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At least 37 records · Page 2

Physics-of-Failure Approach to Prognostics

As more and more electric vehicles emerge in our daily operation progressively, a very critical challenge lies in accurate prediction of the electrical components present in the system. In case of electric vehicles, computing remaining battery charge is safety-critical. In order to tackle and solve the prediction problem, it is essential to have awareness of the current state and health of the system, especially since it is necessary to perform condition-based predictions. To be able to predict the future state of the system, it is also required to possess knowledge of the current and future operations of the vehicle. In this presentation our approach to develop a system level health monitoring safety indicator for different electronic components is presented which runs estimation and prediction algorithms to determine state-of-charge and estimate remaining useful life of respective components. Given models of the current and future system behavior, the general approach of model-based prognostics can be employed as a solution to the prediction problem and further for decision making.

Kulkarni, Chetan S.

Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook

A Physics of Failure Approach to Evaluate Printed Circuit Board Reliability

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed Circuit Boards

Field Programmable Gate Array Failure Rate Estimation Guidelines for Launch Vehicle Fault Tree Models

Today's launch vehicles complex electronic and avionics systems heavily utilize Field Programmable Gate Array (FPGA) integrated circuits (IC) for their superb speed and reconfiguration capabilities. Consequently, FPGAs are prevalent ICs in communication protocols such as MILSTD- 1553B and in control signal commands such as in solenoid valve actuations. This paper will identify reliability concerns and high level guidelines to estimate FPGA total failure rates in a launch vehicle application. The paper will discuss hardware, hardware description language, and radiation induced failures. The hardware contribution of the approach accounts for physical failures of the IC. The hardware description language portion will discuss the high level FPGA programming languages and software/code reliability growth. The radiation portion will discuss FPGA susceptibility to space environment radiation.

Al Hassan, Mohammad

Field Programmable Gate Array Failure Rate Estimation Guidelines for Launch Vehicle Fault Tree Models

Today's launch vehicles complex electronic and avionic systems heavily utilize the Field Programmable Gate Array (FPGA) integrated circuit (IC). FPGAs are prevalent ICs in communication protocols such as MIL-STD-1553B, and in control signal commands such as in solenoid/servo valves actuations. This paper will demonstrate guidelines to estimate FPGA failure rates for a launch vehicle, the guidelines will account for hardware, firmware, and radiation induced failures. The hardware contribution of the approach accounts for physical failures of the IC, FPGA memory and clock. The firmware portion will provide guidelines on the high level FPGA programming language and ways to account for software/code reliability growth. The radiation portion will provide guidelines on environment susceptibility as well as guidelines on tailoring other launch vehicle programs historical data to a specific launch vehicle.

Al Hassan, Mohammad

Field Programmable Gate Array Reliability Analysis Guidelines for Launch Vehicle Reliability Block Diagrams

Field Programmable Gate Arrays (FPGAs) integrated circuits (IC) are one of the key electronic components in today's sophisticated launch and space vehicle complex avionic systems, largely due to their superb reprogrammable and reconfigurable capabilities combined with relatively low non-recurring engineering costs (NRE) and short design cycle. Consequently, FPGAs are prevalent ICs in communication protocols and control signal commands. This paper will identify reliability concerns and high level guidelines to estimate FPGA total failure rates in a launch vehicle application. The paper will discuss hardware, hardware description language, and radiation induced failures. The hardware contribution of the approach accounts for physical failures of the IC. The hardware description language portion will discuss the high level FPGA programming languages and software/code reliability growth. The radiation portion will discuss FPGA susceptibility to space environment radiation.

