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All sourcesNASA NTRSDOE OSTI
NASA NTRS2010

NASA Electronic Parts and Packaging (NEPP) Program - Update

This slide presentation reviews the goals and mission of the NASA Electronic Parts and Packaging (NEPP) Program. The NEPP mission is to provide guidance to NASA for the selection and application of microelectronics technologies, to improve understanding of the risks related to the use of these technologies in the space environment and to ensure that appropriate research is performed to meet NASA mission assurance needs. The program has been supporting NASA for over 20 years. The focus is on the reliability aspects of electronic devices. In this work the program also supports the electronics industry. There are several areas that the program is involved in: Memories, systems on a chip (SOCs), data conversion devices, power MOSFETS, power converters, scaled CMOS, capacitors, linear devices, fiber optics, and other electronics such as sensors, cryogenic and SiGe that are used in space systems. Each of these area are reviewed with the work that is being done in reliability and effects of radiation on these technologies.

LaBel, Kenneth A.↗
NASA NTRS2009

Virtex-4VQ dynamic and mitigated single event upset characterization summary

This report is the result of funding by the NASA Electronic Parts and Packaging Program (NEPP) and the combined efforts of members within the Xilinx Radiation Test Consortium (XRTC), sometimes known as the Xilinx Single Event Effects (SEE) Test Consortium. The XRTC is a voluntary association of aerospace entities, including leading aerospace companies, universitie and national laboratories, combining resources to characterize reconfigurable, field programmable gate arrays (FPGAs) for aerospace applications. Previous publications of Virtex-4 radiation results are for commercial (non-epitaxial) devices; see, for example, Refs. 1–5. A notable exception is Ref. 6, which presents XRTC upset measurements of storage elements in the PowerPC405s in the XQR4VFX60. This work represents a continuation of the efforts reported in the “Virtex-4QV Static SEU Characterization Summary” [7]. The contents of this report describe various Single Event Functional Interrupt (SEFI) and Single Event Upset (SEU) modes seen while dynamically exercising the clocked resources within Virtex-4 devices and the corresponding mitigation techniques related to the aforementioned observed SEFI modes.

Allen, Gregory↗
NASA NTRS1979

A three-dimensional viscous/potential flow interaction analysis method for multi-element wings: Modifications to the potential flow code to allow part-span, high-lift devices and close-interference calculations

The description of the modified code includes details of a doublet subpanel technique in which panels that are close to a velocity calculation point are replaced by a subpanel set. This treatment gives the effect of a higher panel density without increasing the number of unknowns. In particular, the technique removes the close approach problem of the earlier singularity model in which distortions occur in the detailed pressure calculation near panel corners. Removal of this problem allowed a complete wake relaxation and roll-up iterative procedure to be installed in the code. The geometry package developed for the new technique and also for the more general configurations is based on a multiple patch scheme. Each patch has a regular array of panels, but arbitrary relationships are allowed between neighboring panels at the edges of adjacent patches. This provides great versatility for treating general configurations.

Maskew, B.↗
NASA NTRS2009

Silicon Wafer-Scale Substrate for Microshutters and Detector Arrays

The silicon substrate carrier was created so that a large-area array (in this case 62,000+ elements of a microshutter array) and a variety of discrete passive and active devices could be mounted on a single board, similar to a printed circuit board. However, the density and number of interconnects far exceeds the capabilities of printed circuit board technology. To overcome this hurdle, a method was developed to fabricate this carrier out of silicon and implement silicon integrated circuit (IC) technology. This method achieves a large number of high-density metal interconnects; a 100-percent yield over a 6-in. (approximately equal to 15-cm) diameter wafer (one unit per wafer); a rigid, thermally compatible structure (all components and operating conditions) to cryogenic temperatures; re-workability and component replaceability, if required; and the ability to precisely cut large-area holes through the substrate. A method that would employ indium bump technology along with wafer-scale integration onto a silicon carrier was also developed. By establishing a silicon-based version of a printed circuit board, the objectives could be met with one solution. The silicon substrate would be 2 mm thick to survive the environmental loads of a launch. More than 2,300 metal traces and over 1,500 individual wire bonds are required. To mate the microshutter array to the silicon substrate, more than 10,000 indium bumps are required. A window was cut in the substrate to allow the light signal to pass through the substrate and reach the microshutter array. The substrate was also the receptacle for multiple unpackaged IC die wire-bonded directly to the substrate (thus conserving space over conventionally packaged die). Unique features of this technology include the implementation of a 2-mmthick silicon wafer to withstand extreme mechanical loads (from a rocket launch); integrated polysilicon resistor heaters directly on the substrate; the precise formation of an open aperture (approximately equal to 3x3cm) without any crack propagation; implementation of IR transmission blocking techniques; and compatibility with indium bump bonding. Although designed for the microshutter arrays for the NIRSpec instrument on the James Webb Space Telescope, these substrates can be linked to microshutter applications in the photomask generation and stepper equipment used to make ICs and microelectromechanical system (MEMS) devices.

