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Grooved substrate exposes back surface of photovoltaic cells, allowing dopant diffusion into surface and electrical contact. When substrate is coated successively with carbon and molten silicon, polycrystalline-silicon bridges form over grooves, but leave channels open. Best adhesion results when substrate grooves run perpendicular to direction of liquid-silicon layer and are closely spaced.
Understanding the spatial heterogeneity beneath Thwaites Glacier, West Antarctica, is vital to projecting its impact on future sea levels. Radar-echo sounding (RES) is commonly used to infer subglacial conditions, but these data can be challenging to interpret. We assess basal heterogeneity across Thwaites Glacier by comparing RES returns to a radar backscattering simulator for over 400 km of RES data. The modeled variations in bed returned power exhibited a strong correlation with actual RES data in 40% of our simulated flight segments, which we consider evidence for a relatively homogeneous glacier bed. Other sites (40%) demonstrated improved fit quality when hydrology or substrate transitions were introduced in the bed material model. The remaining simulated segments (20%) were diagnosed as having more complex basal heterogeneity. The spatial distribution of complex heterogeneity appears to coincide with asymmetric patterns in the RES specularity content, which has been interpreted in previous studies as a signature for channelized hydrology. Conversely, the homogeneous substrate locations coincide with areas of fast-moving ice in western Thwaites. Our simulation method can isolate power variations induced by material heterogeneity vs topography, which is an important limitation of existing RES analysis methods.
A charge-coupled device (CCD) image sensor includes in a substrate of single crystalline silicon of one conductivity type an array of a plurality of spaced, parallel channel regions of the opposite conductivity type extending along one major surface of the substrate. A plurality of parallel conductive gates are over the one major surface of the substrate and extend transversely across the channel regions. The outermost channel regions of the array are positioned adjacent edges of the substrate so that a plurality of the image sensors can be mounted in edge-to-edge relation with the channel regions of the various sensors being close together. The sensor includes passivating means between each outermost channel region and the adjacent edge to prevent charge carriers generated by the edge from being injected into the outermost channel region. The passivating means includes a highly conductive drain region of a conductivity type opposite to that of the substrate within the substrate and extending along the one major surface between the outermost channel region and the edge. Also, a highly conductive region of the same conductivity type as the substrate is on the substrate and extends along the one major surface directly at the edge.
A method, now undergoing development, of forming nanochannels in planar substrates is intended to enable the fabrication of advanced fluidic devices that could be integrated with complementary metal oxide semiconductor (CMOS) electronic circuits. Such integral combinations of fluidic and electronic components ("laboratory-on-a-chip" devices) could be used, for example, to detect individual molecules of deoxyribonucleic acid (DNA) and proteins. The width of a channel in such a device would be chosen so that molecules of the species of interest would move along the channel in single file. In this method, the fabrication of channels includes the use of such CMOS-compatible processes as chemical-mechanical polishing and oxide deposition. The layout of the channels in the substrate plane is determined by a single photolithographic process, but it is not a nanoscale lithographic process, and this process is not relied upon to define the thickness and width of the channels. Stating it from a slightly different perspective, unlike in the prior fabrication of electronic and fluidic devices involving the use of lithography to define microscale features, this process does not include the use of lithography to define nanoscale features. It is this aspect of the method that enables simplification of the process and, hence, a decrease in cost.
Mode behavior of nonplanar double-heterojunction (DH) and large-optical-cavity (LOC) lasers is investigated using the effective index method to model the lateral field distribution. The thickness variations of various layers for the devices discussed are correlated with the growth characteristics of liquid-phase epitaxy over topographical features (channels, mesas) etched into the substrate. The effective dielectric profiles of constricted double-heterojunction (CDH)-LOC lasers show a strong influence on transverse mode operation: the fundamental transverse mode (i.e., in the plane perpendicular to the junction) may be laterally index-guided, while the first (high)-order mode is laterally index-antiguided. The analytical model developed uses a smoothly varying hyperbolic cosine distribution to characterize lateral index variations. The waveguide model is applied to several lasers to illustrate conditions necessary to convert leaky modes to trapped ones via the active-region gain distribution. Theoretical radiation patterns are calculated using model parameters, and matched to an experimental far-field pattern.