Al Hassan, Mohammad

FPGA Reliability and Failure Rate Analysis for Launch and Space Vehicles Environments

Field Programmable Gate Arrays (FPGAs) integrated circuits (IC) are one of the key electronic components in today's sophisticated launch and space vehicle complex avionic systems, largely due to their superb reprogrammable and reconfigurable capabilities combined with relatively low non-recurring engineering costs (NRE) and short design cycle. Consequently, FPGAs are prevalent ICs in communication protocols and control signal commands. This paper will demonstrate guidelines to estimate FPGA failure rates for ascent and in space operations. The guidelines will account for hardware and radiation-induced failures, as well as Bayesian updates to failure rates. The hardware contribution of the approach accounts for physical failures of the FPGA IC. The radiation portion will expand on FPGA susceptibility to different space radiation environments.

Al Hassan, Mohammad

Electronic assembly thermal testing - Dwell/duration/cycling

Testing of electronic assemblies varies throughout industry, NASA, and the military. Differences include test levels, atmospheric versus vacuum testing of assemblies, dwell durations at temperature extremes (especially high temperature), and thermal cycling versus dwell testing. Of particular interest are the different philosophies of thermal cycling versus single-cycle thermal dwell. An examination of the various failure physics for electronic assemblies has been initiated at JPL. The intent is to determine which failure modes are best revealed by thermal cycling testing and which are susceptible to high-temperature dwell physics. Preliminary results of this study are presented, along with discussions of testing goals, flight environments, reliability models, and the differences between industry and JPL design/test approaches.

Gibbel, Mark

NASA Methodology for Physics of Failure-Based Reliability Assessments Handbook

At the intersection of mission, technology, and place is NASA’s need to modernize for a digital-forward future. Therefore, NASA’s Reliability & Maintainability (R&M) Enterprise Data Sharing team is working to leverage both Digitization and Digital Transformation to develop and share best practices and methodologies across NASA. One such cutting edge methodology is Physics of Failure. Therefore NASA OSMA's R&M office is developing a Reliability Physics of Failure Handbook in order to keep our engineers current and on the cutting edge of analysis methodologies to help ensure NASA’s optimize and achieve continued success.

Reliability Engineering

Contemporary Impact Analysis Methodology for Planetary Sample Return Missions

Development of an Earth entry vehicle and the methodology created to evaluate the vehicle's impact landing response when returning to Earth is reported. NASA's future Mars Sample Return Mission requires a robust vehicle to return Martian samples back to Earth for analysis. The Earth entry vehicle is a proposed solution to this Mars mission requirement. During Earth reentry, the vehicle slows within the atmosphere and then impacts the ground at its terminal velocity. To protect the Martian samples, a spherical energy absorber called an impact sphere is under development. The impact sphere is composed of hybrid composite and crushable foam elements that endure large plastic deformations during impact and cause a highly nonlinear vehicle response. The developed analysis methodology captures a range of complex structural interactions and much of the failure physics that occurs during impact. Numerical models were created and benchmarked against experimental tests conducted at NASA Langley Research Center. The postimpact structural damage assessment showed close correlation between simulation predictions and experimental results. Acceleration, velocity, displacement, damage modes, and failure mechanisms were all effectively captured. These investigations demonstrate that the Earth entry vehicle has great potential in facilitating future sample return missions.

Perino, Scott V.

Reliability training

Discussed here is failure physics, the study of how products, hardware, software, and systems fail and what can be done about it. The intent is to impart useful information, to extend the limits of production capability, and to assist in achieving low cost reliable products. A review of reliability for the years 1940 to 2000 is given. Next, a review of mathematics is given as well as a description of what elements contribute to product failures. Basic reliability theory and the disciplines that allow us to control and eliminate failures are elucidated.

Lalli, Vincent R.

A Novel Multiscale Physics Based Progressive Failure Methodology for Laminated Composite Structures

A variable fidelity, multiscale, physics based finite element procedure for predicting progressive damage and failure of laminated continuous fiber reinforced composites is introduced. At every integration point in a finite element model, progressive damage is accounted for at the lamina-level using thermodynamically based Schapery Theory. Separate failure criteria are applied at either the global-scale or the microscale in two different FEM models. A micromechanics model, the Generalized Method of Cells, is used to evaluate failure criteria at the micro-level. The stress-strain behavior and observed failure mechanisms are compared with experimental results for both models.

