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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 577 records · Page 32
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Design of Novel Hot Gas Component for Gas Turbine Engines Enabled by Materials and Additive Manufacturing Process Development

This CRADA project was the result of a project award under FOA-DOE-0001980. The overarching FOA project team consisted of researchers from Carpenter Technology Corporation (CTC), Solar Turbines Incorporated (Solar), Pennsylvania State University (PSU), University of California-Santa Barbara (UCSB), and Oak Ridge National Laboratory (ORNL). Evaluations were conducted on two high-γ’ superalloys that were designed by CTC and the UCSB. One alloy named GammaPrint-700 (GP-700) is a cobalt-base superalloy. The other alloy named GammaPrint-1100 (GP-1100) is a nickel-base (Ni-base) superalloy. PSU provided expertise and experimental testing of the thermal performance of AM micro-cooling architectures. ORNL provided expertise with the AM superalloy materials characterization and AM processing science. Solar provided turbine component design expertise. The focus of this CRADA report is to document the efforts between ORNL and CTC towards the development of superalloys designed for AM. The project goal was to use an AM processable high-temperature superalloy and design for Additive Manufacturing (DfAM) techniques to design an efficient turbine component (i.e. a turbine tip shoe) with enhanced cooling features that can only be fabricated through additive manufacturing (AM). The efficiencies of existing combined heat and power (CHP) engines are capped by both component design and materials limitations. However, AM of a tip shoe component from a γ’strengthened superalloy offers the design flexibility to increase the efficiency and power of an industrial gas turbine. This project brought about advancements in the DfAM tip shoe design space and in the area of high temperature superalloys processable through laser powder bed fusion (LPBF) AM. State of art computation design tools were utilized to optimize unique cooling features into a tip shoe component design. A two-prong materials development approach was taken to support development of the AM tip shoe geometry. The first approach centered on investigating the processability and the appropriate process science for the industry standard high-γ’ nickel-base (Ni-base) superalloy Mar-M247. This superalloy is typically cast and considered non-weldable by traditional welding standards. In the course of this work, the alloy was not deemed feasible for process scale-up due to significant cracking issues during printing. The second approach focused on the development and evaluation of a novel cobalt-base superalloy, GammaPrint™-700 (GP-700 and a Ni-base superalloy, GammaPrint™-1100 (GP-1100) designed to mitigate the significant AM processing issues with Mar-M247. The processability of these two alloys were investigated through electron beam melting (EBM) binder-jet AM (BJAM), and LPBF as a risk mitigation for manufacturability. To be considered a candidate material for down-selection to proceed to fullscale AM tip shoe engine testing trials, the high temperature creep rupture strength was required to achieve at a minimum, a Larsen Miller Parameter (LMP) increase of 10.9% over the baseline material LPBF AM Hastelloy X.

36 MATERIALS SCIENCE↗
NASA NTRS1990

Additives Lower Dielectric Constants Of Polyimides

Dielectric constants as low as 2.43 make polyimides more attractive for electronic applications. Process makes aromatic condensation polyimide films and coatings with dielectric constants lowered by incorporation of diamic acid additives. Materials provide better electrical insulation without sacrificing temperature stability of polyimide binders. Applicable whenever high temperature, low absorption of moisture, and high electrical-insulation properties needed. Applications include semiconductors and printed-circuit boards for computer industry and possibly automotive industry.

Stoakely, Diane M.↗
NASA NTRS1992

Projected-Fringe, Phase-Stepping Profilometer

Projected-fringe, phase-stepping profilometer is system of optical, electronic, optoelectronic, and electro-optical equipment measuring surface profiles of objects. Projects optical interference pattern onto object and steps phase of pattern to extract phases of interfering beams where they intersect object. Data obtained within seconds. Noncontact, full-field surface profilometer has applications, including inspection of machined and ceramic parts, printed circuit boards, and optical components. Rugged and compact, measures surfaces with variety of sizes and finishes.

