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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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This paper describes the technology, design features and reliability characterization methodology of a CMOS Active Pixel Sensor. Both overall chip reliability and pixel reliability are projected for the imagers.
A compact cryogenic test chamber can be cooled to approximately 5 to 6 Kelvin for materials testing. The system includes a temperature controller and multiple sensors to measure specimen temperature at different locations. The testing chamber provides a fast and easy method to perform materials testing at lower than liquid nitrogen temperature (77 K). The purpose of the chamber is to cool a composite lap shear specimen to approximately 20 K so that tensile test force and displacement data may be acquired at this cryogenic temperature range.
Over the next decades, NASA's planned solar system exploration missions are targeting planets, moons and small bodies, where spacecraft would be expected to encounter diverse extreme environmental (EE) conditions throughout their mission phases. These EE conditions are often coupled. For instance, near the surface of Venus and in the deep atmospheres of giant planets, probes would experience high temperatures and pressures. In the Jovian system low temperatures are coupled with high radiation. Other environments include thermal cycling, and corrosion. Mission operations could also introduce extreme conditions, due to atmospheric entry heat flux and deceleration. Some of these EE conditions are not unique to space missions; they can be encountered by terrestrial assets from the fields of defense,oil and gas, aerospace, and automotive industries. In this paper we outline the findings of NASA's Extreme Environments Study Team, including discussions on state of the art and emerging capabilities related to environmental protection, tolerance and operations in EEs. We will also highlight cross cutting EE mitigation technologies, for example, between high g-load tolerant impactors for Europa and instrumented projectiles on Earth; high temperature electronics sensors on Jupiter deep probes and sensors inside jet engines; and pressure vessel technologies for Venus probes and sea bottom monitors. We will argue that synergistic development programs between these fields could be highly beneficial and cost effective for the various agencies and industries. Some of these environments, however, are specific to space and thus the related technology developments should be spear headed by NASA with collaboration from industry and academia.
This software is used in an automated cryogenic control system developed to monitor and control the operation of small-scale cryocoolers. The system was designed to automate the cryogenically cooled low-noise amplifier system described in "Automated Cryocooler Monitor and Control System" (NPO-47246), NASA Tech Briefs, Vol. 35, No. 5 (May 2011), page 7a. The software contains algorithms necessary to convert non-linear output voltages from the cryogenic diode-type thermometers and vacuum pressure and helium pressure sensors, to temperature and pressure units. The control function algorithms use the monitor data to control the cooler power, vacuum solenoid, vacuum pump, and electrical warm-up heaters. The control algorithms are based on a rule-based system that activates the required device based on the operating mode. The external interface is Web-based. It acts as a Web server, providing pages for monitor, control, and configuration. No client software from the external user is required.
An in-service health monitoring system is needed for steam pipes to track through their wall the condensation of water. The system is required to measure the height of the condensed water inside the pipe while operating at temperatures that are as high as 250 deg. C. The system needs to be able to make real time measurements while accounting for the effects of cavitation and wavy water surface. For this purpose, ultrasonic wave in pulse-echo configuration was used and reflected signals were acquired and auto-correlated to remove noise from the data and determine the water height. Transmitting and receiving the waves is done by piezoelectric transducers having Curie temperature that is significantly higher than 250 deg. C. Measurements were made at temperatures as high as 250 deg. C and have shown the feasibility of the test method. This manuscript reports the results of this feasibility study.
Measuring the seismic activity of Venus is critical to understanding its composition and interior dynamics. Because Venus has an average surface temperature of 462 C and the challenge of providing cooling to multiple seismometers, a high temperature, wireless sensor using a wide bandgap semiconductor is an attractive option. This paper presents progress towards a seismometer sensor with wireless capabilities for Venus applications. A variation in inductance of a coil caused by a 1 cm movement of a ferrite probe held in the coil and attached to a balanced leaf-spring seismometer causes a variation of 80 MHz in the transmitted signal from the oscillator sensor system at 420 C, which correlates to a 10 kHz mm sensitivity when the ferrite probe is located at the optimum location in the coil.
Packaging Qualification and Verification (PQV) and life testing of advanced electronic packaging, mechanical assemblies (motors/actuators), and interconnect technologies (flip-chip), platinum temperature thermometer attachment processes, and various other types of hardware for Mars Exploration Rover (MER)/Mars Science Laboratory (MSL), and JUNO flight projects was performed to enhance the mission assurance. The qualification of hardware under extreme cold to hot temperatures was performed with reference to various project requirements. The flight like packages, assemblies, test coupons, and subassemblies were selected for the study to survive three times the total number of expected temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware including all relevant manufacturing, ground operations, and mission phases. Qualification/life testing was performed by subjecting flight-like qualification hardware to the environmental temperature extremes and assessing any structural failures, mechanical failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Experimental flight qualification test results will be described in this presentation.
Originally, I was brought into the Design and Analysis Branch in the Crew and Thermal Systems to work on administrative tasks like archiving and scheduling. However, I ended up splitting my time between secretarial tasks and a technical project. My technical project was originally meant to be a wireless sensor package for the 20ft Spacecraft Thermal Vacuum Chamber in the B7 High Bay. I would be using a miniature wifi development board and a temperature/humidity sensor along with custom 3D modeling to accomplish this. However, after some discussion with my technical mentor, the plan was changed to a mobile autonomous self-charging sensor platform. A mobile platform will allow the sensors to be moved around without depressurizing the chamber. Also, the self-charging aspect of the package allows for almost unlimited time in the chamber. If the on-board battery runs low, the robot can easily be driven to its charging dock and continue to transmit while charging. The driving base is based around a Raspberry Pi 3 board with a 12C PMW DC Motor controller and a PWM controller driving two small gear motors. The sensor transmitter itself is a RHT03 temperature and humidity sensor and Cozir CO2 sensor connected to an ESP8266 Huzzah board. The power distribution system utilizes a pair of 3.7v 3600mah lipo batteries wired to Powerboost 500 boards. Also, the self-charging mechanism utilizes two 12v-max inductive charging coils wired into the same Powerboost boards as the battery. The Raspberry pi is running Python 3.3 for the driving base and Javascript MJPEG library for transmitting live video from the onboard camera. The sensor package is running Arduino-based C++ and the program capturing the data is running PyqtGraph Python and HTML. The shell of the robot itself is a 3D printed case that will (work in progress) snap together. The photo to the left shows the two halves separated from each other. The black shell contains the power distribution boards and connectors while the white shell contains the driving base and data systems.
