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Simulation-based Study of Single-Event Burnout in 4H-SiC High-Voltage Vertical Superjunction DMOSFET: Physical Failure Mechanism and Robustness vs. Performance Tradeoffs

We explore and elucidate physical failure mechanisms in a 4H-SiC, high voltage, superjunction (SJ) vertical DMOSFET from a single heavy ion strike using three-dimensional electro-thermal transient simulations. The single-event burnout (SEB) failure is thermal runaway from second breakdown, initiated by impact ionization and terminated with mesoplasma formation, at the center of the P-pillar/N+ substrate interface. We also demonstrate that the SEB performance of this SiC SJ DMOSFET is insensitive to the pillar width but sensitive to the strike location with ion strike at the P-pillar causing SEB at a lower blocking voltage than at the N-pillar. Compared to commercially available 1.2 kV blocking-rated non-SJ DMOSFETs, which have been demonstrated to survive SEB up to 525 V, the SJ DMOSFET increases SEB survival threshold voltage (VSEB) by a factor of 2.2, making it close to 1200 V, while the on-resistance is increased by only 11%. Using our recently developed figure of merit (FoM), which considers the trade-off between VSEB and on-state performance, we find that the SiC SJ DMOSFET achieves a FoM that is 14 times better, making it superior to conventional 1.2 kV SiC DMOSFETs for long-term radiation-tolerant operation in space applications.

Silicon Carbide

Microelectronics reliability : physics-of-failure based modeling and lifetime evaluation

This handbook presents a physics-of-failure approach to microelectronics reliability modeling and assessment. Knowledge of the root cause and physical behavior of key failure mechanisms in microelectronic devices has improved dramatically over recent years and has led to the development of more sophisticated reliability modeling tools and techniques...

White, Mark

NASA Physics of Failure (PoF) for Reliability

An item’s reliability or longevity is dependent not only on its design but also on how it is used, manufactured, tested, and the stresses it has or will experience. Stresses include operational and environmental exposures to thermal, voltage, current, age/exposure, mechanical, and radiation mechanisms. Therefore, in reliability analysis, it is important to consider the contributions of all of these factors when predicting the failure rates of components. Historically, there has been a reliance on handbook data (e.g., MIL-HDBK-217), but experience has shown that these values and distributions are not representative of actual performance (1,2). Therefore, to make more credible reliability and risk assessments for its missions, NASA must transition to estimating likelihoods of failure based on an item’s reliability/longevity factors (or the physical susceptibilities and strengths impacting the design’s performance) has or will experience, whenever possible. To facilitate this transition a “Handbook on Methodology for Physics of Failure Based Reliability Assessments” has been developed by NASA to assist in applying physics experiences or experiment physics for empirical analysis and conceptualized physics exposures or theoretical physics for deterministic analysis, to develop and aggregate realistic likelihoods of failure leading to more credible forecasts of item performance and longevity. In addition, since it is NASA’s intention that this document continues to evolve based on community lessons learned and the introduction of new assessment methodologies, NASA is encouraging and appreciates the contributions of current and future authors to maintain and enhance this handbook and its supporting case studies.

Physics of Failure

OSMA Digital Evolution: R&M Physics of Failure (PoF) Handbook

At the intersection of mission, technology, and place is NASA’s need to modernize for a digital-forward future. Therefore, NASA’s Reliability & Maintainability (R&M) Enterprise Data Sharing team is working to leverage both Digitization and Digital Transformation to develop and share best practices and methodologies across NASA. One such cutting edge methodology is Physics of Failure. Therefore NASA OSMA's R&M office is developing a Reliability Physics of Failure Handbook in order to keep our engineers current and on the cutting edge of anlayis methodologies to help ensure NASA’s optimize and achieve continued success.

