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NASA Meteoroid Engineering Model (MEM) Version 3

The Meteoroid Engineering Model (MEM) version 3 is NASA’s most current and accurate model of the meteoroid environment. MEM 3 supersedes all previous versions of MEM, including MEM Release 2.0 (MEMR2), MEM Release 1.0c (MEMR1c), and previously internally controlled and released versions of MEMCxP v2.0 and LunarMEM v2.0. Earlier versions of MEM superseded older models of the meteoroid environment such as the Grün model and its derivative, Technical Memo 4527 (hereafter abbreviated as TM 4527) [1]. Prior to the establishment of the NASA Meteoroid Environment Office (MEO), NASA’s meteoroid environment models relied on a simple empirical expression derived from [2], as described in [3] and later in [1]. This expression describes the meteoroid flux incident on a flat plate near 1 au. TM 4527 assumes an isotropic environment, making the orientation of the plate irrelevant [4]. The flux was combined with scale factors to account for the reduction in flux occurring when the Earth shields the spacecraft from a portion of the meteoroid environment and the enhancement in flux due to the focusing effect of Earth’s gravitational field. TM 4527 also introduced a crude, piecewise meteoroid speed distribution with an average velocity of 19 km/s for an orbiting spacecraft based on [5]. Finally, TM 4527 assumed a three-step density distribution in which dust particles smaller than 10−6 g have a density of 2 g/cu cm, micrometeoroids between 10−6 g and 0.01 g have a density of 1 g/cu cm, and meteoroids larger than 0.01 g have a density of 0.5 g/cm3. Thus, the meteoroid model presented in TM 4527 was assembled from multiple independent sources. The model of TM 4527 was also used for years in Space Station risk assessments, and is described in Space Station Specification (SSP) 30425.

Moorhead, A. V.↗

Hardware platforms for MEMS gyroscope tuning based on evolutionary computation using open-loop and closed -loop frequency response

We propose a tuning method for MEMS gyroscopes based on evolutionary computation to efficiently increase the sensitivity of MEMS gyroscopes through tuning. The tuning method was tested for the second generation JPL/Boeing Post-resonator MEMS gyroscope using the measurement of the frequency response of the MEMS device in open-loop operation. We also report on the development of a hardware platform for integrated tuning and closed loop operation of MEMS gyroscopes. The control of this device is implemented through a digital design on a Field Programmable Gate Array (FPGA). The hardware platform easily transitions to an embedded solution that allows for the miniaturization of the system to a single chip.

evolvable hardware↗

MEMS in Space Systems

Micro-electro-mechanical systems (MEMS) provide an emerging technology that has the potential for revolutionizing the way space systems are designed, assembled, and tested. The high launch costs of current space systems are a major determining factor in the amount of functionality that can be integrated in a typical space system. MEMS devices have the ability to increase the functionality of selected satellite subsystems while simultaneously decreasing spacecraft weight. The Air Force Phillips Laboratory (PL) is supporting the development of a variety of MEMS related technologies as one of several methods to reduce the weight of space systems and increase their performance. MEMS research is a natural extension of PL research objectives in micro-electronics and advanced packaging. Examples of applications that are under research include on-chip micro-coolers, micro-gyroscopes, vibration sensors, and three-dimensional packaging technologies to integrate electronics with MEMS devices. The first on-orbit space flight demonstration of these and other technologies is scheduled for next year.

Lyke, J. C.↗

MEMS Spaceborne Testbed

Micro-electro-mechanical-systems (MEMS) technology can significantly reduce the cost to design, launch and operate space systems. MEMS technology offers low cost, small light weight and reliable devices which can significantly reduce the size, weight and cost of spacecraft while increasing their reliability through durability and redundancy. A standard spaceborne interface/cabinet that is readily available for experiments for inexpensive testing of MEMS devices in space is discussed. The MEMS testbed will provide fixtures for holding MEMS devices, ambient environment monitoring, an assortment of available operating voltages, RF and low frequency signal inputs, sources of various gases and pressure monitors, a command and control interface computer, and a data interface which will record or transmit the data and performance parameters of these small systems.

