Results for “ADHESIVES” — Page 35

NASA NTRS2019

Adhesive Joining of Composite Laminates Using Epoxy Resins with Stoichiometric Offset

Polymer matrix composites are used in high performance structures because of their excellent specific strength, toughness and stiffness along the fiber. To realize the full performance advantages of composites, complex, built-up structures must be assembled with adhesive, but uncertainty in bond strength requires manufacturers to install bolts or other crack arrest features to ensure safety in critical applications. The inherent uncertainty in adhesive bonds stems from the material discontinuity at the composite-to-adhesive interfaces, which are susceptible to contamination. In contrast, composites made by co-curing, although limited in size and complexity, result in predictable structures that may be certifiable for commercial aviation with reduced dependence on redundant load paths.1 The pro-posed technology uses a stoichiometric offset of the hardener-to-epoxy ratio on the faying surfaces of laminates. Assembly of the components in a subsequent “secondary-co-cure” process results in a joint with no material discontinuities.

Palmieri, Frank L.↗

NASA NTRSDate not supplied

Protective Coatings for Mitigating Lunar Dust Abrasion and Adhesion

Materials resistant to the harsh lunar environment are needed to support long duration, sustainable missions on the Moon’s surface. Lunar dust poses a significant threat to the durability of components and vehicles due to its fine, jagged morphology and highly abrasive nature. These characteristics result in particles eroding, adhering and/or embedding onto component surfaces and into device confined geometries (e.g., gear housing, interlocking systems, etc.) potentially leading to premature failure. The aim of this work is to identify and characterize wear-resistant materials, including advanced ceramics, for use as protective coatings to minimize abrasion and adhesion caused by lunar dust. Results from testing and evaluation methods devised to elucidate and mimic aspects of lunar dust degradation, including adhesion, abrasion and erosion, as well as the lunar environment, will be presented. Discussion on balancing the need for dust management and tolerance versus dust adhesion mitigation will be shared in context of relevant lunar applications within the NASA Lunar Occupancy Dust Surface Separation Technologies effort, which is part of a NASA-wide effort to enable a sustained lunar presence through the Lunar Surface Innovation Initiative.

lunar dust mitigation↗

NASA NTRS2020

REACCH - Reactive Electro-Adhesive Capture ClotH Mechanism to Enable Safe Grapple of Cooperative/Non-Cooperative Space Debris

USC’s Space Engineering Research Center (SERC) and the Jet Propulsion Laboratory (JPL) have created a unique “octopus” tentacle end effector for robotic systems that uses formable electro-adhesion (EA) and Gecko adhesion capture cloth material. REACCH, or Reactive Electro-Adhesive Capture ClotH, supports soft capture of objects of any size, shape, surface finish or material on-orbit. To-date SERC/JPL have developed initial tentacles and backing spines that can control the EA/G material. Prototypes with two tentacles have been demonstrated and tested on a 3-DOF air bearing device in 1g in one plane of grip. The results show promise to further develop this new type of grappling mechanism able to make first soft contact with an object, with a technology that merges compliance and control elements for future on-orbit servicing and assembly missions. This paper presents the initial design and test results on this type of system.

Narayanan, Sriram↗

NASA NTRSDate not supplied

Analysis of Crack Propagation Transients in Accelerated Fatigue Characterization of Adhesives

The characterization of the rates of crack propagation by means of a Paris law is intended for steady-state fatigue conditions. While rates of crack propagation are primarily driven by 𝐽𝐽𝑚𝑚𝑚𝑚𝑚𝑚, in the presence of evolving process zones and fiber bridging they also depend on the crack propagation length: cracks with fully formed process zones propagate more slowly. Analyses of the rates of crack propagation in laminates secondarily bonded with AF163-2K film adhesive were conducted to identify the rate transients that occur during the formation of the process zone in the adhesive and during the evolution of bridging of the adhesive’s carrier knit across the crack faces. Dávila's CF22 cohesive fatigue damage model was used in finite element analyses of the double cantilever beam test to explain discrepancies in experimental rates of propagation obtained from tests conducted with either increasing or decreasing 𝐽max. The results indicate that the analyses accurately reproduce transient and steady-state rates of propagation observed in the experimental results, as well as the threshold of propagation. Transient rates of propagation always exceed those in steady state, which underscores the need to understand transients and account for them in fatigue characterization. The results also highlight that a Paris curve for steady-state propagation can be obtained most quickly using a decreasing load function, but that this curve consists of an unconservative bound to the rates of propagation. A lateral shift in the Paris curve is proposed for a conservative characterization that removes the effect of bridging and other R-curve effects.