Jhabvala, Murzy↗
NASA NTRS1979

Large area CCD image sensors for space astronomy

The Defense Advanced Research Projects Agency (DARPA) has a substantial program to develop a 2200 x 2200 pixel CCD (Charge Coupled Device) mosaic array made up of 400 individual CCD's, 110 x 110 pixels square. This type of image sensor appeared to have application in space and ground-based astronomy. Under this grant a CCD television camera system was built which was capable of operating an array of 4 CCD's to explore the suitability of the CCD's to explore the suitability of the CCD for astronomical applications. Two individual packaged CCD's were received and evaluated. Evaluation of the basic characteristics of the best individual chips was encouraging, but the manufacturer found that their yield in manufacturing this design is two low to supply sufficient CDD's for the DARPA mosaic array. The potential utility of large mosaic arrays in astronomy is still substantial and continued monitoring of the manufacturers progress in the coming year is recommended.

Schwarzschild, M.↗
NASA NTRS1993

Output data formatter for the Electronically Scanned Thinned Array Radiometer (ESTAR) instrument

A prototype Output Data Formatter (ODF) for the ESTAR (Electronically Scanned Thinned Array Radiometer) instrument has been designed and tested. It employs programmable logic devices to format and tag correlator data for transmission to Earth. After accepting 170 bits or correlator and error data in parallel, it appends an identification word and then serially passes the data to the Small Explorer Data System (SEDS) for transmission at a maximum rate of greater than 15 Mb/sec. Implemented with two reprogrammable field programmable gate arrays (FPGA's), each contained in a 132-pin plastic pin grid array (PGA) package, the design is cascadeable, fully testable, and low-power.

Chren, William A., Jr.↗
NASA NTRS1972

Heat pipe applications for the space shuttle.

Discussion of six specific applications for heat pipe (HP) devices on the space shuttle. These applications were chosen from 27 concepts formulated as part of a study to evaluate the potential benefits associated with HP use. The formulation process is briefly described along with the applications which evolved. The bulk of the discussion deals with the 'top' six - namely, HP radiators for waste heat rejection, an HP augmented cold rail, an HP circuit for electronic equipment cooling, modular heat sink for control of remote packages, an HP temperature control for compartments, and air-cooled equipment racks. The philosophy, physical design details, and performance data are presented for each concept along with a comparison with the baseline design where applicable.

Tawil, M.↗
NASA NTRS1977

An active nutation damper for spacecraft

An active nutation damping device, consisting of an angular accelerometer, a dc motor driven flywheel, and associated electronics, was developed for spacecraft use. This damping system was used on the Lageos spacecraft, launched 4 May 1976, to control nutation buildup during the long coast period after the third stage separation. Of many electrical and mechanical design choices, an angular rather than linear accelerometer offered some advantages but problems developed in adapting the angular accelerometer to spacecraft use. The damper package was evaluated and proven on a three axis gas-bearing simulator that duplicated the Lageos spacecraft critical flight dynamics. A failure analysis of the damper assembly was performed. Performance of the damper during the Lageos flight has confirmed the preflight evaluation and analysis.