Mercer, Carolyn↗
NASA NTRS2007

NASA Tech Briefs, June 2007

Topics covered include: High-Accuracy, High-Dynamic-Range Phase-Measurement System; Simple, Compact, Safe Impact Tester; Multi-Antenna Radar Systems for Doppler Rain Measurements; 600-GHz Electronically Tunable Vector Measurement System; Modular Architecture for the Measurement of Space Radiation; VLSI Design of a Turbo Decoder; Architecture of an Autonomous Radio Receiver; Improved On-Chip Measurement of Delay in an FPGA or ASIC; Resource Selection and Ranking; Accident/Mishap Investigation System; Simplified Identification of mRNA or DNA in Whole Cells; Printed Multi-Turn Loop Antennas for RF Biotelemetry; Making Ternary Quantum Dots From Single-Source Precursors; Improved Single-Source Precursors for Solar-Cell Absorbers; Spray CVD for Making Solar-Cell Absorber Layers; Glass/BNNT Composite for Sealing Solid Oxide Fuel Cells; A Method of Assembling Compact Coherent Fiber-Optic Bundles; Manufacturing Diamond Under Very High Pressure; Ring-Resonator/Sol-Gel Interferometric Immunosensor; Compact Fuel-Cell System Would Consume Neat Methanol; Algorithm Would Enable Robots to Solve Problems Creatively; Hypothetical Scenario Generator for Fault-Tolerant Diagnosis; Smart Data Node in the Sky; Pseudo-Waypoint Guidance for Proximity Spacecraft Maneuvers; Update on Controlling Herds of Cooperative Robots; and Simulation and Testing of Maneuvering of a Planetary Rover.

Source record↗
DOE OSTI2020

Origin of dislocation structures in an additively manufactured austenitic stainless steel 316L

In this experiment, the origin of dislocation structures in AM stainless steels was systematically investigated by controlling the effect of thermal stress through geometric constraints for the first time. Stainless steel 316L parts were produced in the form of “1D” rods, “2D” walls, and "3D" rectangular prisms to evaluate the effect of constraints to thermal expansion/shrinkage on the development of defect microstructures and to elucidate the origin of additively manufactured (AM) dislocation microstructures. Dislocation density, organization, chemical micro-segregation, precipitate structures, and misorientations were analyzed as a function of increasing constraints around solidifying material in 1D, 2D, and 3D components built using both directed energy deposition (DED) and powder-bed selective laser melting (SLM). In DED parts, the dislocation density was not dependent on local misorientations or micro-segregation patterns, but evolved from approximately ρ ⊥ = 10 12 m -2 in 1D parts to ρ ⊥ = 10 14 m -2 in 3D parts, indicating that it is primarily thermal distortions that produce AM dislocation structures. In DED 3D parts and SLM parts, dislocation densities were highest (ρ ⊥ ≈ 10 14 m -2 ) and corresponded to the formation of dislocation cells approximately 300-450 nm in diameter. Dislocation cells overlapped with dendrite micro-segregation in some but not all cases. The results illustrate that dendritic micro-segregation, precipitates, or local misorientations influence how the dislocations organize during processing, but are not responsible for producing the organized cell structures. Furthermore, this work shows that AM dislocation structures originate due to thermal distortions during printing, which are primarily dictated by constraints surrounding the melt pool and thermal cycling.

36 MATERIALS SCIENCE↗
NASA NTRS2003

Comparison of On-orbit and Ground Based Hollow Cathode Operation

The Plasma Contactor Units (PCUs) were developed at NASA Glenn Research Center (GRC) and Boeing for charge control on board the International Space Station (ISS). Since the first ignition of a PCU on 10/16/2000 over 3,900 hours of operation have been demonstrated on a single unit. In order to guarantee that the PCUs hollow cathode assemblies (HCAs), which emit the electrons used for charge control, would satisfy the life requirement of 18,000 hours, a ground based hollow cathode life test program was initiated at GRC. The life test program aimed at 27,000 hours of operation on a single unit to demonstrate the industry standard 1.5 times operational life requirement. As of this printing, over 18,000 hours of operation have been accumulated on a single hollow cathode. By comparing the data received from the on-orbit HCAs to the data obtained for the life test cathodes, a comparison may be drawn to determine if the on-orbit HCAs are operating normally, with a final goal of predicting lifetime. Based on the data taken thus far, it can be concluded that the on-orbit HCAs are operating within their design specifications.

