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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 397 records · Page 22
All sourcesNASA NTRSDOE OSTI
NASA NTRS1971

Thermal excursion can cause bond problems.

The purpose of this paper is to illustrate the failure mode caused by thermal deformation and how thermal deformation affects bond integrity. Wege bonding in small-signal transistors, microcircuits and LSI circuits is the subject of this work. Repeated switching of the devices between high and low power at a rate that allows thermal expansion and contraction in the interconnecting wire causes the wire to flex at the point of reduced cross-sectional area until finally the wire breaks due to metal fatigue. It was observed that the thermal deformation was related to many factors such as device power dissipation, current density in the wire, wi *e dress and length, thermal time constant and frequency of operation.

Nowakowski, M. F.↗
NASA NTRS1971

Influence of the chemical bond on the K emission spectrum of oxygen and fluorine.

The K emission spectrum of oxygen and fluorine from a number of simple oxides and fluorides is divided into three to six sub-peaks. The spectra of many of these oxides and fluorides resemble one another owing to their basically ionic bonding. Certain sub-peaks, however, are ascribed to cross-over transitions and partially covalent energy levels. The different fluorine spectrum of Teflon is due to the hybrid nature of its covalent bonds.

Koster, A. S.↗
NASA NTRS1972

Stresses near a flat inclusion in bonded dissimilar materials.

The plane elastostatic problem for bonded materials containing a flat inclusion is considered. It is assumed that the inclusion is located parallel to or on the interface and may be rigid or elastic with negligible bending rigidity. The integral equations for various cases are derived and their solutions are described. The stress state around the singular points are investigated and a pair of stress intensity factors similar to that for crack problems are defined. A series of numerical examples for two bonded half planes and for a half plane is worked out. The stress intensity factors are presented as functions of the ratio of the distance from the interface to the length of the inclusion.

Erdogan, F.↗
NASA NTRS1973

Eutectic bonding of sapphire to sapphire

Eutectic mixture of aluminum oxide and zirconium oxide provides new bonding technique for sapphires and rubies. Technique effectively reduces possibility of contamination. Bonding material is aluminum oxide and zirconium oxide mixture that matches coefficient of thermal expansion of sapphire.

Deluca, J. J.↗
NASA NTRS1973

Two bonded half planes with a crack going through the interface

The plane problem of two bonded elastic half planes containing a finite crack perpendicular to and going through the interface is considered. The problem is formulated as a system of singular integral equations with generalized Cauchy kernels. Even though the system has three irregular points, it is shown that the unknown functions are algebraically related at the irregular point on the interface and the integral equations can be solved by a method developed previously. The system of integral equations is shown to yield the same characteristic equation as that for two bonded quarter planes in the general case of the through crack, and the characteristic equation for a crack tip terminating at the interface in the special case. The numerical results given in the paper include the stress intensity factors at the crack tips, the normal and shear components of the stress intensity factors at the singular point on the interface, and the crack surface displacements.

Erdogan, F.↗
NASA NTRS1972

Development of gas-pressure bonding process for air-cooled turbine blades

An investigation was conducted on the application of gas-pressure bonding to the joining of components for convectively cooled turbine blades and vanes. A processing procedure was established for joining the fins of Udimet 700 and TD NiCr sheet metal airfoil shells to cast B1900 struts without the use of internal support tooling. Alternative methods employing support tooling were investigated. Testing procedures were developed and employed to determine shear strengths and internal burst pressures of flat and cylindrical bonded finned shell configurations at room temperature and 1750 F. Strength values were determined parallel and transverse to the cooling fin direction. The effect of thermal cycles from 1750 F to room temperature on strength was also investigated.

Meiners, K. E.↗
NASA NTRS1973

Contact problem for an elastic reinforcement bonded to an elastic plate

The stiffening layer is treated as an elastic membrane and the base plate is assumed to be an elastic continuum. The bonding between the two materials is assumed to be either one of direct adhesion ro through a thin adhesive layer which is treated as a shear spring. The solution for the simple case in which both the stiffener and the base plate are treated as membranes is also given. The contact stress is obtained for a series of numerical examples. In the direct adhesion case the contact stress becomes infinite at the stiffener ends with a typical square root singularity for the continuum model, and behaving as a delta function for the membrane model. In the case of bonding through an adhesive layer the contact stress becomes finite and continuous along the entire contact area.

Erdogan, F.↗
NASA NTRS1972

Lubricating characteristics of polyimide bonded graphite fluoride and polyimide thin films.

A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for the solid lubricant, graphite fluoride (CF sub 1.1) sub n. Also studied were the lubricating properties of PI thin films with no solid lubricant additives. For comparison, similar experiments on PI-bonded MoS2 and burnished films of MoS2 or (CF sub 1.1) sub n were conducted. The best results were obtained with the PI-bonded (CF sub 1.1) sub n films. The polyimide thin films (with no solid lubricant additives) did not lubricate well at 25 C; however, when heated to 100 C, low friction and long wear lives were obtained.