Holderman, Mark↗

MEMS Louvers for Thermal Control

Mechanical louvers have frequently been used for spacecraft and instrument thermal control purposes. These devices typically consist of parallel or radial vanes, which can be opened or closed to vary the effective emissivity of the underlying surface. This project demonstrates the feasibility of using Micro-Electromechanical Systems (MEMS) technology to miniaturize louvers for such purposes. This concept offers the possibility of substituting the smaller, lighter weight, more rugged, and less costly MEMS devices for such mechanical louvers. In effect, a smart skin that self adjusts in response to environmental influences could be developed composed of arrays of thousands of miniaturized louvers. Several orders of magnitude size, weight, and volume decreases are potentially achieved using micro-electromechanical techniques. The use of this technology offers substantial benefits in spacecraft/instrument design, integration and testing, and flight operations. It will be particularly beneficial for the emerging smaller spacecraft and instruments of the future. In addition, this MEMS thermal louver technology can form the basis for related spacecraft instrument applications. The specific goal of this effort was to develop a preliminary MEMS device capable of modulating the effective emissivity of radiators on spacecraft. The concept pursued uses hinged panels, or louvers, in a manner such that heat emitted from the radiators is a function of louver angle. An electrostatic comb drive or other such actuator can control the louver position. The initial design calls for the louvers to be gold coated while the underlying surface is of high emissivity. Since, the base MEMS material, silicon, is transparent in the InfraRed (IR) spectrum, the device has a minimum emissivity when closed and a maximum emissivity when open. An initial set of polysilicon louver devices was designed at the Johns Hopkins Applied Physics Laboratory in conjunction with the Thermal Engineering Branch at NASA's Goddard Space Flight Center.

Champion, J. L.↗

Validation of Landsat-7 ETM+ MEM Thermal Improvement in Thermal Vacuum Tests and in Flight Due to Lower Louver Set Points

The Enhanced Thematic Mapper Plus (ETM+) Main Electronics Module (MEM) power supply heat sink temperature is critical to the Landsat-7 mission. It is strongly dependent on the thermal louver design. A lower power supply heat sink temperature increases the reliability of the MEM, and reduces the risk of over heating and thermal shut-down. After the power supply failures in ETM+ instrument thermal vacuum tests #1 and #2, the author performed detailed thermal analyses of the MEM, and proposed to reduce the louver set-points by 7C. At the 1998 Intersociety Energy Conversion Engineering Conference (IECEC), the author presented a paper that included results of thermal analysis of the MEM. It showed that a 70C reduction of the louver set points could reduce the maximum power supply heat sink temperature in thermal vacuum test and in flight to below 20"C in the cooler outgas mode and in the nominal imaging mode, and has no significant impact on the standby heater duty cycle. It also showed that the effect of Earth infrared and albedo on the power supply heat sink temperature is small. The louver set point reduction was implemented in June 1998, just prior to ETM+ thermal vacuum test #3. Results of the thermal vacuum tests, and temperature data in flight validate the MEM thermal performance improvement due to the 70C reduction of the louver set points.

Choi, Michael K.↗

The MEMS Knudsen Compressor as a Vacuum Pump for Space Exploration Applications

Several lander, probe and rover missions currently under study at the Jet Propulsion Laboratory (JPL) and especially in the Microdevices Laboratory (MDL) Center for Space Microelectronics Technology, focus on utilizing microelectromechanical systems (MEMS) based instruments for science data gathering. These small instruments and NASA's commitment to "faster, better, cheaper" type missions has brought about the need for novel approaches to satisfying mission requirements. Existing in-situ instrument systems clearly lack novel and integrated methods for satisfying their vacuum needs. One attractive candidate for a MEMS vacuum pump is the Knudsen Compressor, which operates based on thermal transpiration. Thermal transpiration describes gas flows induced by temperature differences maintained across orifices, porous membranes or capillary tubes under rarefied conditions. This device has two overwhelmingly attractive features as a MEMS vacuum pump - no moving parts and no fluids. An initial estimate of a Knudsen Compressor's pumping power requirements for a surface atmospheric sampling task on Mars is less than 80 mW, significantly below than alternative pumps. Due to the relatively low energy use for this task and the applicability of the Knudsen Compressor to other applications, the development of a Knudsen Compressor utilizing MEMS fabrication techniques has been initiated. This paper discusses the initial fabrication of a single-stage MEMS Knudsen Compressor vacuum pump, provides performance criteria such as pumping speed, size, energy use and ultimate pressure and details vacuum pump applications in several MDL related in-situ instruments.

