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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2025

Underlying data for characterization of phycocyanobilin (PCB) biosynthesis in Galdieria sulphuraria

This dataset contains data for studies of phycocyanobilin (PCB) synthesis in the red alga Galdieria sulphuraria. Red algae such as G. sulphuraria utilize phycobilisomes for light harvesting. The phycobilisomes of early-branching organisms such as G. sulphuraria or Cyanidioschyzon merolae contain PCB chromophores but not phycoerythrobilin (PEB), in contrast to the phycobilisomes of other red algae. The studies reported in this dataset examine biosynthesis of PCB in G. sulphuraria and C. merolae, starting from biliverdin IX-alpha (BV), the last known common precursor for PCB and PEB. In cyanobacteria, phages, green algae, and land plants, conversion of BV into PCB or PEB is carried out by a family of enzymes called ferredoxin-dependent bilin reductases (FDBRs). The current studies demonstrate that G. sulphuraria, but not C. merolae, require the action of an additional isomerase to synthesize PCB.

59 BASIC BIOLOGICAL SCIENCES↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origami-inspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigid-flex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL's Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

John Bell↗
NASA NTRS2022

Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations

The use of rigid-flex printed circuit board (PCB) as primary structure has the potential to reduce the weight and volume of robotic systems. In the case of robotics for interplanetary exploration, these systems can leverage origamiinspired folding for increased mobility options and reduced storage volume. Folding rigid-flex PCB robotics can be constructed with rigid PCB connected by short Nomex fabric hinges coupled with flex PCB ribbon cables that permits enhanced system flexibility and energy dissipation to promote impact survivability. This paper presents a design methodology of rigidflex PCB systems with an emphasis on impact resistance. The design process considers solder joint adequacy, panel bending, and fracture using a finite element (FE) model. The proposed design methodology is developed using a case study with NASA JPL’s Pop-Up Folding Flat Explorer Robot (PUFFER). First, the finite-element (FE) modeling methodology is presented with consideration to both frequency and time-domain modeling applications, which include operational self-contact analysis and high impact scenarios. The time-domain impact modeling methodology utilizes hyperelastic material properties for the Nomex hinges. This modeling method is validated using image correlation of PUFFER drop tests. A flowchart is presented to guide users through a validated Abaqus modeling procedure for highly flexible rigid-flex systems. Next, a case study is presented in which PUFFER is subject to drop heights representative of falls into Lunar pits and then the design is refined for a more optimum impact performance. Finally, the results of the case study are used to inform a generalized design methodology for rigid-flex PCB robotics subject to high-impact loads with the considerations presented.

de la Croix, Jean-Pierre↗
NASA NTRS2011

PCB-Based Break-Out Box

Break-out boxes (BOBs) are necessary for all electrical integration/cable checkouts and troubleshooting. Because the price of a BOB is high, and no work can be done without one, often the procedure stops, simply waiting for a BOB. A less expensive BOB would take less time in the integration, testing, and troubleshooting process. The PCB-based BOB works and looks the same as a standard JPL BOB, called Gold Boxes. The only differences between the old BOB and the new PCB-based BOB is that the new one has 80 percent of its circuitry in a printed circuit board. This process reduces the time for fabrication, thus making the BOBs less expensive. Moreover, because of its unique design, the new BOBs can be easily assembled and fixed. About 80 percent of the new PCB-based BOB is in a $22 (at the time of this reporting) custom-designed, yet commercially available PCB. This device has been used successfully to verify that BOB cables were properly made. Also, upon completion, the BOB was beeped out via a multimeter to ensure that all sockets on the connectors were properly connected to the respective banana jack. When compared to the Gold Box BOBs, the new BOB has many advantages. It is much more cost efficient, it delivers equal usability at substantially lower cost of the BOB, and the Gold Box is much heavier when compared to the new BOB. The new BOB is also a bit longer and much more versatile in that connectors are easily changeable and if a banana jack is broken, it can be replaced instead of throwing away an entire BOB.

Lee, Jason H.↗
NASA NTRS2022

Finite Element Modeling of Rigid-Flex PCB Robotic Structures for Dynamic Environments

Rigid-flex circuit boards are becoming moreprevalent as the limits are pushed on the size, mass, and geometryof electronic systems. A key aspect of designing a rigid-flexprinted circuit boards (PCB) system is an assessment of thedynamic properties of the PCB and predicting system perfor-mance under dynamic loading. Among current modeling method-ologies for rigid-flex PCB, a simplified modeling methodology thatadequately captures the system dynamics does not exist. This arti-cle presents a novel, computationally efficient approach formodeling rigid-flex PCB systems and the calibration of the mate-rial models via modal testing. The resulting simplified model isable to capture system frequencies, mode shapes, and representa-tive force-displacement behavior. The proposed methodology isused to model NASA Jet Propulsion Laboratory’s Pop-Up FlatFolding Explorer Robot (PUFFER) and assess the sensitivity of asystem model to input parameters.

