Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “Process integration”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Pt/HTCC Alumina based Electronic Packaging System and Integration Processes for High Temperature Harsh Environment Applications

Electronic devices capable of operation at 500°C are required for long term Venus surface missions, as well as for in situ monitoring and control of next generation aeronautical engines. High temperature sensors and electronics can also find many applications in military, and energy and automobile industries. Various silicon carbide (SiC) sensors and electronic devices have been developed for operation at 500 °C, and a compatible packaging system is needed for long term test and deployment of these high temperature devices. High temperature co-fired ceramics (HTCC) alumina with platinum (Pt) conductor was proposed for high temperature electronic packaging. A prototype Pt/HTCC alumina packaging system including chip-level package and circuit board has been briefly reported previously for long-term electrical testing of SiC integrated circuits at 500 °C, and brief testing at much higher temperatures. HTCC alumina is an excellent dielectric material with acceptable dielectric constant and low dielectric loss over wide temperature and frequency ranges. Pt is chemically noble and can be co-fired with HTCC alumina in air ambient producing a viable electronic packaging material system for high temperature applications. This paper presents a more detailed description of this packaging system including prototype low power packages and circuit boards based on HTCC alumina and Pt metallization for 500°C and other harsh environment applications. The key technical considerations for chip-level packaging and circuit board assembly, including materials and processes for 500 °C durable wire-bonding and SiC die attach, and integration of multi-chip circuit boards, are presented. Experimental test results of this packaging approach applied to SiC integrated circuits at 500 °C and 700°C are discussed as well.

electronic packaging↗
NASA NTRS2016

Assembly and Integration Process of the First High Density Detector Array for the Atacama Cosmology Telescope

The Advanced ACTPol (AdvACT) upgrade on the Atacama Cosmology Telescope (ACT) consists of multichroicTransition Edge Sensor (TES) detector arrays to measure the Cosmic Microwave Background (CMB) polarization anisotropies in multiple frequency bands. The first AdvACT detector array, sensitive to both 150 and 230 GHz, is fabricated on a 150 mm diameter wafer and read out with a completely different scheme compared to ACTPol. Approximately 2000 TES bolometers are packed into the wafer leading to both a much denser detector density and readout circuitry. The demonstration of the assembly and integration of the AdvACT arrays is important for the next generation CMB experiments, which will continue to increase the pixel number and density. We present the detailed assembly process of the first AdvACT detector array.

Li, Yaqiong↗
NASA NTRS1993

A perspective on the FAA approval process: Integrating rotorcraft displays, controls and workload

The FAA is responsible for making the determination that a helicopter is safe for IFR operations in the National Airspace System (NAS). This involves objective and subjective evaluations of cockpit displays, flying qualities, procedures and human factors as they affect performance and workload. After all of the objective evaluations are completed, and all Federal Regulations have been met, FAA pilots make the final subjective judgement as to suitability for use by civil pilots in the NAS. The paper uses the flying qualities and pilot workload characteristics of a small helicopter to help examine the FAA pilot's involvement in this process. The result highlights the strengths of the process and its importance to the approval of new aircraft and equipments for civil IFR helicopter applications. The paper also identifies opportunities for improvement.

Green, David L.↗
NASA NTRS1981

An evaluation of the Intel 2920 digital signal processing integrated circuit

The circuit consists of a digital to analog converter, accumulator, read write memory and UV erasable read only memory. The circuit can convert an analog signal to a digital representation, perform mathematical operations on the digital signal and subsequently convert the digital signal to an analog output. Development software tailored for programming the 2920 is presented.

