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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 703 records · Page 39
All sourcesNASA NTRSDOE OSTI
NASA NTRS1990

Optical control of an 8-element Ka-band phased array using a high-speed optoelectronic interconnect

Optical distribution of control signals in electronically steered phased array antennas is being considered. A demonstration experiment is described in which a high speed hybrid GaAs optoelectronic integrated circuit (OEIC) was used to control an eight element phased array antenna. The OEIC, which accepts a serial optical control signal as input and converts it to 16 demultiplexed parallel outputs, was used to control the monolithic GaAs phase shifters of a Ka-band patch panel array antenna. Antenna pattern switching speeds of 2.25 microsec, limited by interface circuitry, were observed.

Richard, M. A.↗
NASA NTRS1991

Testing interconnected VLSI circuits in the Big Viterbi Decoder

The Big Viterbi Decoder (BVD) is a powerful error-correcting hardware device for the Deep Space Network (DSN), in support of the Galileo and Comet Rendezvous Asteroid Flyby (CRAF)/Cassini Missions. Recently, a prototype was completed and run successfully at 400,000 or more decoded bits per second. This prototype is a complex digital system whose core arithmetic unit consists of 256 identical very large scale integration (VLSI) gate-array chips, 16 on each of 16 identical boards which are connected through a 28-layer, printed-circuit backplane using 4416 wires. Special techniques were developed for debugging, testing, and locating faults inside individual chips, on boards, and within the entire decoder. The methods are based upon hierarchical structure in the decoder, and require that chips or boards be wired themselves as Viterbi decoders. The basic procedure consists of sending a small set of known, very noisy channel symbols through a decoder, and matching observables against values computed by a software simulation. Also, tests were devised for finding open and short-circuited wires which connect VLSI chips on the boards and through the backplane.

Onyszchuk, I. M.↗
NASA NTRS1992

Fiber-optic interconnection networks for spacecraft

The overall goal of this effort was to perform the detailed design, development, and construction of a prototype 8x8 all-optical fiber optic crossbar switch using low power liquid crystal shutters capable of operation in a network with suitable fiber optic transmitters and receivers at a data rate of 1 Gb/s. During the earlier Phase 1 feasibility study, it was determined that the all-optical crossbar system had significant advantages compared to electronic crossbars in terms of power consumption, weight, size, and reliability. The result is primarily due to the fact that no optical transmitters and receivers are required for electro-optic conversion within the crossbar switch itself.

Powers, Robert S.↗
NASA NTRS1992

Broadband vertical interconnects using slot-coupled shielded microstrip lines

A full-wave space-domain integral equation analysis of aperture coupled shielded microstrip lines is presented based on the Equivalence Principle. The formulation includes the capability to model multilayered substrates through the derivation of the associated dyadic Green's functions which represent the layers through impedance boundary conditions. The method of moments is used to solve for the line currents and slot voltage with even and odd mode excitations which are then interpreted through transmission line analysis to determine the two-port scattering parameters. A parametric study together with experimental data is presented which demonstrates the behavior of the coupler and the accuracy of the technique.

Vandenberg, Norman L.↗
NASA NTRS1991

High density packaging and interconnect of massively parallel image processors

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Carson, John C.↗
NASA NTRS1992

Architecture for Survivable Systems Processing (ASSP). Technology benefits for Open System Interconnects

The Architecture for Survivable Systems Processing (ASSP) program is a two phase program whose objective is the derivation, specification, development and validation of an open system architecture capable of supporting advanced processing needs of space, ground, and launch vehicle operations. The output of the first phase is a set of hardware and software standards and specifications defining this architecture at three levels. The second phase will validate these standards and develop the technology necessary to achieve strategic hardness, packaging density, throughput requirements, and interoperability/interchangeability.

Wood, Richard J.↗
NASA NTRS1997

High Frequency Interconnects on Silicon Substrates

The measured propagation constant of coplanar waveguide (CPW) on silicon wafers as a function of the line dimensions and the resistivity of the Si wafer; CPW on GaAs wafers as a function of the line dimensions, and thin film microstrip (TFMS) polyimide fabricated with polyimide on the surface of a silicon wafer is presented. It is shown that the attenuation of CPW on 2500 Omega-cm Si wafers and-of TFMS with a polyimide thickness of 4 micrometer or greater is comparable to the attenuation of similar lines on GaAs.