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This presentation serves as an overview of test plans for an upcoming DGEN Aeropropulsion Research Turbofan (DART) test entry at the NASA GRC AeroAcoustic Propulsion Laboratory (AAPL). The test entry includes: (1) a fan intra-stage velocity field survey, which will be compared to a Computational Fluid Dynamics (CFD) survey of DART, (2) an exploratory noise study of DART with several objectives focused on measurement projection to the far-field, source identification improvements and development of a barrier wall for isolation of various sources, (3) advancement of core/combustor noise research on DART using more extensive engine-mounted instrumentation, and (4) high-temperature pressure sensor technology-readiness-level (TRL) advancement.
This presentation serves as an overview of test plans for an upcoming DGEN Aeropropulsion Research Turbofan (DART) test entry at the NASA GRC AeroAcoustic Propulsion Laboratory (AAPL). The test entry includes: (1)a fan intra-stage velocity field survey, which will be compared to a Computational Fluid Dynamics (CFD) survey of DART, (2) an exploratory noise study of DART with several objectives focused on measurement projection to the far-field, source identification improvements and development of a barrier wall for isolation of various sources, (3) advancement of core/combustor noise research on DART using more extensive engine-mounted instrumentation, and (4) high-temperature pressure sensor technology-readiness-level (TRL) advancement.
Subsystems for a proof of concept cryogenic payload have been developed to demonstrate the ability to accommodate low temperature science investigations within the constraints of the Hitchhiker siderail carrier on the Space Shuttle.
Passive microwave remote sensing of sea surface salinity from space is currently being done with measurements in the 27 MHz wide spectral window at 1.413 GHz (L-band) protected for passive use. Modern L-band instruments, such as the radiometers on SMOS and Aquarius, have demonstrated the feasibility of monitoring surface salinity from space, and they have also demonstrated the need for better accuracy, especially in cold water. Proposals to improve accuracy have largely involved adding measurement at more frequencies. For example, adding lower frequencies to improve the sensitivity to salinity in cold water and adding higher frequencies to enable simultaneous retrieval of sea surface temperature which is needed in the retrieval of salinity. These strategies involve trade-offs, some obvious such as the effects of interference from anthropogenic sources of radio frequency radiation (RFI) when operating outside the protected band and the loss of spatial resolution at lower frequencies. But, some are more subtle and arise because of the dependence of the retrieval of salinity on other parameters of the ocean surface, in particular, water temperature and roughness (wind speed). The effect of these interdependencies on the potential accuracy of salinity remote sensing in the frequency range 0.3 – 3.0 GHz is examined here to gain insight into the potential for future wide bandwidth instruments for remote sensing of salinity and the optimization of their design. There is benefit including the low frequencies, especially for cold water, but a danger of increased error including frequencies above 1.5 - 2.0 GHz depending on temperature.
Freeze/thaw (FT) processes at the earth’s surface can have a considerable effect on global carbon, energy, and hydrologic cycles. Therefore, an accurate representation of FT is valuable to adequately monitor and model these processes. In this study, we assess the relationship between satellite-based FT products and modeled surface and soil temperatures over North America. In addition, hourly land surface temperature (LST) from the Geostationary Operational Environmental Satellite (GOES) system is also compared to FT classifications. Utilizing the higher spatial resolution temperatures (5 km), we assess subgrid-scale variability and its relationship to coarser microwave FT classifications (>25 km). We also examine product agreement and subpixel characteristics across the land cover, climate, and topography. FT classifications are shown to vary widely depending on these variables, leading to an ambiguous definition of frozen and thawed states. Our results suggest that current products can characterize FT transitions with consistent subfreezing surface characteristics in far northern regions (>50 °N). However, uncertainty associated with FT classifications is shown to increase considerably as latitude decreases. Our results also suggest that fractional FT products, utilizing data inputs, such as LST, would provide a considerable improvement in mountainous regions with high intergrid cell heterogeneity, in regions characterized by ephemeral FT events (i.e., regions <40 °N), as well as during freeze and thaw onset periods. This study also provides insight to improving the representation of surface FT state by providing a clearer definition of the subpixel scale temperature characteristics that govern existing frozen classifications.
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A Green’s function inverse heat transfer (IHT) approach is used to reconstruct the surface heating conditions on ablative thermal protection system (TPS) materials from embedded heat flux sensor and temperature probe measurements. The approach models the temperature time-history at the measurement location as a discrete linear system, allowing for the heat flux boundary condition to be recovered directly without the need for time-marching schemes. The effects of material decomposition and pyrolysis gas transport are modeled using an energy source/sink analogue. The performance of the reconstruction approach is analyzed on a 1D test case representative of an atmospheric entry heating scenario. The approach can recover the TPS surface heat flux to within 4% of the input heating condition with a computation time of 2-3 seconds (>3 orders of magnitude faster than current time-marching IHT methods). As a byproduct of the surface heating reconstruction, the algorithm also captures the surface pyrolysis gas mass flux and solid decomposition at multiple through-thickness locations within the TPS.
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High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.