Surface topographical effects in the diffusion bonding of 316 stainless steel
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Microchannel heat exchangers have seen increasing adoption in many high-pressure applications in recent decades but are subject to particulate fouling from the relatively small channel size compared to traditional designs. Typical cleaning methods require process shutdown, heat exchanger removal, cleaning, then reassembly. The objective of this project was to refine and transfer technology to enable header design improvements for Cleaning-in-Place (CIP), allowing for reduced/negligible process interruption for the cleaning process. The technology transfer was from Sandia National Laboratories (Sandia) to Vacuum Process Engineering, Inc. (VPE). This primary purpose of CIP was developed while considering channel flow uniformity and heat exchanger cost. The project phases were to 1) capture and define potential improvement options, 2) evaluate options with both simulation and experiments, and 3) transfer design knowledge to the industry partner. These efforts resulted in improved header designs from the first known focused effort in this area. The improved designs will help the entire microchannel heat exchanger field that has applications in supercritical CO 2 power cycles, hydrogen (fuel cell) vehicle fueling, liquified natural gas processing, and more.
Abstract not provided.
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Presented by NETL at TMS 2020, 02/20
Presented by NETL at TMS Annual Meeting 2020, 02/20
Abstract not provided.
Disclosed is a hermetic bond for a joint including a first layer of silicon carbide; a second layer of silicon carbide; and a bonding layer positioned between the first layer and the second layer, wherein the bonding layer includes an iridium layer, a first reaction zone positioned between the iridium foil layer and the first layer, and a second reaction zone positioned between the iridium foil layer and the second layer, wherein the first reaction zone and the second reaction zone include iridium silicides.
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Bipolar plates represent a significant portion of the cost and weight of a proton exchange membrane fuel cell stack. As a result, there has been significant interest in using low weight and cost materials, such as aluminum. Aluminum has good mechanical and physical properties; however, it performs poorly in the corrosive environment within the fuel cell stack. To overcome the corrosion performance issue, there have been efforts towards developing coating processes to enable aluminum to attain corrosion targets. In an effort to enable aluminum as a viable bipolar plate material, a solid phase processing (diffusion bonding) approach for bonding a titanium foil to aluminum is investigated in this study. The microstructure, corrosion performance, mechanical properties and electrical resistance are investigated. To avoid the known reduction in contact resistance performance of titanium after exposure to bipolar plate media, the effect of addition of highly conductive gold particles after diffusion bonding, on contact resistance and corrosion behavior, is also studied and compared with diffusion bonded Ti to Al. In conclusion, the results indicate that diffusion bonded Ti to Al provides a viable alternative material combination for bipolar plate that avoids the micro pores and crevasses that are associated with vapor deposition or electroplating.
The printed circuit heat exchanger (PCHE) has small channels with high surface area, making them an efficient solution for next-generation nuclear plants (NGNPs). These PCHEs are fabricated through a diffusion bonding process. This fabrication step changes the microstructure of wrought metal plates. The current ASME design code does not support the PCHE design for NGNPs due to a lack of test data. Hence, there has been initiative towards elevated temperature mechanical property characterization of the diffusion bonded material. One of the most common channel shapes is a semicircular channel with sharp corners. These corners act as a stress riser at the diffusion bonding interface. Evaluating elevated temperature mechanical performance of diffusion bonded material in the presence of stress risers is an essential step towards the ASME code development of PCHE design. This study selected two specimen geometries: the first is a PCHE bar specimen for tensile loading with three rows and three columns of channels, and the second is a lab-scaled PCHE with six rows and eight columns of channels. A set of elevated temperature monotonic and cyclic tests were conducted on the PCHE bar specimen to evaluate the mechanical performance under axial tensile loadings to study the failure mechanism. The lab-scaled PCHE specimens were tested under overpressure loads at room temperature, and pressure creep and pressure creep-fatigue loadings to mimic the realistic loading conditions observed in typical NGNPs. The X-ray scans of channeled specimens show interesting observations. The test results and observations are presented in the paper.
Molecular dynamics simulations were employed to understand the diffusion bonding process during hot isostatic pressing (HIP) of Al6061/Al6061 alloy. Simulations of the HIP process reveal atomistic phenomena that are difficult or unlikely to be observed experimentally and provide useful insights into the mechanism of diffusion and bonding. Here, the results reveal that at the start of the HIP process, a massive incursion of oxygen atoms occurs from the pre-existing γ-Al 2 O 3 to the 6061 region across the interphase interface. These oxygen atoms interact with the enriched Mg atom layer present at the existing γ-Al 2 O 3 and 6061 matrix to form a secondary complex Mg 2 Al 2 O 5 phase. Diffusion calculations also show that transport of atoms due to the applied pressure is 4–5 orders of magnitude higher than would occur in the absence of HIP conditions. The Mg 2 Al 2 O 5 phase also provides efficient pathways for the rapid transport of Mg atoms. Because of the higher diffusion coefficients observed for Mg within the phase, Mg atoms can move more swiftly compared to their diffusion within other phases such as γ-Al 2 O 3 . This accelerated mobility facilitates the rapid movement of Mg atoms across the interface, leading to changes in the local composition and the potential growth of the Mg 2 Al 2 O 5 phase.
Ultrasonic thermometers have potential to improve on current technologies for very high temperature measurements. One issue limiting their adoption is the formation of diffusion bonds between the acoustic waveguide used as the sensor, and its surroundings (in some cases, a protective sheath). Several potential methods for reducing this diffusion bonding (known as sticking) have been identified. Prototype ultrasonic thermometers were fabricated and tested to high temperatures in order to evaluate these methods. Several showed promise for low temperature use. The most promising option was 3-D printed ceramic spacers.