Finite element techniques have been used to investigate the far-field deformation and stress changes due to asthenospheric viscoelastic relaxation following a dip-slip earthquake. The diffusion of extensional stress toward the subduction zone following a thrust earthquake on land is qualitatively consistent with the modified Elsasser model as proposed by Rydelek and Sacks (1988, 1990) to explain the coupled occurrence of land and sea earthquakes near Japan. However, the magnitude of the diffusing tensional signal is significantly smaller. The nominal model consists of a partially faulted elastic lithosphere overlying a viscoelastic substrate. Other models consider thin channel flow, rupturing of the entire elastic lithosphere, and changes in the depth of faulting. While some of these changes have significant impact on the magnitude and spatial features of the stress and deformation field, the far-field stress remains small. Numerical experiments demonstrate that the assumptions of the modified Elsasser model accentuate uniaxial deformation. When these assumptions are replicated in the finite element calculations, reasonable agreement between the models is achieved.
The International Space Station (ISS) Trace Contaminant Control Subassembly (TCCS) design is based upon proven, highly reliable technology. However, because its core unit operations rely upon expendable activated charcoal and an indirectly heated high temperature catalyst, annual logistics mass, crew time, and power consumption requirements are significant. To address this situation, a unique catalytic reactor design has been developed which is suitable for retrofit into the TCCS's high temperature catalytic oxidizer (HTCO) assembly. The unique design, which employs a metallic, ultra-short channel length monolith (USCM) catalyst substrate, was tested in a flight-like TCCS HTCO assembly to investigate its performance characteristics. Test results indicate that retrofitting the TCCS with a USCM-based catalytic reactor is feasible and that it may provide significant reductions in logistics mass, crew time, and power consumption. Savings indicated by test results are up to 81% for annual logistics, 56% for crew time, and 77% for startup transient duration. In addition, its demonstrated ability to operate in a power saving mode provides up to a 43% savings in average power consumption. A summary of the USCM demonstration test objectives, approach, results, and specific benefits to the TCCS's process economics are presented,
The session "Venus" included the following reports:Preliminary Study of Laser-induced Breakdown Spectroscopy (LIBS) for a Venus Mission; Venus Surface Investigation Using VIRTIS Onboard the ESA/Venus Express Mission; Use of Magellan Images for Venus Landing Safety Assessment; Volatile Element Geochemistry in the Lower Atmosphere of Venus; Resurfacing Styles and Rates on Venus: Assessment of 18 Venusian Quadrangles; Stereo Imaging of Impact Craters in the Beta-Atla-Themis (BAT) Region, Venus; Depths of Extended Crater-related Deposits on Venus ; Potential Pyroclastic Deposit in the Nemesis Tessera (V14) Quadrangle of Venus; Relationship Between Coronae, Regional Plains and Rift Zones on Venus, Preliminary Results; Coronae of Parga Chasma, Venus; The Evolution of Four Volcano/Corona Hybrids on Venus; Calderas on Venus and Earth: Comparison and Models of Formation; Venus Festoon Deposits: Analysis of Characteristics and Modes of Emplacement; Topographic and Structural Analysis of Devana Chasma, Venus: A Propagating Rift System; Anomalous Radial Structures at Irnini Mons, Venus: A Parametric Study of Stresses on a Pressurized Hole; Analysis of Gravity and Topography Signals in Atalanta-Vinmara and Lavinia Planitiae Canali are Lava, Not River, Channels; and Formation of Venusian Channels in a Shield Paint Substrate.