Heller, J.↗
NASA NTRS1990

In-situ integrated processing and characterization of thin films of high temperature superconductors, dielectrics and semiconductors by MOCVD

In this strategy of depositing the basic building blocks of superconductors, semiconductors, and dielectric having common elements, researchers deposited superconducting films of Y-Ba-Cu-O, semiconductor films of Cu2O, and dielectric films of BaF2 and Y2O3 by metal oxide chemical vapor deposition (MOCVD). By switching source materials entering the chamber, and by using direct writting capability, complex device structures like three-terminal hybrid semiconductors/superconductors transistors can be fabricated. The Y-Ba-Cu-O superconducting thin films on BaF2/YSZ substrates show a T(sub c) of 80 K and are textured with most of the grains having their c-axis or a-axis perpendicular to the substrate. Electrical characteristics as well as structural characteristics of superconductors and related materials obtained by x-ray defraction, electron microscopy, and energy dispersive x-ray analysis are discussed.

Singh, R.↗
NASA NTRS1991

In-situ integrated processing and characterization of thin films of high temperature superconductors, dielectrics and semiconductors by MOCVD

In this strategy of depositing the basic building blocks of superconductors, semiconductors, and dielectrics having common elements, researchers deposited superconducting films of Y-Ba-Cu-O, semiconductor films of Cu2O, and dielectric films of BaF2 and Y2O3 by metal oxide chemical vapor deposition (MOCVD). By switching source materials entering the chamber, and by using direct writing capability, complex device structures like three terminal hybrid semiconductor/superconductor transistors can be fabricated. The Y-Ba-Cu-O superconducting thin films on BaF2/YSZ substrates show a T(sub c) of 80 K and are textured with most of the grains having their c-axis or a-axis perpendicular to the substrate. Electrical characteristics as well as structural characteristics of superconductors and related materials obtained by x-ray deffraction, electron microscopy, and energy dispersive x-ray analysis are discussed.

Singh, R.↗
NASA NTRS1993

Systems engineering and integration processes involved with manned mission operations

This paper will discuss three mission operations functions that are illustrative of the key principles of operations SE&I and of the processes and products involved. The flight systems process was selected to illustrate the role of the systems product line in developing the depth and cross disciplinary skills needed for SE&I and providing the foundation for dialogue between participating elements. FDDD was selected to illustrate the need for a structured process to assure that SE&I provides complete and accurate results that consistently support program needs. The flight director's role in mission operations was selected to illustrate the complexity of the risk/gain tradeoffs involved in the development of the flight techniques and flight rules process as well as the absolute importance of the leadership role in developing the technical, operational, and political trades.

Kranz, Eugene F.↗
NASA NTRS2011

Quality Control Algorithms and Proposed Integration Process for Wind Profilers Used by Launch Vehicle Systems

Impact of winds to space launch vehicle include Design, Certification Day-of-launch (DOL) steering commands (1)Develop "knockdowns" of load indicators (2) Temporal uncertainty of flight winds. Currently use databases from weather balloons. Includes discrete profiles and profile pair datasets. Issues are : (1)Larger vehicles operate near design limits during ascent 150 discrete profiles per month 110-217 seasonal 2.0 and 3.5-hour pairs Balloon rise time (one hour) and drift (up to 100 n mi) Advantages of the Alternative approach using Doppler Radar Wind Profiler (DRWP) are: (1) Obtain larger sample size (2) Provide flexibility for assessing trajectory changes due to winds (3) Better representation of flight winds.

Decker, Ryan↗
NASA NTRS1995

MEMS Technology for Space Applications

Micro-technology enables the manufacturing of all kinds of components for miniature systems or micro-systems, such as sensors, pumps, valves, and channels. The integration of these components into a micro-electro-mechanical system (MEMS) drastically decreases the total system volume and mass. These properties, combined with the increasing need for monitoring and control of small flows in (bio)chemical experiments, makes MEMS attractive for space applications. The level of integration and applied technology depends on the product demands and the market. The ultimate integration is process integration, which results in a one-chip system. An example of process integration is a dosing system of pump, flow sensor, micromixer, and hybrid feedback electronics to regulate the flow. However, for many applications, a hybrid integration of components is sufficient and offers the advantages of design flexibility and even the exchange of components in the case of a modular set up. Currently, we are working on hybrid integration of all kinds of sensors (physical and chemical) and flow system modules towards a modular system; the micro total analysis system (micro TAS). The substrate contains electrical connections as in a printed circuit board (PCB) as well as fluid channels for a circuit channel board (CCB) which, when integrated, form a mixed circuit board (MCB).