Pineda, Evan J.

The ablation of graphitic materials in the sublimation regime.

A large variety of graphitic materials have been tested in an arc heated air stream at a surface pressure of 4.3 atm and a nominal surface temperature of 3925 K. Included were commercial and developmental grades of artificial graphites, both two and three dimensional carbon-carbon composites, composites seeded with refractory compounds, and several special materials such as pyrolytic graphite, mesophase graphite, glassy carbon, and natural graphite. ATJ graphite was used as a control material. Except for the seeded materials which had poor performance, the mass loss rate for all the man-made graphitic materials fell within the range of 17 per cent less to 30 per cent more than the rate for ATJ. Thus it is concluded that wide variations in constituents, processing, fabrication and structure have relatively little effect on the ablation performance of graphitic materials, at least under the conditions of the present tests. Particulate mass loss was observed for all the materials tested and is the dominant mechanism for mass removal at the present test conditions. It is suggested that this mechanism results from physical failure, primarily by compressive thermal stress.

Lundell, J. H.

Development of potassium ion conducting hollow glass fibers

Potassium ion conducting glasses, chemically resistant to potassium, potassium sulfide and sulfur, were made and their possible utility as the membrane material for a potassium/sulfur battery was evaluated. At least one satisfactory candidate was found. It possesses an electrical resistance which makes it usable as a membrane in the form of a fine hollow fiber. It's chemical and electrochemical resistances are excellent. The other aspects of the possible potassium sulfur battery utilizing such fine hollow fibers, including the header (or tube sheet) and a cathode current collector were studied. Several cathode materials were found to be satisfactory. None of the tube sheet materials studied possessed all the desired properties. Multi-fiber cells had very limited life-time due to physical failure of fibers at the fiber/tube sheet junctions.

Tsang, F. Y.

Delamination micromechanics analysis

A three-dimensional finite element analysis was developed which includes elastoplastic, orthotropic material response, and fracture initiation and propagation. Energy absorption due to physical failure processes characteristic of the heterogeneous and anisotropic nature of composite materials is modeled. A local energy release rate in the presence of plasticity was defined and used as a criterion to predict the onset and growth of cracks in both micromechanics and macromechanics analyses. This crack growth simulation technique is based upon a virtual crack extension method. A three-dimensional finite element micromechanics model is used to study the effects of broken fibers, cracked matrix and fiber-matrix debond on the fracture toughness of the unidirectional composite. The energy release rates at the onset of unstable crack growth in the micromechanics analyses are used as critical energy release rates in the macromechanics analysis. This integrated micromechanical and macromechanical fracture criterion is shown to be very effective in predicting the onset and growth of cracks in general multilayered composite laminates by applying the criterion to a single-edge notched graphite/epoxy laminate subjected to implane tension normal to the notch.

Adams, D. F.

A specification-based approach to concurrent structure verification in multiprocessor systems

A recently initiated research project concerned with the concurrent detection of software errors and errors due to physical failures in the hardware of multiprocessor systems is described in this paper. An approach to error detection is described, which is specification based and relies on the structural verification of program control flow and data structure integrity. The techniques discussed utilize the hardware redundancy inherent in parallel processing systems to provide verification of both program structure and data concurrently with program execution.

Fuchs, W. Kent

Faulty behavior of asynchronous storage elements

It is often assumed that the faults in storage elements (SE's) can be modeled as output/input stuck-at-faults of the element. They are implicitly considered equivalent to the stuck-at faults in the combinational logic surrounding the SE cells. A more accurate higher level fault model for elementary SE's used in asynchronous circuits is presented. This model offers better representation of the physical failures. It is shown that the stuck-at model may be adequate if only modest fault coverage is desired. The enhanced model includes some common fault behaviors of SE's that are not covered by the stuck-at model. These include data-feed-through behaviors that cause the SE to be combinational. Fault models for complex SE cells can be obtained without a significant loss of information about the structure of the circuit.

Al-Assadi, Waleed K.