John Bell↗
NASA NTRSDate not supplied

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. In order to reject heat effectively the PCB needs to be thermally conductive to the electronics enclosure. However, when the enclosure temperature gets too low, too much heat is rejected from the PCB and it can fail. This thermal switch has been designed to allow for heat rejection when the PCB is sufficiently warm but then greatly reduce heat rejection when the temperature gets low enough.

Jarret Bone↗
NASA NTRS2004

Printed Circuit Board Design (PCB) with HDL Designer

Contents include the following: PCB design with HDL designer, design process and schematic capture - symbols and diagrams: 1. Motivation: time savings, money savings, simplicity. 2. Approach: use single tool PCB for FPGA design, more FPGA designs than PCB designers. 3. Use HDL designer for schematic capture.

Winkert, Thomas K.↗
NASA NTRS1987

Environmental projects. Volume 1: Polychlorinated biphenyl (PCB) abatement program

Six large parabolic dish antennas are located at the Goldstone Deep Space Communications Complex north of Barstow, California. Some of the ancillary electrical equipment of thes Deep Space Stations, particularly transformers and power capicitors, were filled with stable, fire-retardant, dielectric fluids containing substances called polychlorobiphenyls (PCBs). Because the Environmental Protection Agency has determined that PCBs are environmental pollutants toxic to humans, all NASA centers have been asked to participate in a PCB-abatement program. Under the supervision of JPL's Office of Telecommunications and Data Acquisition, a two-year long PCB-abatement program has eliminated PCBs from the Goldstone Complex.

Kushner, L.↗
NASA NTRS2013

Impedance Discontinuity Reduction Between High-Speed Differential Connectors and PCB Interfaces

High-speed serial communication (i.e., Gigabit Ethernet) requires differential transmission and controlled impedances. Impedance control is essential throughout cabling, connector, and circuit board construction. An impedance discontinuity arises at the interface of a high-speed quadrax and twinax connectors and the attached printed circuit board (PCB). This discontinuity usually is lower impedance since the relative dielectric constant of the board is higher (i.e., polyimide approx. = 4) than the connector (Teflon approx. = 2.25). The discontinuity can be observed in transmit or receive eye diagrams, and can reduce the effective link margin of serial data networks. High-speed serial data network transmission improvements can be made at the connector-to-board interfaces as well as improving differential via hole impedances. The impedance discontinuity was improved by 10 percent by drilling a 20-mil (approx. = 0.5-mm) hole in between the pin of a differential connector spaced 55 mils (approx. = 1.4 mm) apart as it is attached to the PCB. The effective dielectric constant of the board can be lowered by drilling holes into the board material between the differential lines in a quadrax or twinax connector attachment points. The differential impedance is inversely proportional to the square root of the relative dielectric constant. This increases the differential impedance and thus reduces the above described impedance discontinuity. The differential via hole impedance can also be increased in the same manner. This technique can be extended to multiple smaller drilled holes as well as tapered holes (i.e., big in the middle followed by smaller ones diagonally).

Navidi, Sal↗
NASA NTRS2018

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗
NASA NTRSDate not supplied

Passive PCB Mounted Thermal Switch

A printed circuit board (PCB) generates heat during operation. In a vacuum this heat can only be rejected by conduction and radiation. To reject heat effectively and avoid overheating, the PCB needs to be thermally conductive to the electronics enclosure. However, if the system rejects too much heat, or not enough heat, either can result in system failure. The thermal switch will be able to regulate the amount of heat the system rejects to stay within the operational temperature range.

Jarret Bone↗
NASA NTRS2014

Initial Field Deployment Results of Green PCB Removal from Sediment Systems (GPRSS)

The goal of this task order was to complete optimization and development of the Green PCB Remediation from Sediment Systems(GPRSSs) technology, culminating in the production of functioning demonstration test units which would be deployed at a suitable demonstration location. This location would be selected in conjunction with Toxicological & Ecological Associates who have entered into a SAA with NASA to partner with and further develop this technology. The GPRSSs technology was initially developed under ESC Task Order 83 with the purpose of providing a green remediation technology capable of in-situ removal and remediation of polychlorinated biphenyls (PCBs) from contaminated sediments. The core concept of the technology, a polymeric blanket capable of absorbing PCBs when in contact with contaminated sediments was then transitioned to Task Order 165 where the primary objective was to fully design and optimize a functioning test unit capable of testing the theoretical and laboratory scale concepts in a real world situation. Results from both task orders are included in this report for completeness, although Task Order 165 focused on the blanket design and the small scale field demonstration in which is currently still ongoing in Altavista, VA.

Deployment↗
NASA NTRS2014

Initial Field Deployment Results of Green PCB Removal from Sediment Systems (GPRSS)

Purpose of Study: (a) Develop/optimize technology capable of removing PCBs from contaminated sediments; (b) Develop design for functional GPRSS unit; (c) Produce and prove functionality of prototype units in a laboratory settings; (d) Produce fully-functional GPRSS units for testing at a demonstration site in Altavista, VA; and (e) Evaluate efficacy of GPRSS technology for the remediation of PCB-contaminated sediments.