Patterson, Michael↗
NASA NTRS2001

Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems

High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.

Chen, Liang-Yu↗
DOE OSTI2023

Hardness Measurements and Interface Behavior of SiC-B 4 C-Si Multiple Phase Particulate Composites Made with Melt Infiltration and Additive Manufacturing

Reaction-bonded SiC-B 4 C-Si ceramic composites were binder jet 3D-printed and subsequently pressureless-melt-infiltrated with molten Si. The addition of B 4 C aided the Si infiltration to produce a highly dense composite. The microstructures and phases of these composites were examined. The measured hardness values of each constituent with Vickers and nanoindentation matched the bulk values, and the macro-hardness values with Knoop and spherical indentation represented the bulk, composite hardness values of all three phases together, which was close to a rule of mixtures value. For particulate-based composites, this is a significant finding. The interfacial bonds of SiC and Si were imaged using scanning transmission electron microscopy to view intimacy, whereas the crack propagation was examined with carefully placed indents. This work demonstrated that pressureless melt infiltration with a reactive particle provides a method to shape non-wetting reaction-bonded ceramic composites with limited shrinkage and high density and provides insights into the mechanical behavior with numerous indentation techniques.

36 MATERIALS SCIENCE↗
NASA NTRS1974

Skylab electronic technological advancements

The present work describes three electronic devices designed for use in the Skylab airlock module: the teleprinter system, the quartz crystal microbalance contamination monitor (QCM), and the speaker. Design considerations, operation, characteristics, and system development are described for these systems, with accompanying diagrams, graphs, and photographs. The teleprinter is a thermal dot printer used to produce hard copy messages by electrically heating print elements in contact with heat-sensitive paper. The QCM was designed to estimate contamination buildup on optical surfaces of the earth resources experiment package. A vibrating quartz crystal is used as a microbalance relating deposited mass to shifts in the crystal's resonant frequency. Audio devices provide communication between crew members and between crew and STDN, and also provide audible alarms, via the caution and warning system, of out-of-limit-conditions.

Hornback, G. L.↗
DOE OSTI2022

3D isotope density measurements by energy-resolved neutron imaging

Abstract Tools for three-dimensional elemental characterization are available on length scales ranging from individual atoms, using electrons as a probe, to micrometers with X-rays. However, for larger volumes up to millimeters or centimeters, quantitative measurements of elemental or isotope densities were hitherto only possible on the surface. Here, a novel quantitative elemental characterization method based on energy-resolved neutron imaging, utilizing the known neutron absorption cross sections with their ‘finger-print’ absorption resonance signatures, is demonstrated. Enabled by a pixilated time-of-flight neutron transmission detector installed at an intense short-pulsed spallation neutron source, for this demonstration 3.25 million state-of-the-art nuclear physics neutron transmission analyses were conducted to derive isotopic densities for five isotopes in 3D in a volume of 0.25 cm 3 . The tomographic reconstruction of the isotope densities provides elemental maps similar to X-ray microprobe maps for any cross section in the probed volume. The bulk isotopic density of a U-20Pu-10Zr-3Np-2Am nuclear transmutation fuel sample was measured, agrees well with mass-spectrometry and is evidence of the accuracy of the method.

36 MATERIALS SCIENCE↗
NASA NTRS2011

Process-Hardened, Multi-Analyte Sensor for Characterizing Rocket Plume Constituents

A multi-analyte sensor was developed that enables simultaneous detection of rocket engine combustion-product molecules in a launch-vehicle ground test stand. The sensor was developed using a pin-printing method by incorporating multiple sensor elements on a single chip. It demonstrated accurate and sensitive detection of analytes such as carbon dioxide, carbon monoxide, kerosene, isopropanol, and ethylene from a single measurement. The use of pin-printing technology enables high-volume fabrication of the sensor chip, which will ultimately eliminate the need for individual sensor calibration since many identical sensors are made in one batch. Tests were performed using a single-sensor chip attached to a fiber-optic bundle. The use of a fiber bundle allows placement of the opto-electronic readout device at a place remote from the test stand. The sensors are rugged for operation in harsh environments.

