Diffusional creep and creep-degradation in dispersion-strengthened Ni-Cr base alloys.
Dispersoid-free regions were observed in the dispersion-strengthened alloy TD-NiCr (Ni-20 Cr-2 ThO2) after slow strain rate testing (stress rupture, creep, and fatigue) in air from 1145 to 1590 K. Formation of the dispersoid-free regions appears to be the result of diffusional creep. The net effect of creep in TD-NiCr is the degradation of the alloy to a duplex microstructure. Creep degradation of TD-NiCr is further enhanced by the formation of voids and intergranular oxidation in the dispersoid-free bands. Void formation was observed after as little as 0.13% creep deformation at 1255 K. The dispersoid-free regions apparently provide sites for void formation and oxide growth since the strength and oxidation resistance of Ni-20 Cr-2 ThO2.