fracture mechanics; delamination; J-integral↗

NASA NTRSDate not supplied

Analysis of Crack Propagation Transients in Accelerated Fatigue Characterization of Adhesives

The characterization of the rates of crack propagation by means of a Paris law is intended for steady-state fatigue conditions. While rates of crack propagation are primarily driven by 𝐽𝐽𝑚𝑚𝑚𝑚𝑚𝑚, in the presence of evolving process zones and fiber bridging they also depend on the crack propagation length: cracks with fully formed process zones propagate more slowly. Analyses of the rates of crack propagation in laminates secondarily bonded with AF163-2K film adhesive were conducted to identify the rate transients that occur during the formation of the process zone in the adhesive and during the evolution of bridging of the adhesive’s carrier knit across the crack faces. Dávila's CF22 cohesive fatigue damage model was used in finite element analyses of the double cantilever beam test to explain discrepancies in experimental rates of propagation obtained from tests conducted with either increasing or decreasing 𝐽max. The results indicate that the analyses accurately reproduce transient and steady-state rates of propagation observed in the experimental results, as well as the threshold of propagation. Transient rates of propagation always exceed those in steady state, which underscores the need to understand transients and account for them in fatigue characterization. The results also highlight that a Paris curve for steady-state propagation can be obtained most quickly using a decreasing load function, but that this curve consists of an unconservative bound to the rates of propagation. A lateral shift in the Paris curve is proposed for a conservative characterization that removes the effect of bridging and other R-curve effects.

fracture mechanics; delamination; J-integral↗

NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography↗

NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness↗

DOE OSTI2013

Investigation Of Adhesion Formation In New Stainless Steel Trim Spring Operated Pressure Relief Valves

Examination of proof test data for new (not previously installed) stainless steel (SS) trim spring operated pressure relief valves (SOPRV) reveals that adhesions form between the seat and disc in about 46% of all such SOPRV. The forces needed to overcome these adhesions can be sufficiently large to cause the SOPRV to fail its proof test (FPT) prior to installation. Furthermore, a significant percentage of SOPRV which are found to FPT are also found to ''fail to open'' (FTO) meaning they would not relief excess pressure in the event of an overpressure event. The cases where adhesions result in FTO or FPT appear to be confined to SOPRV with diameters < 1 in and set pressures < 150 psig and the FTO are estimated to occur in 0.31% to 2.00% of this subpopulation of SS trim SOPRV. The reliability and safety implications of these finding for end-users who do not perform pre-installation testing of SOPRV are discussed.

42 ENGINEERING↗

DOE OSTI2013

Photovoltaic module with adhesion promoter

Photovoltaic modules with adhesion promoters and methods for fabricating photovoltaic modules with adhesion promoters are described. A photovoltaic module includes a solar cell including a first surface and a second surface, the second surface including a plurality of interspaced back-side contacts. A first glass layer is coupled to the first surface by a first encapsulating layer. A second glass layer is coupled to the second surface by a second encapsulating layer. At least a portion of the second encapsulating layer is bonded directly to the plurality of interspaced back-side contacts by an adhesion promoter.

