at the gate-level will be utilized. The primary benefit of emulation to reliability analysis is the fact that it provides the capability to model a system at a very detailed level. Emulation allows the direct insertion of faults into the system, rather than waiting for actual hardware failures to occur. This allows for controlled and accelerated testing of system reaction to hardware failures. There is a trade study which leads to the decision to specify a two-machine system, including an emulation computer connected to a general-purpose computer. There is also an evaluation of potential computers to serve as the emulation computer.

Source record↗

Reliability of photovoltaic modules

In order to assess the reliability of photovoltaic modules, four categories of known array failure and degradation mechanisms are discussed, and target reliability allocations have been developed within each category based on the available technology and the life-cycle-cost requirements of future large-scale terrestrial applications. Cell-level failure mechanisms associated with open-circuiting or short-circuiting of individual solar cells generally arise from cell cracking or the fatigue of cell-to-cell interconnects. Power degradation mechanisms considered include gradual power loss in cells, light-induced effects, and module optical degradation. Module-level failure mechanisms and life-limiting wear-out mechanisms are also explored.

Ross, R. G., Jr.↗

Recent achievements in module reliability research

After 10 years of extensive research on crystalline-silicon flat-plate photovoltaic modules, the emphasis of recent reliability research has shifted to the emerging first-generation thin-film amorphous-silicon modules. These modules share much in common with their crystalline precursors, but also include many materials and processes that demand the development of reliability technologies. Key research thrusts include light-induced effects, cell corrosion, thermal diffusion, hot-spot heating, and electrical isolation of the cells from the module exterior. Research goals and recent achievements are described in each of these areas.

Ross, R. G., Jr.↗

Common-Reliability Cumulative-Binomial Program

Cumulative-binomial computer program, CROSSER, one of set of three programs, calculates cumulative binomial probability distributions for arbitrary inputs. CROSSER, CUMBIN (NPO-17555), and NEWTONP (NPO-17556), used independently of one another. Point of equality between reliability of system and common reliability of components found. Used by statisticians and users of statistical procedures, test planners, designers, and numerical analysts. Program written in C.

Scheuer, Ernest, M.↗

Noninteractive macroscopic reliability model for ceramic matrix composites with orthotropic material symmetry

A macroscopic noninteractive reliability model for ceramic matrix composites is presented. The model is multiaxial and applicable to composites that can be characterized as orthotropic. Tensorial invariant theory is used to create an integrity basis with invariants that correspond to physical mechanisms related to fracture. This integrity basis is then used to construct a failure function per unit volume (or area) of material. It is assumed that the overall strength of the composite is governed by weakest link theory. This leads to a Weibull type model similar in nature to the principle of independent action (PIA) model for isotropic monolithic ceramics. An experimental program to obtain model parameters is briefly discussed. In addition, qualitative features of the model are illustrated by presenting reliability surfaces for various model parameters.

Duffy, Stephen F.↗

Time dependent reliability model incorporating continuum damage mechanics for high-temperature ceramics

Presently there are many opportunities for the application of ceramic materials at elevated temperatures. In the near future ceramic materials are expected to supplant high temperature metal alloys in a number of applications. It thus becomes essential to develop a capability to predict the time-dependent response of these materials. The creep rupture phenomenon is discussed, and a time-dependent reliability model is outlined that integrates continuum damage mechanics principles and Weibull analysis. Several features of the model are presented in a qualitative fashion, including predictions of both reliability and hazard rate. In addition, a comparison of the continuum and the microstructural kinetic equations highlights a strong resemblance in the two approaches.

Duffy, Stephen F.↗

Integrated circuit reliability testing

A technique is described for use in determining the reliability of microscopic conductors deposited on an uneven surface of an integrated circuit device. A wafer containing integrated circuit chips is formed with a test area having regions of different heights. At the time the conductors are formed on the chip areas of the wafer, an elongated serpentine assay conductor is deposited on the test area so the assay conductor extends over multiple steps between regions of different heights. Also, a first test conductor is deposited in the test area upon a uniform region of first height, and a second test conductor is deposited in the test area upon a uniform region of second height. The occurrence of high resistances at the steps between regions of different height is indicated by deriving the measured length of the serpentine conductor using the resistance measured between the ends of the serpentine conductor, and comparing that to the design length of the serpentine conductor. The percentage by which the measured length exceeds the design length, at which the integrated circuit will be discarded, depends on the required reliability of the integrated circuit.

Buehler, Martin G.↗