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At least 433 records · Page 24

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NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherends

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

X-ray computed tomography↗

NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

bondline thickness↗

DOE OSTI2023

When Is a Bond Broken? The Polarizability Perspective.

Abstract The question of when a chemical bond can be said to be broken is of fundamental chemical interest but has not been widely studied. Herein we propose that the maxima of static polarizability along bond dissociation coordinates naturally define cutoff points for bond rupture, as they represent the onset of localization of shared electron density into constituent fragments. Examples of computed polarizability maxima over the course of bond cleavage in main‐group and transition metal compounds are provided, across covalent, dative and charge‐shift bonds. The behavior along reaction paths is also considered. Overall, the static polarizability is found to be a sensitive reporter of electronic structure reorganization associated with bond stretching, and thus can serve as a metric for describing bond cleavage (or diagnose the absence of a chemical bond).

Hait, Diptarka↗

DOE OSTI2023

When Is a Bond Broken? The Polarizability Perspective.

Hait, Diptarka↗

DOE OSTI2018

Microstructural and Mechanical Properties of Hot Roll Bonded Titanium Alloy/Low Carbon Steel Plate

In this paper, a titanium alloy and low carbon steel were bonded via hot rolling in a vacuum, and the effect of roll bonding temperature and reduction ratio on the microstructural and mechanical properties of the plate was studied. When the bonding temperature was between 850 and 1050 °C, the shear strength of the interface increased with an increasing reduction ratio from 18 to 70%. At a bonding temperature of 950 °C and at a rolling reduction ratio of 70%, the best bonding strength was obtained, and a shear fracture occurred on the low carbon steel matrix. At 1050 °C, brittle compounds, i.e., TiC, FeTi, and Fe{sub 2}Ti, formed at the interface, which decreased the bonding strength. The large reduction ratio can break up compounds at the interface and extrude fresh metal for bonding, thereby increasing the bonding strength.

36 MATERIALS SCIENCE↗

DOE OSTI2024

Corrosion Behavior of a Reactive Bond Between Stainless Steel and a Cast AlCeMg Alloy

Corrosion is a longstanding issue for metal components, especially those used in heat exchanger applications. Al–Ce–Mg alloys may provide a potential solution to this problem due to their good mechanical properties and potential reaction bonding with other metals. The reaction bonding involves a “reactive” bond that occurs upon casting of Al–Ce–Mg alloy over stainless steel (SS). Here this study examined the corrosion response of Al–2Ce–6Mg (atomic percent)/(SS) reactive bond interfaces after samples were completely submerged in nitric, sulfuric, formic, and mixed acids for 267 h. Scanning electron microscopy revealed that in the as-cut condition, reactive bond formations were seen frequently throughout the length of the casting and maintained a secure bond between the alloy and the SS tubes. Furthermore, the nitric, sulfuric, and the mixed acids did not have a deleterious effect on the reactive bond structure. However, formic acid did produce changes in both the microstructural appearance and the elemental profile across the bond due to the formation of corrosion reaction products on the acid-exposed surface.

36 MATERIALS SCIENCE↗

DOE OSTI2026

Aluminum bonded SmCo5 magnets with enhanced mechanical strength

Despite their versatility and easy manufacturability, polymer-bonded magnets find limited application due to their limited mechanical properties and temperature resistance. In this study, we developed mechanically robust, aluminum-bonded SmCo5 magnets by utilizing a low-temperature, shear-assisted friction consolidation technique. Bonded magnets with varying magnetic phase content were fabricated at processing temperature of 500°C, and their microstructures, magnetic, mechanical, and electrical properties were systematically investigated. The resulting bonded-magnets showed effective consolidation with nanocrystalline microstructures. Magnetic properties were found to be tunable through variations in binder phase content, with coercivity reaching values up to 15.3 kOe (1217.5 kA/m) and maximum magnetic energy product up to 3.6 MGOe (28.7 kJ/m3), which are comparable to other bonded magnets. Electrical resistivities were lower than the polymer-bonded magnets, but comparable to the sintered ones. We observed an average flexural strength of 223 MPa for 60 vol.% SmCo5/Al sample, which is nearly two times higher than the reported values for sintered and bonded Sm-Co magnets. Our research demonstrated an effective approach to fabricate metal-bonded permanent magnets with superior magnetic and mechanical properties potentially applicable for high temperature applications.

