NASA NTRS · 19760000137
Transistor-to-substrate bond quality
Abstract
Quantitative measurement of X-ray images of bonded power-transistor chips is accomplished by using light meter, which determines percentage of voids in bond.
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Telfer, T. A.. 1976-08-01. Transistor-to-substrate bond quality. https://ntrs.nasa.gov/citations/19760000137
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