Vargo, S. E.↗

Evaluation of Thermo-Mechanical Stability of COTS Dual-Axis MEMS Accelerometers for Space Applications

Microelectromechanical systems in MEMS is one of the fastest growing technologies in microelectronics, and is of great interest for military and aerospace applications. Accelerometers are the earliest and most developed representatives of MEMS. First demonstrated in 1979, micromachined accelerometers were used in automobile industry for air bag crash- sensing applications since 1990. In 1999, N4EMS accelerometers were used in NASA-JPL Mars Microprobe. The most developed accelerometers for airbag crash- sensing are rated for a full range of +/- 50 G. The range of sensitivity for accelerometers required for military or aerospace applications is much larger, varying from 20,000 G (to measure acceleration during gun and ballistic munition launches), and to 10(exp -6) G, when used as guidance sensors (to measure attitude and position of a spacecraft). The presence of moving parts on the surface of chip is specific to MEMS, and particularly, to accelerometers. This characteristic brings new reliability issues to micromachined accelerometers, including cyclic fatigue cracking of polysilicon cantilevers and springs, mechanical stresses that are caused by packaging and contamination in the internal cavity of the package. Studies of fatigue cracks initiation and growth in polysilicon showed that the fatigue damage may influence MEMS device performance, and the presence of water vapor significantly enhances crack initiation and growth. Environmentally induced failures, particularly, failures due to thermal cycling and mechanical shock are considered as one of major reliability concerns in MEMS. These environmental conditions are also critical for space applications of the parts. For example, the Mars pathfinder mission had experienced 80 mechanical shock events during the pyrotechnic separation processes.

Sharma, Ashok K.↗

Development of Testing Methodologies for the Mechanical Properties of MEMS

This effort is to investigate and design testing strategies to determine the mechanical properties of MicroElectroMechanical Systems (MEMS) as well as investigate the development of a MEMS Probabilistic Design Methodology (PDM). One item of potential interest is the design of a test for the Weibull size effect in pressure membranes. The Weibull size effect is a consequence of a stochastic strength response predicted from the Weibull distribution. Confirming that MEMS strength is controlled by the Weibull distribution will enable the development of a probabilistic design methodology for MEMS - similar to the GRC developed CARES/Life program for bulk ceramics. However, the primary area of investigation will most likely be analysis and modeling of material interfaces for strength as well as developing a strategy to handle stress singularities at sharp corners, filets, and material interfaces. This will be a continuation of the previous years work. The ultimate objective of this effort is to further develop and verify the ability of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) code to predict the time-dependent reliability of MEMS structures subjected to multiple transient loads.