Poudel Chhetri, Tej Bahadur↗

DOE OSTI2020

Selective activation of methane C–H bond in the presence of methanol

Direct methane to methanol (MTM) conversion over heterogeneous catalysts is a promising route for valorization of methane. The methane C-H bond activation is considered as the key step of the MTM and is the focus of considerable research activity. However, the formed methanol typically suffers from overoxidation largely due to the cleavage of a methanol C-H bond, whose bond dissociation energy is ca. 0.5 eV lower than that of the methane C-H bond, which usually translates to a transition state energy of the methanol C-H bond cleavage that is ca. 0.55 eV lower than that of methane whenever the reactions proceed through a radical mechanism. Furthermore, we propose a general approach for decreasing the transition state energy difference between the CH 4 and CH 3 OH C-H bond dissociation. When a metal-oxide supported cationic transition metal atom and a neighboring oxygen on the oxide surface serve as the active site, the transition state energy difference through a surface-stabilized pathway can be noticeably narrowed as compared with that of a radical pathway. For Ir, Pt and Rh-doped anatase TiO 2 (101), the CH 4 C-H bond activation can be preferred over that of CH 3 OH at significant methanol mole fraction. Also, for PdAu alloys containing adsorbed oxygen and positively charged Pd, calculations suggest in agreement with recent experiments (Science 367 (6474), 193-197) that the CH 4 C-H bond can be selectively activated in the presence of CH 3 OH.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2018

Interfacial bonding mechanism and mechanical properties of micro friction stir blind riveting for multiple Cu/Al ultra-thin layers

Highlights: • Micro Friction Stir Blind Riveting is developed for joining multilayer ultra-thin dissimilar materials. • Interfacial bonding mechanism for different interfaces is identified. • Proposed technique offers better mechanical performance than conventional micro riveting process. • The relationship between each interfacial bonding mechanism and improved mechanical property is elucidated. - Abstract: In this research, bonding mechanisms and mechanical properties were investigated for a newly developed multilayer dissimilar material joining technique, micro friction stir blind riveting (viz. μFSBR), where the multilayer micro joint was made consisting of one Cu layer and three Al layers (each layer having 0.203 mm thickness) connected through Al rivet. Different microscopy techniques were employed (i.e. scanning electron microscopy and transmission electron microscopy) to unearth the bonding mechanisms of the three interfaces (i.e. Al rivet and Cu sheet interface, Cu sheet and Al sheet interface, and Al rivet and Al sheet interface) which revealed intricate yet distinct bonding phenomenon for each interface. A nano-scale diffusion layer in addition to two-way material flow consequential heterogeneous lamellar structures and mechanical interlocking was formed at the Al rivet and Cu sheet interface; Cu particles diffused into a non-uniform thickness thin oxide layer at the Cu sheet and Al sheet interface; and Al sheet experienced grain refinement near the interface close to Al rivet with a nano-scale gap. These observations revealed that both mechanical and metallurgical bonding occurred simultaneously in μFSBR. The formation of different bonding mechanisms resulted in superior bonding strength and absorbed energy compared to conventional micro blind riveting joints, which was further confirmed through layer by layer tensile tests.