Ponchak, George E.↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS2006

Nano-interconnection for microelectronics and polymers with benzo-triazole

Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induced 3-D polymerization of BTA on the Cu electrode material which was measured with the Ultraviolet Photoemission Spectroscopy (UPS), X-ray Photoemission Spectroscopy (XPS), and Scanning Tunneling Microscope (STM). The electric utilization of shield and chain polymerization of BTA on Cu surface is contemplated in this study.

Park, Yeonjoon↗
NASA NTRS1996

Global Interconnectivity Between Mobile Satellite and Terrestrial Users: Call Signalling Issues and Challenges

This paper will discuss some of the challenges in connecting mobile satellite users and mobile terrestrial users in a cost efficient manner and with a grade of service comparable to that of satellite to fixed user calls. Issues arising from the translation between the mobility management protocols resident at the satellite Earth station and those resident at cellular switches - either GSM (Group Special Mobile) or IS-41 (used by U.S. digital cellular systems) type - will be discussed. The impact of GSM call routing procedures on the call setup of a satellite to roaming GSM user will be described. Challenges facing provision of seamless call handoff between satellite and cellular systems will be given. A summary of the issues explored in the paper are listed and future work outlined.

mobile satellite usersGroup Special MobileGSMdigit↗
NASA NTRS2001

Three-dimensional modular electronic interconnection system

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.

Bolotin, Gary S.↗
NASA NTRS2010

Evaluation of Small Form Factor Fiber Optic Interconnects for the NASA Electronics Parts and Packaging Program (NEPP)

The Diamond AVIM optical fiber connector has been used for over a decade in flight environments. AVIM which stands for Aviation Intermediate Maintenance is always referenced as a fiber optic connector type from the DIN (Deutsches Institut fur Normung) family of optical fiber connectors. The newly available Mini AVIM and DMI (Definition Multimedia Interface) connectors also by Diamond provide similar features as the high performance AVIM with the added benefits of being small form factor for board mount and internal box use where long connectors and strain relief can not be accommodated. Transceiver, fiber laser technology and receiver optic technology based on small sized constraints will benefit the most by the reduction in connector form factor. It is for this reason that the Mini AVIM is being evaluated for multimode and single mode optical fiber use in both fiber based and cable based packaging configurations. In a fiber based termination, there are no cable materials to bond to the connector. The only bonding that is conducted is the mounting of the fiber with epoxy to the connector ferrules (which are called DMI ferrules). In a cable configuration, the compatibility of the connector subcomponents along with the upjacketing materials of the cable around the fiber needs to be considered carefully for termination fabrication. Cabled terminations will show greater insertion loss and high probability of failures during thermal cycling testing. This is due to the stressing of the combination of materials that each have different Coefficients of Thermal Expansion (CTE's) and that are bonded together to the connector subcomponents. As the materials flex during thermal excursions, forces are applied to the termination and can make the system fail if the grouping of materials (per their CTE's) are not compatible and this includes cable materials, epoxies, ferrule and connector body components. For this evaluation, multimode 100 micron core step index fiber was used for the fiber terminated condition, and single mode SMF-28 upjacketed with W.L. Gore Flexlite was used for the cabled configuration. For background purposes, a comparison is presented here for information purposes between the high performance AVIM connector features and the Mini AVIM small form factor connectors. Basic connector features are described here.

Ott, Melanie↗
NASA NTRS2015

Scheduled Peripheral Component Interconnect Arbiter

Systems and methods are described for arbitrating access of a communication bus. In one embodiment, a method includes performing steps on one or more processors. The steps include: receiving an access request from a device of the communication bus; evaluating a bus schedule to determine an importance of the device based on the access request; and selectively granting access of the communication bus to the device based on the importance of the device.

Nixon, Scott Alan↗