Ekwaro-Osire, Stephen↗

RF MEMS Switches with SiC Microbridges for Improved Reliability

Radio frequency (RF) microelectromechanical (MEMS) switches offer superior performance when compared to the traditional semiconductor devices such as PIN diodes or GaAs transistors. MEMS switches have a return loss (RL) better than -25 dB, negligible insertion loss (IL), isolation better than -30 dB, and near zero power consumption. However, RF MEMS switches have several drawbacks the most serious being long-term reliability. The ability for the switch to operate for millions or even billions of cycles is a major concern and must be addressed. MEMS switches are basically grouped in two categories, capacitive and metal-to-metal contact. The capacitive type switch consists of a movable metal bridge spanning a fixed electrode and separated by a narrow air gap and thin insulating material. The metal-to-metal contact type utilizes the same basic design but without the insulating material. After prolonged operation the metal bridges, in most of these switches, begin to sag and eventually fail to actuate. For the metal-to-metal type, the two metal layers may actually fuse together. Also if the switches are not packaged properly or protected from the environment moisture may build up and cause stiction between the top and bottom electrodes rendering them useless. Many MEMS switch designs have been developed and most illustrate fairly good RF characteristics. Nevertheless very few have demonstrated both great RF performance and ability to perform millions/billions of switching cycles. Of these, nearly all are of metal-to-metal type so as the frequency increases RF performance decreases.

Scardelletti, Maximilian C.↗

Accounting for Uncertainties in Strengths of SiC MEMS Parts

A methodology has been devised for accounting for uncertainties in the strengths of silicon carbide structural components of microelectromechanical systems (MEMS). The methodology enables prediction of the probabilistic strengths of complexly shaped MEMS parts using data from tests of simple specimens. This methodology is intended to serve as a part of a rational basis for designing SiC MEMS, supplementing methodologies that have been borrowed from the art of designing macroscopic brittle material structures. The need for this or a similar methodology arises as a consequence of the fundamental nature of MEMS and the brittle silicon-based materials of which they are typically fabricated. When tested to fracture, MEMS and structural components thereof show wide part-to-part scatter in strength. The methodology involves the use of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) software in conjunction with the ANSYS Probabilistic Design System (PDS) software to simulate or predict the strength responses of brittle material components while simultaneously accounting for the effects of variability of geometrical features on the strength responses. As such, the methodology involves the use of an extended version of the ANSYS/CARES/PDS software system described in Probabilistic Prediction of Lifetimes of Ceramic Parts (LEW-17682-1/4-1), Software Tech Briefs supplement to NASA Tech Briefs, Vol. 30, No. 9 (September 2006), page 10. The ANSYS PDS software enables the ANSYS finite-element-analysis program to account for uncertainty in the design-and analysis process. The ANSYS PDS software accounts for uncertainty in material properties, dimensions, and loading by assigning probabilistic distributions to user-specified model parameters and performing simulations using various sampling techniques.

Nemeth, Noel↗

Meteoroid Engineering Model (MEM) 3: NASA’s Newest Meteoroid Model

Meteoroid impacts threaten spacecraft and astronauts at all locations within the Solar System. At certain altitudes in low-Earth orbit, orbital debris dominates the risk, but meteoroids are more significant within 250 km of the Earth’s surface and above 4000 km [1]. In interplanetary space, orbital debris is nonexistent and meteoroids constitute the entire population of potentially dangerous impactors. The NASA Meteoroid Environment Office (MEO) produces the Meteoroid Engineering Model (MEM) to support meteoroid impact risk assessments [2]; MEM is a stand-alone piece of software that describes the flux, speed, directionality, and bulk density of meteoroids striking a spacecraft on a user-supplied trajectory. The MEO released version 3 of MEM in 2019 [3]. This proceeding describes the orbital populations that form the core of MEM, highlights key differences between MEM 3 and its predecessors, discusses the implications of these changes for spacecraft, summarizes our validation against meteor and in-situ data, and delineates the model’s limitations.

