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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 37 records · Page 2
All sourcesNASA NTRSDOE OSTI
NASA NTRS2017

24-71 GHz PCB Array for 5G ISM

Millimeter-wave 5G mobile architectures need to consolidate disparate frequency bands into a single, multifunctional array. Existing arrays are either narrow-band, prohibitively expensive or cannot be scaled to these frequencies. In this paper, we present the first ultra-wideband millimeter wave array to operate across six 5G and ISM bands spanning 24-71 GHz. Importantly, the array is realized using low-cost PCB. The paper presents the design and optimized layout, and discusses fabrication and measurements.

5G and ISM↗
NASA NTRSDate not supplied

PCB Quality Metrics that Drive Reliability

Risk-based technology infusion is a deliberate and systematic process that defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2021 Events provides the audience a snapshot of quality variations in printed-wiring-board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed-wiring-board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends are then matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk-based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies that promote the adoption of higher throughput and faster processing technology for GSFC missions.

Printed circuit boards↗
DOE OSTI2025

Flexible PCB Windings Size Optimization for Winding AC Resistance Minimization Under the Sinusoidal Voltage Regime

In this paper, optimization of the winding AC resistance of the flexible printed circuit board (FPCB) wire windings is performed. A one-dimensional model of the FPCB winding is introduced and an equation for the FPCB winding AC resistance and its low and medium frequency approximation are derived. The approximate FPCB winding AC resistance equation is used to derive optimum thickness of the FPCB winding conductor thickness at which minimum of winding AC resistance (global optimum) is achieved. The Finite Element Method analysis and experimental verification of derived equations (winding resistance, impedance, power loss, and temperature measurements) is performed in order validate derived model and winding resistance equation.

42 ENGINEERING↗
NASA NTRS1985

Anvil for Flaring PCB Guide Pins

Spring-loaded anvil results in fewer fractured pins. New anvil for flaring guide pins in printed-circuit boards absorbs approximately 80 percent of press force. As result fewer pins damaged, and work output of flaring press greatly increased.

Winn, E.↗
NASA NTRS2007

Removal of PCB and other halogenated organic contaminants found in ex situ structures

Emulsified systems of a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline↗
NASA NTRS2007

Removal of PCB and Other Halogenated Organic Contaminants found in Ex Situ Structures

Emulsified systems or a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline↗
NASA NTRS2009

Removal of PCB and other halogenated organic contaminants found in ex situ structures

Emulsified systems of a surfactant-stabilized, biodegradable water-in-solvent emulsion with bimetallic particles contained with the emulsion droplets are useful at removing PCBs from ex situ structures. The hydrophobic emulsion system draws PCBs through the solvent/surfactant membrane. Once inside the membrane, the PCBs diffuse into the bimetallic particles and undergo degradation. The PCBs continue to enter, diffuse, degrade, and biphenyl will exit the particle maintaining a concentration gradient across the membrane and maintaining a driving force of the reaction.

Quinn, Jacqueline W.↗
NASA NTRS2017

24-71 GHz PCB Array for 5G-ISM

This presentation discusses the development of a low form factor Ultra-Wideband at Ka-Band and up to the Millimeter-Wave Spectrum.

phased array↗
NASA NTRS2020

PCB Quality Metrics that Drive Reliability (PD 18)

Risk based technology infusion is a deliberate and systematic process which defines the analysis and communication methodology by which new technology is applied and integrated into existing and new designs, identifies technology development needs based on trends analysis and facilitates the identification of shortfalls against performance objectives. This presentation at IPC Works Asia Aerospace 2019 Events provides the audience a snapshot of quality variations in printed wiring board quality, as assessed, using experiences in processing and risk analysis of PWB structural integrity coupons. The presentation will focus on printed wiring board quality metrics used, the relative type and number of non-conformances observed and trend analysis using statistical methods. Trend analysis shows the top five non-conformances observed across PWB suppliers, the root cause(s) behind these non-conformance and suggestions of mitigation plans. The trends will then be matched with the current state of the PWB supplier base and its challenges and opportunities. The presentation further discusses the risk based SMA approaches and methods being applied at GSFC for evaluating candidate printed wiring board technologies which promote the adoption of higher throughput and faster processing technology for GSFC missions.

