Optimal Header Design for Diffusion Bonded Heat Exchangers

Abstract

Microchannel heat exchangers have seen increasing adoption in many high-pressure applications in recent decades but are subject to particulate fouling from the relatively small channel size compared to traditional designs. Typical cleaning methods require process shutdown, heat exchanger removal, cleaning, then reassembly. The objective of this project was to refine and transfer technology to enable header design improvements for Cleaning-in-Place (CIP), allowing for reduced/negligible process interruption for the cleaning process. The technology transfer was from Sandia National Laboratories (Sandia) to Vacuum Process Engineering, Inc. (VPE). This primary purpose of CIP was developed while considering channel flow uniformity and heat exchanger cost. The project phases were to 1) capture and define potential improvement options, 2) evaluate options with both simulation and experiments, and 3) transfer design knowledge to the industry partner. These efforts resulted in improved header designs from the first known focused effort in this area. The improved designs will help the entire microchannel heat exchanger field that has applications in supercritical CO 2 power cycles, hydrogen (fuel cell) vehicle fueling, liquified natural gas processing, and more.