Goswami, Kisholoy↗
DOE OSTI2023

A hybrid 3D/2D field response calculation for liquid argon detectors with PCB based anode plane

Liquid Argon Time Projection Chamber (LArTPC) technology is commonly utilized in neutrino detector designs. It enables detailed reconstruction of neutrino events with high spatial precision and low energy threshold. Its field response (FR) model describes the time-dependent electric currents induced in the anode-plane electrodes when ionization electrons drift nearby. An accurate and precise FR is a crucial input to LArTPC detector simulations and charge reconstruction. Established LArTPC designs have been based on parallel wire planes. It allows accurate and computationally economic two-dimensional (2D) FR models utilizing the translational symmetry along the direction of the wires. Recently, novel LArTPC designs utilize electrodes formed on printed circuit board (PCB) in the shape of strips with through holes. The translational symmetry is no longer a good approximation near the electrodes and a new FR calculation that employs regions with three dimensions (3D) has been developed. Extending the 2D models to 3D would be computationally expensive. Fortuitously, the nature of strips with through holes allows for a computationally economic approach based on the finite-difference method (FDM). In this paper, we present a new software package pochoir that calculates LArTPC field response for these new strip-based anode designs. This package combines 3D calculations in the volume near the electrodes with 2D far-field solutions to achieve fast and precise field response computation. We apply the resulting FR to simulate and reconstruct samples of cosmic-ray muons and 39 Ar decays from a Vertical Drift (VD) detector prototype operated at CERN. We find the difference between real and simulated data within 5%. Current state-of-the-art LArTPC software requires a 2D FR which we provide by averaging over one dimension and estimate that variations lost in this average are smaller than 7%.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
NASA NTRS1974

Blindness

The possibilities are considered that modern electronics and engineering have to offer the individual with a damaged or disordered nervous system, especially the blind person. Discussed are the incidence and principal causes of blindness, past research activities, and a capsule review of some of the more interesting programs designed to provide the blind with the ability to be mobile in their environment and to read printed matter.

Pudenz, R. H.↗
DOE OSTI2022

Not All Aggregates Are Made the Same: Distinct Structures of Solution Aggregates Drastically Modulate Assembly Pathways, Morphology, and Electronic Properties of Conjugated Polymers

Abstract Tuning structures of solution‐state aggregation and aggregation‐mediated assembly pathways of conjugated polymers is crucial for optimizing their solid‐state morphology and charge‐transport property. However, it remains challenging to unravel and control the exact structures of solution aggregates, let alone to modulate assembly pathways in a controlled fashion. Herein, aggregate structures of an isoindigo–bithiophene‐based polymer (PII‐2T) are modulated by tuning selectivity of the solvent toward the side chain versus the backbone, which leads to three distinct assembly pathways: direct crystallization from side‐chain‐associated amorphous aggregates, chiral liquid crystal (LC)‐mediated assembly from semicrystalline aggregates with side‐chain and backbone stacking, and random agglomeration from backbone‐stacked semicrystalline aggregates. Importantly, it is demonstrated that the amorphous solution aggregates, compared with semicrystalline ones, lead to significantly improved alignment and reduced paracrystalline disorder in the solid state due to direct crystallization during the meniscus‐guided coating process. Alignment quantified by the dichroic ratio is enhanced by up to 14‐fold, and the charge‐carrier mobility increases by a maximum of 20‐fold in films printed from amorphous aggregates compared to those from semicrystalline aggregates. This work shows that by tuning the precise structure of solution aggregates, the assembly pathways and the resulting thin‐film morphology and device properties can be drastically tuned.