14 SOLAR ENERGY↗

DOE OSTI2015

Measurement of Interfacial Adhesion in Glass-Epoxy Systems Using the Indentation Method

The adhesion of coatings often controls the performance of the substrate-coating system. Certain engineering applications require an epoxy coating on a brittle substrate to protect and improve the performance of the substrate. Experimental observations and measurements of interfacial adhesion in glass-epoxy systems are described in this thesis. The Oliver and Pharr method was utilized to calculate the bulk epoxy hardness and elastic modulus. Spherical indentations were used to induce delaminations at the substrate-coating interface. The delamination sizes as a function of load were used to calculate the interfacial toughness. The interfacial fracture energy of my samples is an order of magnitude higher than a previous group who studied a similar glass-epoxy system. A comparison study of how different glass treatments affect adhesion was also conducted: smooth versus rough, clean versus dirty, stressed versus non-stressed.

36 MATERIALS SCIENCE↗

DOE OSTI2021

System and method for large-scale PCB production including continuous selective adhesion

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

Hatch, Jonathan Douglas↗

DOE OSTI2011

Molecular Design Principles Underlying beta-strand Swapping in the Adhesive Dimerization of Cadherins

Cell adhesion by classical cadherins is mediated by dimerization of their EC1 domains through the 'swapping' of N-terminal {beta}-strands. We use molecular simulations, measurements of binding affinities and X-ray crystallography to provide a detailed picture of the structural and energetic factors that control the adhesive dimerization of cadherins. We show that strand swapping in EC1 is driven by conformational strain in cadherin monomers that arises from the anchoring of their short N-terminal strand at one end by the conserved Trp2 and at the other by ligation to Ca{sup 2+} ions. We also demonstrate that a conserved proline-proline motif functions to avoid the formation of an overly tight interface where affinity differences between different cadherins, crucial at the cellular level, are lost. We use these findings to design site-directed mutations that transform a monomeric EC2-EC3 domain cadherin construct into a strand-swapped dimer.

59 BASIC BIOLOGICAL SCIENCES↗

DOE OSTI2013

Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process

We present the facile dry transfer of graphene synthesized via chemical vapor deposition on copper film to a functional device substrate. High quality uniform dry transfer of graphene to oxidized silicon substrate was achieved by exploiting the beneficial features of a poly(4-vinylphenol) adhesive layer involving a strong adhesion energy to graphene and negligible influence on the electronic and structural properties of graphene. The graphene field effect transistors (FETs) fabricated using the dry transfer process exhibit excellent electrical performance in terms of high FET mobility and low intrinsic doping level, which proves the feasibility of our approach in graphene-based nanoelectronics.

36 MATERIALS SCIENCE↗

DOE OSTI2014

Understanding the bond-energy, hardness, and adhesive force from the phase diagram via the electron work function

Properties of metallic materials are intrinsically determined by their electron behavior. However, relevant theoretical treatment involving quantum mechanics is complicated and difficult to be applied in materials design. Electron work function (EWF) has been demonstrated to be a simple but fundamental parameter which well correlates properties of materials with their electron behavior and could thus be used to predict material properties from the aspect of electron activities in a relatively easy manner. In this article, we propose a method to extract the electron work functions of binary solid solutions or alloys from their phase diagrams and use this simple approach to predict their mechanical strength and surface properties, such as adhesion. Two alloys, Fe-Ni and Cu-Zn, are used as samples for the study. EWFs extracted from phase diagrams show same trends as experimentally observed ones, based on which hardness and surface adhesive force of the alloys are predicted. This new methodology provides an alternative approach to predict material properties based on the work function, which is extractable from the phase diagram. This work may also help maximize the power of phase diagram for materials design and development.

36 MATERIALS SCIENCE↗

DOE OSTI2018

Novel Rear Side Metallization Route for Si Solar Cells Using a Transparent Conducting Adhesive

The rear side metallization of Si solar cells comes with a number of inherent losses and trade-offs: a larger metallized area fraction improves fill factor at the expense of open-circuit voltage, depositing directly on textured Si leads to low contact resistivity at the expense of short-circuit current, and some metallization processes create defects in Si. To mitigate many of these losses we have developed a novel approach for rear side metallization of Si solar cells, utilizing a transparent conducting adhesive (TCA) to metallize Si without exposing the wafer to the metal deposition process. The TCA consists of an insulating adhesive loaded with conductive microspheres. This approach leads to virtually no loss in implied open-circuit voltage upon metallization. Electrical measurements showed that contact resistivities of 3-9 ..omega..cm 2 were achieved, and an analysis of the transit resistance per microsphere showed that <;1 ..omega..cm 2 should be achievable with higher microsphere loading of the TCA.