Digital Transformation

OSMA Digital Evolution: R&M Physics of Failure (PoF) Handbook

At the intersection of mission, technology, and place is NASA’s need to modernize for a digital-forward future. Therefore, NASA’s Reliability & Maintainability (R&M) Enterprise Data Sharing team is working to leverage both Digitization and Digital Transformation to develop and share best practices and methodologies across NASA. One such cutting edge methodology is Physics of Failure. Therefore NASA OSMA's R&M office is developing a Reliability Physics of Failure Handbook in order to keep our engineers current and on the cutting edge of analysis methodologies to help ensure NASA’s optimize and achieve continued success. "

Digital transformation

NASA Physics of Failure (PoF) Handbook Update

At the intersection of mission, technology, and place is NASA’s need to modernize for a digital-forward future. Therefore, NASA’s Reliability & Maintainability (R&M) Enterprise Data Sharing team is working to leverage both Digitization and Digital Transformation to develop and share best practices and methodologies across NASA. One such cutting edge methodology is Physics of Failure. Therefore NASA OSMA's R&M office is developing a Reliability Physics of Failure Handbook in order to keep our engineers current and on the cutting edge of anlayis methodologies to help ensure NASA’s optimize and achieve continued success.

Digital transformation

NASA Physics of Failure (PoF) for Reliability

An item’s reliability or longevity is dependent not only on its design but also on how it is used, manufactured, tested, and the stresses it has or will experience. Stresses include operational and environmental exposures to thermal, voltage, current, age/exposure, mechanical, and radiation mechanisms. Therefore, in reliability analysis, it is important to consider the contributions of all these factors when predicting the failure rates of components. Historically, there has been a reliance on handbook data (e.g., MIL-HDBK-217), but experience has shown that these values and distributions are not representative of actual performance. Therefore, to make more credible reliability and risk assessments for its missions, NASA must transition to estimating likelihoods of failure based on an item’s reliability or longevity factors (or the physical susceptibilities and strengths impacting the design’s performance) has or will experience, whenever possible. To facilitate this transition, a Handbook on Methodology for Physics of Failure Based Reliability Assessments has been developed by NASA to assist in applying physics experiences or experimental physics for empirical analysis and conceptualized physics exposures or theoretical physics for deterministic analysis, to develop and aggregate realistic likelihoods of failure leading to more credible forecasts of item performance and longevity. In addition, since it is NASA’s intention that this document continues to evolve based on community lessons learned and the introduction of new assessment methodologies, NASA is encouraging and appreciates the contributions of current and future authors to maintain and enhance this handbook and its supporting case studies.

PoF

Probabilistic physics of failure approach to fusion systems & Risk-efficiency optimization of nuclear co-generation [Slides]

An overview of the progress made towards two separate summer internship projects: a probabilistic physics of failure approach to fusion systems and a risk efficiency optimization of nuclear co-generation. Original version summarized the progress through end of June, and the revision version summarizes the progress through the entire internship to August 1st.

22 - GENERAL STUDIES OF NUCLEAR REACTORS

Design for validation, based on formal methods

Validation of ultra-reliable systems decomposes into two subproblems: (1) quantification of probability of system failure due to physical failure; (2) establishing that Design Errors are not present. Methods of design, testing, and analysis of ultra-reliable software are discussed. It is concluded that a design-for-validation based on formal methods is needed for the digital flight control systems problem, and also that formal methods will play a major role in the development of future high reliability digital systems.

Butler, Ricky W.

Physics of Failure Analysis of Nuclear Fusion Divertor Monoblock: An Analytical Approach

Original - A slide package that summarizes research progress of 2025 summer high school internship. To be presented at an internal group presentation to all the high school interns and mentors within C200, plus potential more interested audience from INL. Revision - Based on the original LRS-approved slide package, an updated slide package and a poster were prepared with slight changes (e.g., adjusting the layout of slides and reproducing some plots for better clarity) for the interns' final showcase on August 13. The showcase will be public-facing (i.e., not limited to INL attendees).

99 - GENERAL AND MISCELLANEOUS

Physically Based Failure Criteria for Transverse Matrix Cracking

A criterion for matrix failure of laminated composite plies in transverse tension and in-plane shear is developed by examining the mechanics of transverse matrix crack growth. Matrix cracks are assumed to initiate from manufacturing defects and can propagate within planes parallel to the fiber direction and normal to the ply mid-plane. Fracture mechanics models of cracks in unidirectional laminates, embedded plies and outer plies are developed to determine the onset and direction of propagation for unstable crack growth. The models for each ply configuration relate ply thickness and ply toughness to the corresponding in-situ ply strength. Calculated results for several materials are shown to correlate well with experimental results.

Davila, Carlos G.

Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials

The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.

Suh, Jong-ook