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes depositing a first conductive medium within a plurality of channels of a base to form a plurality of first conductors; depositing within the plurality of channels a plurality of semiconductor substrate particles suspended in a carrier medium; forming an ohmic contact between each semiconductor substrate particle and a first conductor; converting the semiconductor substrate particles into a plurality of semiconductor diodes; depositing a second conductive medium to form a plurality of second conductors coupled to the plurality of semiconductor diodes; and depositing or attaching a plurality of lenses suspended in a first polymer over the plurality of diodes. In various embodiments, the depositing, forming, coupling and converting steps are performed by or through a printing process.
A life support system for providing a growth medium for at least one photosynthetic micro-organism and for converting CO2 to O2, with reduced water use that is as low as about 4 percent of the corresponding amount of water normally required for conventional micro-organism growth. The system includes a liquid transport capillary channel, a mixed culture photosynthetic biofilm and a liquid transport substrate that is positioned between and contiguous to the capillary channel and the biofilm, where the liquid transport rate is adjustable by adjustment of the local humidity. Approximately uniform radiation is received by the biofilm and contributes to microorganism growth.
Pneumatically actuated miniature peristaltic vacuum pumps have been proposed for incorporation into advanced miniature versions of scientific instruments that depend on vacuum for proper operation. These pumps are expected to be capable of reaching vacuum-side pressures in the torr to millitorr range (from .133 down to .0.13 Pa). Vacuum pumps that operate in this range are often denoted roughing pumps. In comparison with previously available roughing pumps, these pumps are expected to be an order of magnitude less massive and less power-hungry. In addition, they would be extremely robust, and would operate with little or no maintenance and without need for oil or other lubricants. Portable mass spectrometers are typical examples of instruments that could incorporate the proposed pumps. In addition, the proposed pumps could be used as roughing pumps in general laboratory applications in which low pumping rates could be tolerated. The proposed pumps could be designed and fabricated in conventionally machined and micromachined versions. A typical micromachined version (see figure) would include a rigid glass, metal, or plastic substrate and two layers of silicone rubber. The bottom silicone layer would contain shallow pump channels covered by silicone arches that could be pushed down pneumatically to block the channels. The bottom silicone layer would be covered with a thin layer of material with very low gas permeability, and would be bonded to the substrate everywhere except in the channel areas. The top silicone layer would be attached to the bottom silicone layer and would contain pneumatic- actuation channels that would lie crosswise to the pump channels. This version is said to be micromachined because the two silicone layers containing the channels would be fabricated by casting silicone rubber on micromachined silicon molds. The pneumatic-actuation channels would be alternately connected to a compressed gas and (depending on pump design) either to atmospheric pressure or to a partial vacuum source. The design would be such that the higher pneumatic pressure would be sufficient to push the silicone arches down onto the substrates, blocking the channels. Thus, by connecting pneumatic- actuation channels to the two pneumatic sources in spatial and temporal alternation, waves of opening and closing, equivalent to peristalsis, could be made to move along the pump channels. A pump according to this concept could be manufactured inexpensively. Pneumatic sources (compressors and partial vacuum sources) similar those needed for actuation are commercially available; they typically have masses of .100 g and power demands of the order of several W. In a design-optimization effort, it should be possible to reduce masses and power demands below even these low levels and to integrate pneumatic sources along with the proposed pumps into miniature units with overall dimensions of no more than a few centimeters per side.