Abercrombie, R. A.↗
NASA NTRS1989

Development of a tether deployment monitoring system

The feasibility of monitoring the position of a tether during orbital deployment is discussed. Attention is given to the techniques for attaching reflectors to the tether at periodic intervals during the deployment process, which could then be tracked visually or with a radar unit that is pointed towards the targets by the control system. Consideration is also given to a method for tether attitude and tension detection, and a launching device to attach small instrumentation platforms onto the tether during deployment. The configuration of a tether deployment monitoring system (TEDEMS) and the equipment developed to perform the above tasks are described, along with an analysis of requirements for the construction of a family of space-borne TEDEMS suitable for use on the Space Shuttle, Expendable Launch Vehicles, or the Space Station. The potential uses of the TEDEMS for launching small tether-borne experimental packages are discussed. Design and block diagrams are included.

Ibanez, P.↗
NASA NTRS2013

Fully Printed, Flexible, Phased Array Antenna for Lunar Surface Communication

NASAs future exploration missions focus on the manned exploration of the Moon, Mars, and beyond, which will rely heavily on the development of a reliable communications infrastructure from planetary surface-to-surface, surface-to-orbit, and back to Earth. Flexible antennas are highly desired in many scenarios. Active phased array antennas (active PAAs) with distributed control and processing electronics at the surface of an antenna aperture offer numerous advantages for radar communications. Large-area active PAAs on flexible substrates are of particular interest in NASA s space radars due to their efficient inflatable package that can be rolled up during transportation and deployed in space. Such an inflatable package significantly reduces stowage volume and mass. Because of these performance and packaging advantages, large-area inflatable active PAAs are highly desired in NASA s surface-to-orbit and surface-to-relay communications. To address the issues of flexible electronics, a room-temperature printing process of active phased-array antennas on a flexible Kapton substrate was developed. Field effect transistors (FETs) based on carbon nanotubes (CNTs), with many unique physical properties, were successfully proved feasible for the PAA system. This innovation is a new type of fully inkjet-printable, two-dimensional, high-frequency PAA on a flexible substrate at room temperature. The designed electronic circuit components, such as the FET switches in the phase shifter, metal interconnection lines, microstrip transmission lines, etc., are all printed using a special inkjet printer. Using the developed technology, entire 1x4, 2x2, and 4x4 PAA systems were developed, packaged, and demonstrated at 5.3 GHz. Several key solutions are addressed in this work to solve the fabrication issues. The source/drain contact is developed using droplets of silver ink printed on the source/drain areas prior to applying CNT thin-film. The wet silver ink droplets allow the silver to wet the CNT thin-film area and enable good contact with the source and drain contact after annealing. A passivation layer to protect the device channel is developed by bonding a thin Kapton film on top of the device channel. This film is also used as the media for transferring the aligned CNT thin-film on the device substrate. A simple and cost-effective technique to form multilayer metal interconnections on flexible substrate is developed and demonstrated. Contact vias are formed on the second substrate prior to bonding on the first substrate. Inkjet printing is used to fill the silver ink into the via structure. The printed silver ink penetrates through the vias to contact with the contact pads on the bottom layer. It is then annealed to form a good connection. One-dimensional and two-dimensional PAAs were fabricated and characterized. In these circuits, multilayer metal interconnects were used to make a complete PAA system.

Subbaraman, Harish↗
NASA NTRS1983

Development and fabrication of a high current, fast recovery power diode

A high voltage (VR = 1200 V), high current (IF = 150 A), fast recovery ( 700 ns) and low forward voltage drop ( 1.5 V) silicon rectifier was designed and the process developed for its fabrication. For maximum purity, uniformity and material characteristic stability, neutron transmutation n-type doped float zone silicon is used. The design features a hexagonal chip for maximum area utilization of space available in the DO-8 diode package, PIN diffused junction structure with deep diffused D(+) anode and a shallow high concentration n(+) cathode. With the high temperature glass passivated positive bevel mesa junction termination, the achieved blocking voltage is close to the theoretical limit of the starting material. Gold diffusion is used to control the lifetime and the resulting effect on switching speed and forward voltage tradeoff. For solder reflow assembly, trimetal (Al-Ti-Ni) contacts are used. The required major device electrical characteristics were achieved. Due to the tradeoff nature of forward voltage drop and reverse recovery time, a compromise was reached for these values.