Initial Field↗
NASA NTRS2011

PCB-Caulk Replacement Project Johnson Space Center Houston, TX

Wet method reduced exposure by minimizing overall respirable particulate release. Dry method didn't introduce delays for primer/caulk application. Removed caulks came in many forms, from dry powdery to tarry sticky. Varying textures were not sampled or packaged differently. During the course of the project, EPA modified recommended practices to include full containment for exterior caulk removal. Changes are ongoing. Initial recommendations were directed to school buildings. EPA is researching risks due to caulk. Exposure guidance lacking except for 2 of 209 PCB congeners. Work was safely completed on schedule and under budget.

Young, William M.↗
NASA NTRS2012

Calibration of PCB-132 Sensors in a Shock Tube

While PCB-132 sensors have proven useful for measuring second-mode instability waves in many hypersonic wind tunnels, they are currently limited by their calibration. Until now, the factory calibration has been all that was available, which is a single-point calibration at an amplitude three orders of magnitude higher than a second-mode wave. In addition, little information has been available about the frequency response or spatial resolution of the sensors, which is important for measuring high-frequency instability waves. These shortcomings make it difficult to compare measurements at different conditions and between different sensors. If accurate quantitative measurements could be performed, comparisons of the growth and breakdown of instability waves could be made in different facilities, possibly leading to a method of predicting the amplitude at which the waves break down into turbulence, improving transition prediction. A method for calibrating the sensors is proposed using a newly-built shock tube at Purdue University. This shock tube, essentially a half-scale version of the 6-Inch shock tube at the Graduate Aerospace Laboratories at Caltech, has been designed to attain a moderate vacuum in the driven section. Low driven pressures should allow the creation of very weak, yet still relatively thin shock waves. It is expected that static pressure rises within the range of second-mode amplitudes should be possible. The shock tube has been designed to create clean, planar shock waves with a laminar boundary layer to allow for accurate calibrations. Stronger shock waves can be used to identify the frequency response of the sensors out to hundreds of kilohertz.

Berridge, Dennis C.↗
NASA NTRS2014

Green PCB Remediation from Sediment Systems (GPRSS) Project

An ongoing problem facing the global environment community including NASA centers is the removal and remediation of polychlorinated biphenyls (PCBs). PCBs were commonly used in a variety of materials including paints, caulking, and adhesives due to the advantageous physical and chemical properties that PCBs imparted to these various materials. Unfortunately, these properties have made the treatment of sites contaminated with these chemicals extremely difficult to deal with, due to their inherent chemical stability. The remediation of sediments contaminated with PCBs is especially difficult, primarily due to the risk of releasing the contaminant into the environment during the treatment process. Traditional treatment options involve the use of dredging and incineration of the contaminated soils/sediments, in which the chance of releasing the contaminants is greatly increased. The purpose of this project is to develop cleanup technology capable of remediating contaminated sediments in-situ, with minimum intrusion. This allows for the minimization of any potential contaminant release during the treatment process, providing a safer method for cleanup operations (as opposed to dredging/incineration) and still treating the basic problem of PCB contamination (as opposed to capping).

System↗
NASA NTRS2017

Ultra-Wideband Array in PCB for Millimeter-Wave 5G and ISM

Next generation 5G mobile architectures will take advantage of the millimeter-wave spectrum to deliver unprecedented bandwidth. Concurrently, there is a need to consolidate numerous disparate allocations into a single, multi-functional array. Existing arrays are either narrow-band, prohibitively expensive or cannot be scaled to these frequencies. In this paper, we present the first ultra-wideband millimeter-wave array to operate across the six 5G and ISM bands spanning 24-71 GHz. Critically, the array is realized using low-cost PCB. The design concept and optimized layout are presented, and fabrication and measurement considerations are discussed.

Ultra-Wideband Array↗
NASA NTRS2017

Ultra-Wideband Array in PCB for Millimeter-Wave 5G and ISM

Growing mobile data consumption has prompted the exploration of the millimeter-wave spectrum for large bandwidth, high speed communications. However, the allocated bands are spread across a wide swath of spectrum: Fifth generation mobile architecture (5G): 28, 38, 39, 6471 GHz; Industrial, Scientific, and Medical bands (ISM): 24, 60 GHz. Moreover, high gain phased arrays are required to overcome the significant path loss associated with these frequencies. Further, it is necessary to incorporate several of these applications in a single, small size and low cost platform. To this end, we have developed a scanning, Ultra-Wideband (UWB) array which covers all 5G, ISM, and other mm-W bands from 2472 GHz. Critically, this is accomplished using mass-production Printed Circuit Board (PCB) fabrication. The results of this work are presented in this poster.

Milli-Meter Wave↗