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At least 55 records · Page 3
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

A Double Sided LGAD-Based Detector Providing Timing, Position, and Track Angle Information

We describe a detector concept which combines small pixels enabled by 3D sensor-electronics integration with gain produced by a Low Gain Avalanche Diode (LGAD) layer. The detector is double-sided, with electrons collected by the cathode, which provides timing information, and an anode with small pixels to provide position and angle information. The cathode can be coarse grained, providing timing with fewer fast amplifiers to limit power consumption. The anode layer benefits from the gain of the LGAD, with larger signals that also limit the power needed. Position can be reconstructed by measuring the pattern of total charge deposited on the anode. Angle and depth of charge deposit can be measured by the shapes of the anode pulses. We describe a possible assembly technology based on 3D integration.

3D Integration↗
DOE OSTI2026

Two 28-nm front-end ASICs for ultra-fine spatial resolution and precision timing to be 3D integrated with 12 LGADs

The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (about 10 µm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely pixelated LGAD sensors to achieve the performance and scalability required for large-area, high-rate applications. High-granularity, precision-timing detectors are essential for scientific advances in HEP, NP, BES, and FES, but widespread adoption is limited by the cost and complexity of 3D integration. To close this gap, the collaboration is developing LGAD sensors compatible with 12-inch commercial CMOS processes, enabling cost-effective integration with high-performance ASICs under development. We present two 28 nm CMOS ASIC prototypes, including a low-jitter front end, and in-pixel TDC demonstrating sub-10 ps timing resolution. These advances represent a critical step toward scalable, high-resolution radiation imaging systems for future scientific instrumentation.

England, Troy [Fermilab] (ORCID:0000000154405255)↗
DOE OSTI2026

Two 28-nm front-end ASICs for ultra-fine spatial resolution and precision timing to be 3D integrated with 12 LGADs

The 3DIntSenS Collaboration—a joint effort between SLAC, Fermilab, and LLNL—is developing enabling technologies for next-generation radiation imaging detectors that combine ultra-fine spatial resolution (about 10 µm) with precision timing (<20 ps), while maintaining low power <1 W/cm2 and high data throughput. The approach leverages 3D integration between advanced CMOS readout ASICs and finely pixelated LGAD sensors to achieve the performance and scalability required for large-area, high-rate applications. High-granularity, precision-timing detectors are essential for scientific advances in HEP, NP, BES, and FES, but widespread adoption is limited by the cost and complexity of 3D integration. To close this gap, the collaboration is developing LGAD sensors compatible with 12-inch commercial CMOS processes, enabling cost-effective integration with high-performance ASICs under development. We present two 28 nm CMOS ASIC prototypes, including a low-jitter front end, and in-pixel TDC demonstrating sub-10 ps timing resolution. These advances represent a critical step toward scalable, high-resolution radiation imaging systems for future scientific instrumentation.

England, Troy [Fermilab] (ORCID:0000000154405255)↗
DOE OSTI2022

Characterization of BNL and HPK AC-LGAD sensors with a 120 GeV proton beam

We present measurements of AC-LGADs performed at the Fermilab's test beam facility using 120 GeV protons. We studied the performance of various strip and pad AC-LGAD sensors that were produced by BNL and HPK. The measurements are performed with our upgraded test beam setup that utilizes a high precision telescope tracker, and a simultaneous readout of up to 7 channels per sensor, which allows detailed studies of signal sharing characteristics. These measurements allow us to assess the differences in designs between different manufacturers, and optimize them based on experimental performance. We then study several reconstruction algorithms to optimize position and time resolutions that utilize the signal sharing properties of each sensor. We present a world's first demonstration of silicon sensors in a test beam that simultaneously achieve better than 6-10 micron position and 30 ps time resolution. This represents a substantial improvement to the spatial resolution than would be obtained with binary readout of sensors with similar pitch.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2020

Radiation campaign of HPK prototype LGAD sensors for the High-Granularity Timing Detector (HGTD)

In this work, we report on the results of a radiation campaign with neutrons and protons of Low Gain Avalanche Detectors (LGAD) produced by Hamamatsu (HPK) as prototypes for the High-Granularity Timing Detector (HGTD) in ATLAS. Sensors with an active thickness of were irradiated in steps of roughly 2 up to a fluence of 3. As a function of the fluence, the collected charge and time resolution of the irradiated sensors will be reported for operation at °C.

47 OTHER INSTRUMENTATION↗
DOE OSTI2023

First survey of centimeter-scale AC-LGAD strip sensors with a 120 GeV proton beam

We present the first beam test results with centimeter-scale AC-LGAD strip sensors, using the Fermilab Test Beam Facility and sensors manufactured by the Brookhaven National Laboratory. Sensors of this type are envisioned for applications that require large-area precision 4D tracking coverage with economical channel counts, including timing layers for the Electron Ion Collider (EIC), and space-based particle experiments. A survey of sensor designs is presented, with the aim of optimizing the electrode geometry for spatial resolution and timing performance. Several design considerations are discussed towards maintaining desirable signal characteristics with increasingly larger electrodes. The resolutions obtained with several prototypes are presented, reaching simultaneous 18 μm and 32 ps resolutions from strips of 1 cm length and 500 μm pitch. With only slight modifications, these sensors would be ideal candidates for a 4D timing layer at the EIC.

47 OTHER INSTRUMENTATION↗
DOE OSTI2022

First survey of centimeter-scale AC-LGAD strip sensors with a 120 GeV proton beam

We present the first beam test results with centimeter-scale AC-LGAD strip sensors, using the Fermilab Test Beam Facility and sensors manufactured by the Brookhaven National Laboratory. Sensors of this type are envisioned for applications that require large-area precision 4D tracking coverage with economical channel counts, including timing layers for the Electron Ion Collider (EIC), and space-based particle experiments. A survey of sensor designs is presented, with the aim of optimizing the electrode geometry for spatial resolution and timing performance. Several design considerations are discussed towards maintaining desirable signal characteristics with increasingly larger electrodes. The resolutions obtained with several prototypes are presented, reaching simultaneous 18 micron and 32 ps resolutions from strips of 1 cm length and 500 micron pitch. With only slight modifications, these sensors would be ideal candidates for a 4D timing layer at the EIC.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2021

LGAD Single Event Burnout Studies

We report on simulation of single event burnout of low gain avalanche diodes during high voltage operation after irradiation. A model is described which can be used to estimate energy deposition needed for single event burnout and the dependence of burnout on thermal conductivity and thermal resistance to heat sinks.

74 ATOMIC AND MOLECULAR PHYSICS↗
DOE OSTI2022

LGAD-in-CMOS Design Studies

We describe a process flow for a CMOS sensor with intrinsic gain. The design is based on a base wafer which is prepared with closely spaced buried n and p doping layers that form an amplifying high field gain region when the device is biased. A deep n-well forms the collecting electrode. The buried n layer serves to moderate the internal field so that the CMOS transistors within the n-well remain within their operating region.

43 PARTICLE ACCELERATORS↗
DOE OSTI2024

AC-LGADs for 4D Tracking

Explore the source record for details and available documents.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2019

Test Beam Characterization of Hamamatsu LGADs for the CMS Endcap Timing Layer

•HL-LHC will provide unprecedented instantaneous and integrated luminosity •Higher instantaneous luminosity, higher levels of overlapping events (pile-up) and higher radiation level will create a harsh detector environment •Maintaining high efficiencies for particle reconstruction and primary vertex identification will be main challenges at CMS •CMS detector will be upgraded with a timing layer, MTD (MIP timing detector) capable of detecting minimum ionizing particles (MIPs) with a timing resolution of 40 ps or better

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