Heat pipe applications for the space shuttle.

Abstract

Discussion of six specific applications for heat pipe (HP) devices on the space shuttle. These applications were chosen from 27 concepts formulated as part of a study to evaluate the potential benefits associated with HP use. The formulation process is briefly described along with the applications which evolved. The bulk of the discussion deals with the 'top' six - namely, HP radiators for waste heat rejection, an HP augmented cold rail, an HP circuit for electronic equipment cooling, modular heat sink for control of remote packages, an HP temperature control for compartments, and air-cooled equipment racks. The philosophy, physical design details, and performance data are presented for each concept along with a comparison with the baseline design where applicable.