14 SOLAR ENERGY↗

DOE OSTI2017

Role of Surface Chemistry in Grain Adhesion and Dissipation during Collisions of Silica Nanograins

The accretion of dust grains to form larger objects, including planetesimals, is a central problem in planetary science. It is generally thought that weak van der Waals interactions play a role in accretion at small scales where gravitational attraction is negligible. However, it is likely that in many instances, chemical reactions also play an important role, and the particular chemical environment on the surface could determine the outcomes of dust grain collisions. Using atomic-scale simulations of collisional aggregation of nanometer-sized silica (SiO{sub 2}) grains, we demonstrate that surface hydroxylation can act to weaken adhesive forces and reduce the ability of mineral grains to dissipate kinetic energy during collisions. The results suggest that surface passivation of dangling bonds, which generally is quite complete in an Earth environment, should tend to render mineral grains less likely to adhere during collisions. It is shown that during collisions, interactions scale with interparticle distance in a manner consistent with the formation of strong chemical bonds. Finally, it is demonstrated that in the case of collisions of nanometer-scale grains with no angular momentum, adhesion can occur even for relative velocities of several kilometers per second. These results have significant implications for early planet formation processes, potentially expanding the range of collision velocities over which larger dust grains can form.

79 ASTRONOMY AND ASTROPHYSICS↗

DOE OSTI2018

Novel Rear Side Metallization Route for Si Solar Cells Using a Transparent Conducting Adhesive: Preprint

The rear side metallization of Si solar cells comes with a number of inherent losses and trade-offs: a larger metallized area fraction improves fill factor at the expense of open-circuit voltage, depositing directly on textured Si leads to low contact resistivity at the expense of short-circuit current, and some metallization processes create defects in Si. To mitigate many of these losses we have developed a novel approach for rear side metallization of Si solar cells, utilizing a transparent conducting adhesive (TCA) to metallize Si without exposing the wafer to the metal deposition process. The TCA consists of an insulating adhesive loaded with conductive microspheres. This approach leads to virtually no loss in implied open-circuit voltage upon metallization. Electrical measurements showed that contact resistivities of 3-9 ..omega.. cm2 were achieved, and an analysis of the transit resistance per microsphere showed that less than 1 ..omega.. cm2 should be achievable with higher microsphere loading of the TCA.

14 SOLAR ENERGY↗

DOE OSTI2018

Evaluating and predicting molecular mechanisms of adhesive degradation during field and accelerated aging of photovoltaic modules

Extending photovoltaic (PV) module lifetimes beyond 30 years is a goal of significant priority. A challenge that must first be addressed, however, is the development of a predictive reliability model that captures the synergy of terrestrial stressors on module degradation, particularly at encapsulant interfaces. Using a metrology designed specifically for PV modules, a comprehensive study of the widely used ethylene vinyl acetate encapsulant was performed in which encapsulant adhesion was evaluated as a function of environmental stressors (UV exposure, temperature, and humidity) for modules aged both under accelerated lab and internationally located field conditions for months to nearly 3 decades. Mechanical and chemical characterization methods are combined with fundamental polymer reaction engineering to unravel the degradation processes active at the molecular scale that lead to encapsulant delamination. An analytical and modular model framework is put forward enabling the prediction of long-term PV module durability, starting from fundamental principles at the molecular level and explicitly accounting for bond rupture events in the bulk encapsulant and at the encapsulant interfaces. Successful parameter tuning to adhesion data indicates a dominant occurrence of deacetylation, β-scission, and hydrolytic depolymerization, respectively. The model contributes to the longstanding challenge of predicting module lifetimes in any geographic location while minimizing time-consuming and costly aging studies.

14 SOLAR ENERGY↗