Berman, A. H.↗
NASA NTRS2001

Mars Array Technology Experiment Developed to Test Solar Arrays on Mars

Solar arrays will be the power supply for future missions to the planet Mars, including landers, rovers, and eventually human missions to explore the Martian surface. Until Mars Pathfinder landed in July 1997, no solar array had been used on the surface. The MATE package is intended to measure the solar energy reaching the surface, characterize the Martian environment to gather the baseline information required for designing power systems for long-duration missions, and to quantify the performance and degradation of advanced solar cells on the Martian surface. To measure the properties of sunlight reaching the Martian surface, MATE incorporates two radiometers and a visible/NIR spectrometer. The radiometers consist of multiple thermocouple junctions using thin-film technology. These devices generate a voltage proportional to the solar intensity. One radiometer measures the global broadband solar intensity, including both the direct and scattered sunlight, with a field of view of approximately 130. The second radiometer incorporates a slit to measure the direct (unscattered) intensity radiation. The direct radiometer can only be read once per day, with the Sun passing over the slit. The spectrometer measures the global solar spectrum with two 256-element photodiode arrays, one Si sensitive in the visible range (300 to 1100 nm), and a second InGaAs sensitive to the near infrared (900 to 1700 nm). This range covers 86 percent of the total energy from the Sun, with approximately 5-nm resolution. Each photodiode array has its own fiber-optic feed and grating. Although the purpose of the MATE is to gather data useful in designing solar arrays for Mars surface power systems, the radiometer and spectrometer measurements are expected to also provide important scientific data for characterizing the properties of suspended atmospheric dust. In addition to measuring the solar environment of Mars, MATE will measure the performance of five different individual solar cell types and two different solar cell strings, to qualify advanced solar cell types for future Mars missions. The MATE instrument, designed for the Mars-2001 Surveyor Lander mission, contains a capable suite of sensors that will provide both scientific information as well as important engineering data on the operation of solar power systems on Mars. MATE will characterize the intensity and spectrum of the solar radiation on Mars and measure the performance of solar arrays in the Mars environment. MATE flight hardware was built and tested at the NASA Glenn Research Center and is ready for flight.

Landis, Geoffrey A.↗
NASA NTRS2017

Transparent Conductive Ink for Additive Manufacturing

NASA analyzes, tests, packages, and fabricates electrical, electronic, and electromechanical (EEE) parts. Nanotechnology is listed in NASA's Technology Roadmap as a key area to invest for further development.1 This research project focused on using nanotechnology to improve electroluminescent lighting in terms of additive manufacturing and to increase energy efficiency. Specifically, this project's goal was to produce a conductive but transparent printable ink that can be sprayed on any surface for use as one of the electrodes in electroluminescent device design. This innovative work is known as thick film dielectric electroluminescent (TDEL) technology. TDEL devices are used for "backlighting, illumination, and identification due to their tunable color output, scalability, and efficiency" (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). These devices use a 'front-to-back' printing method, where the substrate is the transparent layer, and the dielectric and phosphor are layered on top. This project is a first step in the process of creating a 3D printable 'back-to-front' electroluminescent device. Back-to-front 3D-printed devices are beneficial because they can be printed onto different substrates and embedded in different surfaces, and the substrate is not required to be transparent, all because the light is emitted from the top surface through the transparent conductor. Advances in this area will help further development of printing TDEL devices on an array of different surfaces. Figure 1 demonstrates the layering of the two electrodes that are aligned in a parallel plate capacitor structure (I.K. Small, T.D. Rolin, and A.D. Shields, "3D Printed Electroluminescent Light Panels," NASA Fiscal Year 2017 Center Innovation Fund Proposal, unpublished data, 2017). Voltage is applied across the device, and the subsequent electron excitation results in light emission at the top layer.