36 MATERIALS SCIENCE↗
DOE OSTI2021

Separating Miscible Liquid–Liquid Mixtures Using Supported Ionic Liquid Membranes

Supported liquid membranes (SLMs) are promising in separating miscible liquid–liquid mixtures, which has been a key challenge in wastewater treatment and other applications. However, SLMs suffer from poor durability due to the loss of the liquid phase. In current work, ionic liquids (ILs) with high stability have been impregnated into polyvinylidene fluoride membranes to separate miscible benzene–heptane mixtures. The two imidazolium-based ILs, that is, 1-butyl-3-methylimidazolium hexafluorophosphate ([BMIM][PF 6 ]) and 1-butyl-3-methylimidazolium tris(pentafluoroethyl) trifluorophosphate ([BMIM][FAP]), were tested in supported ionic liquid membranes (SILMs) for the benzene–heptane separation. Both ILs show successful separation within 48 h as indicated by nuclear magnetic resonance results. Compared to the SILM with [BMIM][FAP], the SILM with [BMIM][PF 6 ] has lower throughput and higher selectivity. The higher selectivity can be attributed to the higher hydrophilicity of [BMIM][PF 6 ], which results in strong repulsion against heptane. The lower throughput can be attributed to the higher hydrophilicity as well since it lowers the solubility of benzene in [BMIM][PF 6 ]. The stability of IL in SILMs has also been investigated via multiple separation cycles. The scanning electron microscopy, weight change of SILMs, and separation results indicate that the separation efficiency of the [BMIM][PF 6 ] SILM does not degrade for up to 144 h. The SILM has been further optimized with curvature design (i.e., curved SILM) to increase the interfacial area and thus increase the separation throughput, where the curved SILM separation device was 3D-printed. Here, the findings here have important implications on design and application of SILMs in separating miscible liquid–liquid mixtures.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
DOE OSTI2023

Mitigating challenges in aberration-corrected electron-beam lithography on electron-opaque substrates

Aberration-corrected electron-beam lithography (AC-EBL) using ultra-thin electron transparent membranes has achieved single-digit nanometer resolution in two widely used electron-beam resists: poly (methyl methacrylate) (PMMA) and hydrogen silsesquioxane. On the other hand, AC-EBL implementation on thick, electron-opaque substrates is appealing for conventional top-down fabrication of quantum devices with nanometer-scale features. To investigate the performance of AC-EBL on thick substrates, we measured the lithographic point spread function of a 200 keV aberration-corrected scanning transmission electron microscope by defining both positive and negative patterns in PMMA thin films, spin-cast on thick SiO 2 /Si substrates. We present the problems encountered during pre-exposure beam focusing and discuss methods to overcome them. In addition, applying some of these methods using commercial 50 nm thick SiN X membranes with thick Si support frames, we printed arrays of holes in PMMA with pitches around 26 nm on SiN X /Si substrates with increasing Si thickness. Here, our results show that proximity effects from even 50 nm thick SiN X membranes limit hole arrays to 20 nm pitch; however, down to this limit, the effect of the substrate thickness on the pattern quality is minimal. These results highlight the need for novel resists less susceptible to proximity effects, or resists which can be used directly, after development, as the dielectric material in periodic gates in 2D quantum devices.

2D quantum devices↗
DOE OSTI2025

Design and Analysis of Short Period 2G-HTS Undulators

Recent advancements in second-generation high-temperature superconducting (2G-HTS) materials have opened new possibilities for superconducting undulator (SCU) technology, particularly in achieving shorter periods and higher magnetic fields. Here, this paper presents the design and analysis of a short-period, as small as 10 mm, 2G-HTS undulator, focusing on magnetic performance, mechanical force minimization, and quench protection. A force-balanced coil pack design is introduced to significantly reduce mechanical stresses on the conductors, eliminating the need for heavy support structures. Rapid prototyping techniques such as3D printing is employed to refine the design for scalability and manufacturability. Correction schemes for end-field effects are developed using a combination of 2G-HTS tapes and NbTi conductors to optimize field integrals. Simulation results demonstrated that optimized magnetic performance and enhanced mechanical stability, positioning 2G-HTS undulators as promising candidates for storage ring and free-electron based light sources.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