This innovation is a compact, superconducting, channelizing bandpass filter on a single-crystal (0.45 m thick) silicon substrate, which operates from 300 to 600 GHz. This device consists of four channels with center frequencies of 310, 380, 460, and 550 GHz, with approximately 50-GHz bandwidth per channel. The filter concept is inspired by the mammalian cochlea, which is a channelizing filter that covers three decades of bandwidth and 3,000 channels in a very small physical space. By using a simplified physical cochlear model, and its electrical analog of a channelizing filter covering multiple octaves bandwidth, a large number of output channels with high inter-channel isolation and high-order upper stopband response can be designed. A channelizing filter is a critical component used in spectrometer instruments that measure the intensity of light at various frequencies. This embodiment was designed for MicroSpec in order to increase the resolution of the instrument (with four channels, the resolution will be increased by a factor of four). MicroSpec is a revolutionary wafer-scale spectrometer that is intended for the SPICA (Space Infrared Telescope for Cosmology and Astrophysics) Mission. In addition to being a vital component of MicroSpec, the channelizing filter itself is a low-resolution spectrometer when integrated with only an antenna at its input, and a detector at each channel s output. During the design process for this filter, the available characteristic impedances, possible lumped element ranges, and fabrication tolerances were identified for design on a very thin silicon substrate. Iterations between full-wave and lumped-element circuit simulations were performed. Each channel s circuit was designed based on the availability of characteristic impedances and lumped element ranges. This design was based on a tabular type bandpass filter with no spurious harmonic response. Extensive electromagnetic modeling for each channel was performed. Four channels, with 50-GHz bandwidth, were designed, each using multiple transmission line media such as microstrip, coplanar waveguide, and quasi-lumped components on 0.45- m thick silicon. In the design process, modeling issues had to be overcome. Due to the extremely high frequencies, very thin Si substrate, and the superconducting metal layers, most commercially available software fails in various ways. These issues were mitigated by using alternative software that was capable of handling them at the expense of greater simulation time. The design of on-chip components for the filter characterization, such as a broadband antenna, Wilkinson power dividers, attenuators, detectors, and transitions has been completed.
The performance of experimental two phase, charge-coupled shift registers constructed using polysilicon gates overlapped by aluminum gates was studied. Shift registers with 64, 128, and 500 stages were built and operated. Devices were operated at the maximum clock frequency of 20 MHz. Loss per transfer of less than .0001 was demonstrated for fat zero operation. The effect upon transfer efficiency of various structural and materials parameters was investigated including substrate orientation, resistivity, and conductivity type; channel width and channel length; and method of channel confinement. Operation of the devices with and without fat zero was studied as well as operation in the complete charge transfer mode and the bias charge, or bucket brigade mode.
Micromachined pumps including a channel formed between a first membrane and a substrate or between first and second flexible membranes. A series of electrically conductive strips is applied to a surface of the substrate or one of the membranes. Application of a sequential voltage to the series of strips causes a region of closure to progress down the channel to achieve a pumping action.
The following accomplishments were made towards the goal of an optimized whiskerless diode chip for submillimeter wavelength applications. (1) Surface channel whiskerless diode structure was developed which offers excellent DC and RF characteristics, reduced shunt capacitance and simplified fabrication compared to mesa and proton isolated structures. (2) Reliable fabrication technology was developed for the surface channel structure. The new anode plating technology is a major improvement. (3) DC and RF characterization of the surface channel diode was compared with whisker contacted diodes. This data indicates electrical performance as good as the best reported for similar whisker contacted devices. (4) Additional batches of surface channel diodes were fabricated with excellent I-V and reduced shunt capacitance. (5) Large scale capacitance modelinng was done for the planar diode structure. This work revealed the importance of removing the substrate gallium arsenide for absolute minimum pad capacitance. (6) A surface channel diode was developed on quartz substrate and this substrate was completely removed after diode mounting for minimum parasitic capacitance. This work continues with the goal of producing excellent quality submillimeter wavelength planar diodes which satisfy the requirements of easy handling and robustness. These devices will allow the routine implementation of Schottky receivers into space-based applications at frequencies as high as 1 THz, and, in the future, beyond.
A hybrid detector or imager includes two substrates fabricated under incompatible processes. An array of detectors, such as charged-coupled devices, are formed on the first substrate using a CCD fabrication process, such as a buried channel or peristaltic process. One or more charge-converting amplifiers are formed on a second substrate using a CMOS fabrication process. The two substrates are then bonded together to form a hybrid detector.