Sood, Bhanu↗
NASA NTRS2012

Focal Plane Alignment Utilizing Optical CMM

In many applications, an optical detector has to be located relative to mechanical reference points. One solution is to specify stringent requirements on (1) mounting the optical detector relative to the chip carrier, (2) soldering the chip carrier onto the printed circuit board (PCB), and (3) installing the PCB to the mechanical structure of the subsystem. Figure 1 shows a sketch of an optical detector mounted relative to mechanical reference with high positional accuracy. The optical detector is typically a fragile wafer that cannot be physically touched by any measurement tool. An optical coordinate measuring machine (CMM) can be used to position optical detectors relative to mechanical reference points. This approach will eliminate all requirements on positional tolerances. The only requirement is that the PCB is manufactured with oversized holes. An exaggerated sketch of this situation is shown in Figure 2. The sketch shows very loose tolerances on mounting the optical detector in the chip carrier, loose tolerance on soldering the chip carrier to the PCB, and finally large tolerance on where the mounting screws are located. The PCB is held with large screws and oversized holes. The PCB is mounted loosely so it can move freely around. The optical CMM measures the mechanical reference points. Based on these measurements, the required positions of the optical detector corners can be calculated. The optical CMM is commanded to go to the position where one detector corner is supposed to be. This is indicated with the cross-hairs in Figure 2(a). This figure is representative of the image of the optical CMM monitor. Using a suitable tapping tool, the PCB is manually tapped around until the corner of the optical detector is at the crosshairs of the optical CMM. The CMM is commanded to another corner, and the process is repeated a number of times until all corners of the optical detector are within a distance of 10 to 30 microns of the required position. The situation is sketched in Figure 2(b) (the figure also shows the tapping tool and where to tap). At this point the fasteners for the PCB are torqued slightly so the PCB can still move. The PCB location is adjusted again with the tapping tool. This process is repeated 3 to 4 times until the final torque is achieved. The oversized mounting holes are then filled with a liquid bonding agent to secure the board in position (not shown in the sketch). A 10- to 30-micron mounting accuracy has been achieved utilizing this method..

Liebe, Carl Christian↗
NASA NTRS2022

KSC Headquarters Building Area SWMU 104 Soil Interim Measure Report for LOC 2D and LOC 2E Kennedy Space Center, Florida

This Interim Measure (IM) Report for Location of Concern (LOC) 2D and LOC 2E summarizes the activities associated with implementation of an IM to address soil and concrete contamination at the Kennedy Space Center (KSC) Headquarters Building Area (KHQA) located at KSC, Florida. KHQA has been designated Solid Waste Management Unit (SWMU) 104 under KSC’s Resource Conservation and Recovery Act Corrective Action Program. The IM consisted of excavating/removing residual polychlorinated biphenyl (PCB) contamination in soil and concrete from two separate areas, LOC 2D and LOC 2E, which were associated with electrical transformer locations. IM activities were conducted in accordance with the Interim Measure Work Plan (IMWP), Revision 1, for KHQA dated June 2018, which was approved by the Florida Department of Environmental Protection in a correspondence letter dated April 2016 and the United States Environmental Protection Agency in a correspondence letter dated August 2018. The objective of the IM was to remove all remaining contaminated media with total PCB concentrations greater than the State of Florida Residential Soil Cleanup Target Level (RSCTL) (0.5 milligrams per kilogram [mg/kg]). This cleanup goal meets unrestrictive re-use conditions in Florida, and is below federal regulations for PCB Bulk Remediation Waste Cleanup of 1 mg/kg for high occupancy, unrestricted use areas, as outlined in 40 Code of Federal Regulations (CFR) 761.61(a). The timeline of the IM was coordinated with demolition of the former KSC Headquarters Building (demolished in 2021) in order to safely remove contaminated media after electrical equipment was de-energized and removed from the site. Excavation activities were conducted between January 10, 2022, and February 8, 2022, and included two waste streams for off-site disposal: (1) PCB-remediation waste greater than or equal to 50 mg/kg, and (2) PCB-remediation waste less than 50 mg/kg. A total of approximately 347 cubic yards (478 tons) of PCB-contaminated soil and concrete was initially removed from the LOC 2D and LOC 2E areas, as defined in the IMWP. An additional 4.35 tons of soil and concrete were removed based on verification sampling, which was conducted until the cleanup goal was achieved. The total area of excavation from both LOC 2D and LOC 2E was approximately 5,186 square feet (0.12 acres), and excavation depths ranged from 0.5 to 4.0 feet below land surface Excavated soils and concrete were stockpiled based on waste stream and subsequently transported and disposed of at Waste Connections of Osceola County, LLC – JED Landfill in St. Cloud, Florida (PCBs less than 50 mg/kg) or the Chemical Waste Management Landfill in Emelle, Alabama (PCBs greater than or equal to 50 mg/kg). Following excavation, clean backfill was brought to the site and provided to the Demolition Contractor to complete backfill and grading in conjunction with their final site restoration activities from building demolition. Post-IM groundwater sampling was conducted in May 2022 at three monitoring wells installed in April 2022 to confirm that PCBs did not leach into groundwater. These wells were installed where the highest PCB concentrations were detected at LOC 2D, LOC 2E, and from the Building Perimeter IM (previously completed in 2020). All PCB results in groundwater were non-detect. Volatile organic compounds were also analyzed based on potential past use of solvents in transformers with PCB-dielectric fluids and the potential release of dielectric fluids containing volatile organic compounds, and all results were non-detect. Based on completion of a successful IM at LOC 2D and LOC 2E, as well as previous remedial actions that have addressed other contamination at KHQA (SWMU 104), No Further Action without controls will be recommended for SWMU 104. NASA will submit separate Site Rehabilitation Completion Order request documentation for SWMU 104 to support an NFA without controls recommendation.

PCB↗