vandenBerg, A.↗
NASA NTRS2014

Human Integration Design Processes (HIDP)

The purpose of the Human Integration Design Processes (HIDP) document is to provide human-systems integration design processes, including methodologies and best practices that NASA has used to meet human systems and human rating requirements for developing crewed spacecraft. HIDP content is framed around human-centered design methodologies and processes in support of human-system integration requirements and human rating. NASA-STD-3001, Space Flight Human-System Standard, is a two-volume set of National Aeronautics and Space Administration (NASA) Agency-level standards established by the Office of the Chief Health and Medical Officer, directed at minimizing health and performance risks for flight crews in human space flight programs. Volume 1 of NASA-STD-3001, Crew Health, sets standards for fitness for duty, space flight permissible exposure limits, permissible outcome limits, levels of medical care, medical diagnosis, intervention, treatment and care, and countermeasures. Volume 2 of NASASTD- 3001, Human Factors, Habitability, and Environmental Health, focuses on human physical and cognitive capabilities and limitations and defines standards for spacecraft (including orbiters, habitats, and suits), internal environments, facilities, payloads, and related equipment, hardware, and software with which the crew interfaces during space operations. The NASA Procedural Requirements (NPR) 8705.2B, Human-Rating Requirements for Space Systems, specifies the Agency's human-rating processes, procedures, and requirements. The HIDP was written to share NASA's knowledge of processes directed toward achieving human certification of a spacecraft through implementation of human-systems integration requirements. Although the HIDP speaks directly to implementation of NASA-STD-3001 and NPR 8705.2B requirements, the human-centered design, evaluation, and design processes described in this document can be applied to any set of human-systems requirements and are independent of reference missions. The HIDP is a reference document that is intended to be used during the development of crewed space systems and operations to guide human-systems development process activities.

Boyer, Jennifer↗
NASA NTRS1980

Case study: Lockheed-Georgia Company integrated design process

A case study of the development of an Integrated Design Process is presented. The approach taken in preparing for the development of an integrated design process includes some of the IPAD approaches such as developing a Design Process Model, cataloging Technical Program Elements (TPE's), and examining data characteristics and interfaces between contiguous TPE's. The implementation plan is based on an incremental development of capabilities over a period of time with each step directed toward, and consistent with, the final architecture of a total integrated system. Because of time schedules and different computer hardware, this system will not be the same as the final IPAD release; however, many IPAD concepts will no doubt prove applicable as the best approach. Full advantage will be taken of the IPAD development experience. A scenario that could be typical for many companies, even outside the aerospace industry, in developing an integrated design process for an IPAD-type environment is represented.

Waldrop, C. T.↗
NASA NTRS1979

Development of Integrated Programs for Aerospace-vehicle design (IPAD): Integrated information processing requirements

The engineering-specified requirements for integrated information processing by means of the Integrated Programs for Aerospace-Vehicle Design (IPAD) system are presented. A data model is described and is based on the design process of a typical aerospace vehicle. General data management requirements are specified for data storage, retrieval, generation, communication, and maintenance. Information management requirements are specified for a two-component data model. In the general portion, data sets are managed as entities, and in the specific portion, data elements and the relationships between elements are managed by the system, allowing user access to individual elements for the purpose of query. Computer program management requirements are specified for support of a computer program library, control of computer programs, and installation of computer programs into IPAD.

Southall, J. W.↗
NASA NTRS1980

Chemical vapor deposition for automatic processing of integrated circuits

Chemical vapor deposition for automatic processing of integrated circuits including the wafer carrier and loading from a receiving air track into automatic furnaces and unloading on to a sending air track is discussed. Passivation using electron beam deposited quartz is also considered.

Kennedy, B. W.↗