36 MATERIALS SCIENCE↗

DOE OSTI2025

Effects of co-adsorbed water on different bond cleavages involved in acetic acid decomposition on Pt (111)

Acetic acid decomposition on Pt (111) in the presence of co-adsorbed water is a good model system for oxygenate decomposition on Pt (111) in aqueous phase, with application in hydrogen production and biomass conversion. Here, in this study, we present a density functional theory (DFT) theory calculation of how co-adsorbed water affects different bond cleavages of acetic acid decomposition on Pt (111). The presence of co-adsorbed water generally enhances O$-$H bond cleavage while inhibiting OC$-$O and OC$-$OH bond cleavage. The influence of co-adsorbed water on C$-$H bond cleavage varies the most and depends on the nature of the transition state and how co-adsorbed water stabilizes the initial and final state. Although these trends are useful as general guidance, they are not sufficient to predict the effect on a complex reaction network such as acetic acid decomposition on Pt (111) which has several parallel reaction paths with similar energies. In the absence of co-adsorbed water, the two lowest energy pathways are decarboxylation (DCX) and decarbonylation (DCN) pathways through a common CH 2 COO intermediate, in which the DCX pathway (C$-$H bond cleavage of CH 2 COO) is more favorable than DCN pathway (OC$-$O bond cleavage of CH 2 COO). In the presence of co-adsorbed water, the energy difference between Csingle bondH bond cleavage and OC$-$O bond cleavage of CH 2 COO increases, suggesting an increase in the favorability of acetic acid decarboxylation (formation of carbon dioxide) over acetic acid decarbonylation (formation of carbon monoxide) on Pt (111).

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2025

Unveiling Unusual Reactivity of SO 2 and Unusual Type of S–X Long Bonds

A new reactivity of SO 2 to form unusual stable M−X−SO 2 (X = F, Cl, H) complexes is unveiled in this study. Moreover, a new type of S−X long bonds, which are significantly longer than traditional S−X covalent bonds, has been discovered. The P,N-ligated Ni−F complex model 1A can bind a SO 2 molecule through the new F−S long bond (2.207 Å), and a stable Ni−F−SO 2 complex 1B is generated, being exergonic by 2.2 kcal/mol. According to natural localized molecular orbital analysis, the new S−F long bond has a unique p(F) → π*(O=S=O) bonding interaction, which is shown to arise from the long S−F length. In comparison, the strength of the new F−S long bond (−2.2 kcal/mol) is found to be significantly stronger than common noncovalent interactions such as the hydrogen and halogen bond. The substituent modulations suggest that the electron-donating groups can increase the strength of new F−S bonds and enhance binding free energies ΔG bind . The scope of possible M−X complexes was explored, and various metals and X (F, Cl, and H) ligands were found to form stable M−X−SO 2 complexes. Specifically, the anionic M−X complexes display much higher ΔG bind values, ranging from −8 to −10 kcal/mol. The study paves the way for a green, recyclable, and adjustable SO 2 absorption method.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2021

Altering Linear Scaling Relationships on Metal Catalysts via Ligand–Adsorbate Hydrogen Bonding

Linear scaling relationships for adsorption energies of related molecules provide a simple tool for the prediction of catalytic properties and also reveal inherent constraints in heterogeneous catalyst design. In an effort to predict materials that preferentially stabilize intermediates capable of forming hydrogen bonds (H-bonds) and thus reduce these constraints, scaling relations for thiolate-coated fcc (111) surfaces were developed. Here, we demonstrate how ligand–adsorbate H-bonds lead to the stabilization of certain adsorbates and how this affects the linear scaling of adsorption energies for similarly bound intermediates. For H-bonds that occur remote from the surface, ligand–adsorbate H-bond strength is independent of metal composition and instead depends only on the acidities of the H-bond-forming functional groups. As the distance of H-bond-accepting groups from the surface decreases and interactions with the metal strengthen, the effect of surface composition on H-bond strength increases while additional factors, such as conformational changes and steric hinderance, can offset the stabilizing effect of the ligands. In this work, these competing factors may influence both the slope and y-intercept of adsorption strength scaling. These findings aid the rational design of enhanced catalytic materials by enabling the screening of ligand- or spectator-modified materials that do not conform to the linear scaling relations of bare metal surfaces.