Moorhead, Althea V.↗

Conversion of Environment Files from ORDEM 3 & MEM 3 to STENVI

To perform Micrometeoroid and Orbital Debris (MMOD) analyses, NASA describes the orbital debris particle environment using the ORDEM 3 tool and the micrometeoroid environment using the MEM 3 tool. Both output files that detail the flux of particles as a function of several parameters. European MMOD analyses use different tools to perform similar functions, including the Meteoroid And Space debris Terrestrial Environment Reference (MASTER) environment model, which outputs flux data in the Standard Environment Interface (STENVI) format. The NASA Johnson Space Center Hypervelocity Impact Technology Group was asked to create a converter to translate flux data from the output file formats used by ORDEM 3.x and MEM 3 into the STENVI file format. Validation was performed to ensure that the converter was reproducing the input data correctly. The Bumper 3 MMOD risk assessment tool has a capability for reading ORDEM 3.x, MEM 3, and STENVI environment file formats and was used to compare MMOD risk results generated using the converter’s output STENVI files to the risk results generated using the input ORDEM 3.x and MEM 3 igloo files. Specific point comparisons validated that the converter translated the environment data correctly, producing the intended output. However, realistic risk assessments showed that the bin methodology employed by Bumper for determining particle flux as a function of particle size when reading files in STENVI format produces much higher MMOD risk than the point-interpolation methodology used in Bumper risk assessments using ORDEM and MEM. Modifications to how Bumper 3 reads STENVI files during analyses are considered to improve Bumper’s ability to perform useful analyses with environment files in this format.

STENVI↗

Conversion of ORDEM 3.X & MEM 3 Into STENVI File Format

To perform Micrometeoroid and Orbital Debris (MMOD) analyses, NASA describes the orbital debris particle environment using the ORDEM 3 tool and the micrometeoroid environment using the MEM 3 tool. Both output files that detail the flux of particles as a function of several parameters. European MMOD analyses use different tools to perform similar functions, including the Meteoroid And Space debris Terrestrial Environment Reference (MASTER) environment model, which outputs flux data in the Standard Environment Interface (STENVI) format. The NASA Johnson Space Center Hypervelocity Impact Technology Group was asked to create a converter to translate flux data from the output file formats used by ORDEM 3.x and MEM 3 into the STENVI file format. Validation was performed to ensure that the converter was reproducing the input data correctly. The Bumper 3 MMOD risk assessment tool has a capability for reading ORDEM 3.x, MEM 3, and STENVI environment file formats and was used to compare MMOD risk results generated using the converter’s output STENVI files to the risk results generated using the input ORDEM 3.x and MEM 3 igloo files. Specific point comparisons validated that the converter translated the environment data correctly, producing the intended output. However, realistic risk assessments showed that the bin methodology employed by Bumper for determining particle flux as a function of particle size when reading files in STENVI format produces much higher MMOD risk than the point-interpolation methodology used in Bumper risk assessments using ORDEM and MEM. Modifications to how Bumper 3 reads STENVI files during analyses are considered to improve Bumper’s ability to perform useful analyses with environment files in this format.

STENVI↗

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗

Qualification and Reliability for MEMS and IC Packages

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

inertial measurement unit↗

Tuning of MEMS Gyroscope using Evolutionary Algorithm and "Switched Drive-Angle" Method

We propose a tuning method for Micro-Electro-Mechanical Systems (MEMS) gyroscopes based on evolutionary computation that has the capacity to efficiently increase the sensitivity of MEMS gyroscopes through tuning and, furthermore, to find the optimally tuned configuration for this state of increased sensitivity. We present the results of an experiment to determine the speed and efficiency of an evolutionary algorithm applied to electrostatic tuning of MEMS micro gyros. The MEMS gyro used in this experiment is a pyrex post resonator gyro (PRG) in a closed-loop control system. A measure of the quality of tuning is given by the difference in resonant frequencies, or frequency split, for the two orthogonal rocking axes. The current implementation of the closed-loop platform is able to measure and attain a relative stability in the sub-millihertz range, leading to a reduction of the frequency split to less than 100 mHz.

Micro-Electro-Mechanical Systems (MEMS)↗

Tuning of MEMS Devices using Evolutionary Computation and Open-loop Frequency Response

We propose a tuning method for MEMS gyroscopes based on evolutionary computation that has the capacity to efficiently increase the sensitivity of MEMS gyroscopes through tuning and, furthermore, to find the optimally tuned configuration for this state of increased sensitivity. The tuning method was tested for the second generation JPL/Boeing Post-resonator MEMS gyroscope using the measurement of the frequency response of the MEMS device in open-loop operation.

evolvable hardware↗