Patlan, X. J.↗
NASA NTRS1975

Sensor equipment of the German earth scientific airplane program

The German airplane program for earth scientific research supports the work of a vast staff of earth scientists from universities and federal agencies. Due to their fields of interest, which are in oceanography, hydrology, geology, ecology, and forestry, five test areas were selected which are spread all over Germany. The sensor package, which was designed in accordance with the requirements of this group of scientists, will be installed in a DO 28 D2 type airplane. The sensor equipment consists of a series of 70-mm cameras having different film/filter combinations, a photogrammetric camera, an infrared radiometer, an 11-channel multispectral line scanner, a LANDSAT-compatible radiometer, and a complex avionic system. Along with the airplane, a truck will be equipped with a set of radiometers and other sensor devices for extensive ground-truth measurement; this also includes a cherry picker.

Seige, P.↗
NASA NTRS2007

Structural Bus and Release Mechanisms on the ST5 Satellites: Summary and Status

The Space Technology 5 Mechanical System met the challenge of packaging a fully functional science and technology satellite system with its Deployer mechanism into a compact 0.07cu m volume. Three 25 kg satellites were orbited in constellation in March, 2006. The ST5 mechanical system is composed of 1) The Structural Bus; 2) Magnetometer Instrument Boom 3) Spacecraft Deployer Release Mechanism This system includes a highly integrated electronics enclosure as a multifunctional structure; a lightweight, magnetically clean Magnetometer Boom; the first use of Nitinol Shape-Memory Alloy trigger devices for deploying multiple spacecraft; an innovative compliant mount for the umbilical connector and a Deployer mechanism that imparts both separation velocity and mission spin rate to three constellation flying satellites These elements employed cutting-edge design and analysis tools, state-of-the-art testing facilities and proven engineering techniques to meet stringent performance criteria, enabling the mission s success.

Rossoni, Peter↗
NASA NTRS2013

WFL: Microwave Applications of Thin Ferroelectric Films

We have developed a family of tunable microwave circuits, operating from X- through Ka-band, based on laser ablated BaxSr1-xTiO films on lanthanum aluminate and magnesium oxide substrates. Circuits include voltage controlled oscillators, filters, phase shifters and antennas. A review of the basic theory of operation of these devices will be presented along with measured performance. Emphasis has been on low-loss phase shifters to enable a new phased array architecture. The critical role of phase shifter loss and transient response in reflectarray antennas will be discussed. The Ferroelectric Reflectarray Critical Components Space Experiment was launched on the penultimate Space Shuttle, STS-134, in May of 2011. It included a bank of ferroelectric phase shifters with two different stoichiometries as well as ancillary electronics. The experiment package and status will be reported. In addition, unusual results of a Van der Pauw measurement involving a ferroelectric film grown on buffered high resisitivity silicon will be discussed.

Romanofsky, Robert↗
NASA NTRS1975

Battery peak charge voltage monitor for dual air density satellite

A battery peak charge voltage monitor was developed for use on the dual air density satellite (DADS). This device retains a reading of the maximum voltage reached by the spacecraft battery during periods of charging, and makes it available during periods of data transmission. The monitor is connected across the battery and operates solely from the battery; it is powered continuously with quiescent input current of only 3 milliamperes. Standard integrated circuits and a thin-film resistor network are utilized. The monitor occupies approximately 40 square centimeters of a printed-circuit board within a larger electronic package.

Shull, T. A.↗
NASA NTRS1997

SiC-Based Gas Sensors

Electronic grade Silicon Carbide (SiC) is a ceramic material which can operate as a semiconductor at temperatures above 600 C. Recently, SiC semiconductors have been used in Schottky diode gas sensor structures. These sensors have been shown to be functional at temperatures significantly above the normal operating range of Si-based devices. SiC sensor operation at these higher temperatures allows detection of gases such as hydrocarbons which are not detectable at lower temperatures. This paper discusses the development of SiC-based Schottky diode gas sensors for the detection of hydrogen, hydrocarbons, and nitrogen oxides (NO(x)). Sensor designs for these applications are discussed. High sensitivity is observed for the hydrogen and hydrocarbon sensors using Pd on SiC Schottky diodes while the NO(x) sensors are still under development. A prototype sensor package has been fabricated which allows high temperature operation in a room temperature ambient by minimizing heat loss to that ambient. It is concluded that SiC-based gas sensors have considerable potential in a variety of gas sensing applications.

Chen, Liang-Yu↗