36 MATERIALS SCIENCE↗

DOE OSTI2016

Chemical bond activation observed with an x-ray laser

The concept of bonding and anti-bonding orbitals is fundamental in chemistry. The population of those orbitals and the energetic difference between the two reflect the strength of the bonding interaction. Weakening the bond is expected to reduce this energetic splitting, but the transient character of bond-activation has so far prohibited direct experimental access. Lastly, we apply time-resolved soft X-ray spectroscopy at a free-electron laser to directly observe the decreased bonding–anti-bonding splitting following bond-activation using an ultra short optical laser pulse.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2019

A Simple Bond-Additivity Model Explains Large Decreases in Heats of Adsorption in Solvents Versus Gas Phase: A Case Study with Phenol on Pt(111) in Water

Previously, we reported the low-coverage heat of adsorption of phenol on Pt(111) facets of a Pt wire in aqueous phase to be approximately 21 kJ/mol (relative to aqueous phenol) on the basis of measurements of the adsorption equilibrium constant. This is much smaller than the heat we reported for gas-phase phenol adsorption at this same low coverage on single-crystal Pt(111) under ultrahigh vacuum (200 kJ/mol) on the basis of adsorption calorimetry measurements. Here we quantitatively analyze the individual contributions that give rise to this 179 kJ/mol difference using a simple pairwise bond-additivity model, taking advantage of experimental data from the literature to estimate the bond energies. The dominant contribution to the lowering in heat when phenol is adsorbed in water is the energy cost to break the strong bond of liquid water to Pt(111) (~116 kJ per mole of phenol area). The water–phenol bonding is lost on one face of the phenol, and this costs ~50 kJ/mol, but this is nearly compensated by the new water–water bonding (~53 kJ/mol of phenol area). The results indicate that the intrinsic bond energy between phenol and Pt(111) is not very different in the gas versus the aqueous phase, provided one takes into consideration the expectation that water forces phenol into islands of high local coverage even at low average coverage (for the same reason that phenol has limited solubility in water). Furthermore, this explains the lack of a strong coverage dependence in the heat of adsorption when it is measured in aqueous phase, whereas it decreases by ~57 kJ/mol with coverage when it is measured in gas phase. This bond-additivity analysis presented here can be easily generalized to other adsorbates, surfaces, and solvents. It clarifies why catalysis with molecules such as phenol which have very strong bonding to Pt-group metals can proceed rapidly at room temperature in liquid solvents such as water but would never proceed in the gas phase at room temperature due to irreversible site poisoning.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2022

Hydrogen-Bond-Promoted Planar Conformation, Crystallinity, and Charge Transport in Semiconducting Diazaisoindigo Derivatives

Conformational control of π-conjugated molecules using intramolecular noncovalent bonds represents a promising strategy to tailor the solid-state molecular packing and electronic properties of these materials. Here, we report the design and synthesis of two model compounds featuring intramolecular hydrogen bonds formed between a center diazaisoindigo unit (the acceptor) and flanking indole units (the donor). Computational and experimental investigations show that these hydrogen bonds enthalpically stabilize the coplanar molecular conformation by over 10 kcal/mol. The formation of these hydrogen bonds is also slightly favorable in terms of entropy, ensuring high temperature stability of the planar conformation. In this work, thermal annealing of thin films of these compounds imparts high crystallinity and orientation in the solid state, while the non-hydrogen bond control only gave an amorphous solid. Field-effect transistor devices fabricated from these thin films exhibit hole mobilities up to 0.270 cm 2 V -1 s -1 , in contrast to the lack of measurable charge carrier mobility for the non-hydrogen bond control. This work demonstrates an efficient synthetic strategy to incorporate robust intramolecular hydrogen bonds into conjugated π-systems and elucidates the mechanism on how such hydrogen bonds promote the desired molecular conformation, solid-state packing, and electronic performances of conjugated organic materials.