Fusaro, R. L.↗
NASA NTRS1973

Adhesive-bonded scarf and stepped-lap joints

Continuum mechanics solutions are derived for the static load-carrying capacity of scarf and stepped-lap adhesive-bonded joints. The analyses account for adhesive plasticity and adherend stiffness imbalance and thermal mismatch. The scarf joint solutions include a simple algebraic formula which serves as a close lower bound, within a small fraction of a per cent of the true answer for most practical geometries and materials. Digital computer programs were developed and, for the stepped-lap joints, the critical adherend and adhesive stresses are computed for each step. The scarf joint solutions exhibit grossly different behavior from that for double-lap joints for long overlaps inasmuch as that the potential bond shear strength continues to increase with indefinitely long overlaps on the scarf joints. The stepped-lap joint solutions exhibit some characteristics of both the scarf and double-lap joints. The stepped-lap computer program handles arbitrary (different) step lengths and thickness and the solutions obtained have clarified potentially weak design details and the remedies. The program has been used effectively to optimize the joint proportions.

Hart-Smith, L. J.↗
NASA NTRS1972

Spot-weld bonding on the Blackhawk helicopter

The Sikorsky S-67 Blackhawk attack helicopter utilizes spot-weld bonding for stringer to skin attachment on more than 5 per cent of its surface area. It is the first American aircraft to utilize spot weld bonding, although the process has been used for some years in the U.S.S.R. The process consists of applying adhesive on the surfaces to be joined, spot welding through the adhesive, then curing the adhesive.

Salking, M. J.↗
NASA NTRS1972

Bonding of reusable surface insulation with low density silicone foams

The development and evaluation of a reduced density, high reliable foamed bond strain isolation system for attaching reusable surface insulation to the space shuttle structure are reported. Included are data on virgin materials as well as on materials that received 100 cycles of exposure to 650 F for approximately 20 minutes per cycle. Room temperature vulcanizing silicon elastomers meet all the requirments for an adhesive bonding system.

Hiltz, A. A.↗
NASA NTRS1972

Design of bonded joints in composite materials

The primary form of joining high strength advanced composite materials is adhesive bonded joints. The stepped bonded joint is an efficient configuration where the adhesive and composite matrix are co-cured. A design procedure for this type of joint is described along with the analysis technique upon which it is based. A modified elastic analysis accounts for the nonlinear behavior of the adhesive. A computer program with minimum running time and simplified input is utilized for analysis and becomes an efficient link in an iterative design procedure. Comparisons between analytical results and test results are shown. Material properties which are needed for design and methods of measuring these properties are discussed.

Corvelli, N.↗
NASA NTRS1974

Advances in the analysis and design of adhesive-bonded joints in composite aerospace structures

Several aspects of adhesive-bonded joint analysis and design are presented from the reference of size of structure or load intensity. This integrates the individual characterizations of double-lap, single-lap, stepped-lap, tapered-lap and scarf joints. The paper includes an overview of bonded joint selection from the standpoints of design, fabrication, and processing, each bearing in mind the influence of such considerations on the strength of the joint. A case study is presented of the optimization of a specific relatively thick titanium-to-graphite epoxy stepped-lap joint, using the digital computer analysis program A4EG. The factors accounted for are adhesive plasticity, adherend stiffness imbalance, adherend thermal mismatch, and change of material properties within the range of temperature environment and with load direction. The strength increases obtainable by refining the initial design are demonstrated.

Hart-Smith, L. J.↗
NASA NTRS1974

Eutectic bonding of boron-aluminum structural components. II

Eutectic bonding is a diffusion brazing process developed for fabricating boron-aluminum components from composite monolayer. This process relies on the diffusion of a thin surface film of copper into the aluminum matrix to form a liquid phase when heated above the copper-aluminum eutectic temperature of 1018 F. This type of fabrication offers design flexibility in that skin thickness may be varied, the stiffness geometry and orientation can be varied, and local reinforcement can be added. In addition, this type of boron-aluminum structure offers high efficiency. Also, this method of construction can be cost-comparative with complex titanium shapes; simple tooling permits easy layup, bonding is a one-step operation, and little finish machining is required.

Niemann, J. T.↗
NASA NTRS1975

Quality control of microelectronic wire bonds

Report evaluates ultrasonic bonding of small-diameter aluminum wire joined to ceramic substrates metalized with thin-film and thick-film gold. Quick testing technique for nondestructive location of poor wire bonds is also presented.

Thiel, R. A.↗
NASA NTRS1975

Bonded electrodes for use on the external surface of spacecraft

A new bonding process is described which is suitable for applying electrodes to the external surfaces of spacecraft and sounding rockets. A polyimide material containing small, uniform glass spheres provides the necessary insulation and mechanical strength. The bonded electrodes are simple to construct and are shown to have good electrical, vacuum, and thermal properties.

Kendall, B. R. F.↗
NASA NTRS1976

Transistor-to-substrate bond quality

Quantitative measurement of X-ray images of bonded power-transistor chips is accomplished by using light meter, which determines percentage of voids in bond.

Telfer, T. A.↗
NASA NTRS1975

Crack growth in bonded elastic half planes

Two solutions were developed for the two dimensional problem of bonded linearly elastic half-planes. For each solution, numerical results are presented for the stress intensity factors, strain energy release rate, stresses, and displacements. The behavior predicted by the studies was investigated experimentally using polymers for the material pairs. Close agreement was found for the critical stress intensity factor at fracture for the perpendicular crack near the interface. Fracture along the interface proved to be inconclusive due to difficulties in obtaining a brittle bond. Some interesting and predictable behavior regarding the potential for the crack to cross the interface was observed and is discussed.

Goree, J. G.↗