36 MATERIALS SCIENCE↗

DOE OSTI2023

USc 2 C 2 and USc 2 NC Clusters with U–C Triple Bond Character Stabilized Inside Fullerene Cages

The chemistry of f-block metal–carbon multiple bonds is underdeveloped compared to well-established carbene complexes of the d-block transition metals. Herein, we report two new actinide-rare earth mixed metal carbides and nitrogen carbide cluster fullerenes, USc 2 C 2 @D 5h (6)-C 80 and USc 2 NC@D 5h (6)-C 80 , which contain U–C bonds with triple bond character and were successfully synthesized and characterized by mass spectrometry, UV–vis–NIR spectroscopy, Fourier transform infrared spectroscopy, single crystal X-ray diffraction, and DFT calculations. Crystallographic studies show that the two previously unreported clusters, USc 2 C 2 and USc 2 NC, are stabilized in the D 5h (6)-C 80 carbon cage and adopt unique trifoliate configurations, in which C 2 /NC units are almost vertically inserted into the plane defined by the U and two Sc atoms. Combined experimental and theoretical studies further reveal the bonding structure of USc 2 C 2 and USc 2 NC, which contain C=U(VI)=C and C=U(V)=N bonding motifs. The electronic structures of the two compounds are determined as U 6+ (Sc 2 ) 6+ (C 4– ) 2 @D 5h (6)-C 80 4– and U 5+ (Sc 2 ) 6+ (N) 3– (C) 4– @D 5h (6)-C 80 4– , respectively. Quantum-chemical studies confirm that the U–C bonds in both molecules show unprecedented multicenter triple-bond character. Furthermore, the discovery of this unique U–C multiple bond offers a deeper understanding of the fundamentals of uranium chemistry.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2015

Significantly shorter Fe–S bond in cytochrome P450-I is consistent with greater reactivity relative to chloroperoxidase

Cytochrome P450 (P450) and chloroperoxidase (CPO) are thiolate-ligated haem proteins that catalyse the activation of carbon hydrogen bonds. The principal intermediate in these reactions is a ferryl radical species called compound I. P450 compound I (P450-I) is significantly more reactive than CPO-I, which only cleaves activated C–H bonds. In this paper, to provide insight into the differing reactivities of these intermediates, we examined CPO-I and P450-I using variable-temperature Mössbauer and X-ray absorption spectroscopies. These measurements indicate that the Fe–S bond is significantly shorter in P450-I than in CPO-I. This difference in Fe–S bond lengths can be understood in terms of variations in the hydrogen-bonding patterns within the ‘cys-pocket’ (a portion of the proximal helix that encircles the thiolate ligand). Weaker hydrogen bonding in P450-I results in a shorter Fe–S bond, which enables greater electron donation from the axial thiolate ligand. Finally, this observation may in part explain P450's greater propensity for C–H bond activation.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

DOE OSTI2020

Clarifying the quantum mechanical origin of the covalent chemical bond

Lowering of the electron kinetic energy (KE) upon initial encounter of radical fragments has long been cited as the primary origin of the covalent chemical bond based on Ruedenberg’s pioneering analysis of H$^{+}_{2}$ and H 2 and presumed generalization to other bonds. This work reports KE changes during the initial encounter corresponding to bond formation for a range of different bonds; the results demand a re-evaluation of the role of the KE. Bonds between heavier elements, such as H 3 C–CH 3 , F–F, H 3 C–OH, H 3 C–SiH 3 , and F–SiF 3 behave in the opposite way to H$^{+}_{2}$ and H 2 , with KE often increasing on bringing radical fragments together (though the total energy change is substantially stabilizing). The origin of this difference is Pauli repulsion between the electrons forming the bond and core electrons. These results highlight the fundamental role of constructive quantum interference (or resonance) as the origin of chemical bonding. Differences between the interfering states distinguish one type of bond from another.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