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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 343 records · Page 19
All sourcesNASA NTRSDOE OSTI
DOE OSTI2022

Analysis of electrically conductive adhesives in shingled solar modules by X-ray imaging techniques

The failure mechanisms of electrically conductive adhesives (ECAs) in solar modules are difficult to study since the ECA layer is not easily accessible within the module package. In this work, we present two complementary imaging modalities—X-ray radiography and X-ray microcomputed tomography (XCT)—that reveal important morphological features of the ECA within a shingled module. X-ray radiography uses single X-ray projections to provide fast and non-destructive imaging of the shingled interconnection, illuminating the alignment of the ECA relative to the busbars, the size and shape of the ECA, and the presence of voids within it. Through X-ray radiography, we observed, for example, that the average void coverage area of ECA segments reduced from 36.7% to 4.4% when an ECA was cured for 60 s prior to module lamination. XCT is a three-dimensional imaging technique that can identify regions in which the ECA makes electrical contact to busbars on cells and regions in which the ECA has cracked, among other features. XCT can also be used to image the individual metal particles within ECA, from which the metal volume fraction of an ECA was found here to be 70.4%. This is a quantity that is not often reported by ECA manufacturers but is important to ensure isotropic conduction. As X-ray projections can be performed non-destructively on full modules, the technique may be used to pinpoint ECA failures in accelerated degradation testing. XCT is complementary and is suited to forensic analysis of failing modules.

14 SOLAR ENERGY↗
DOE OSTI2025

Pressure effects on lithium anode/nickel-manganese-cobalt oxide cathode pouch cells through fixture design

Applying external pressure to a pouch cell results in improved performance, implicating systems-level design of batteries. Here, different formats and amounts of external pressure to Li-Li x Ni 0.8 Mn 0.1 Co 0.1 O 2 (Li-NMC811) pouch cells were studied under lean electrolyte conditions. Due to the more uniform lithium plating/stripping, a constant gap fixture that retains the distance of the frame during cycling performed greater than a constant pressure fixture that retains applied pressure to the cell. In addition, the use of flexible foam in a constant gap fixture revealed enhanced cycle life at 10 psi; however, at 30 psi, the use of a rigid plate extended cycle life to over 250 cycles, while the foam severely shortened cycle life. This discrepancy with pressure was proven to be driven by stress distribution on cell components. The failure mechanisms and the effects of pressure fixture design on cell components were unveiled, shedding light on improving high-energy battery performance through at-scale fixture design.

25 - ENERGY STORAGE↗
NASA NTRS1991

Detailed analysis and test correlation of a stiffened composite wing panel

Nonlinear finite element analysis techniques are evaluated by applying them to a realistic aircraft structural component. A wing panel from the V-22 tiltrotor aircraft is chosen because it is a typical modern aircraft structural component for which there is experimental data for comparison of results. From blueprints and drawings supplied by the Bell Helicopter Textron Corporation, a very detailed finite element model containing 2284 9-node Assumed Natural-Coordinate Strain (ANS) elements was generated. A novel solution strategy which accounts for geometric nonlinearity through the use of corotating element reference frames and nonlinear strain displacements relations is used to analyze this detailed model. Results from linear analyses using the same finite element model are presented in order to illustrate the advantages and costs of the nonlinear analysis as compared with the more traditional linear analysis. Strain predictions from both the linear and nonlinear stress analyses are shown to compare well with experimental data up through the Design Ultimate Load (DUL) of the panel. However, due to the extreme nonlinear response of the panel, the linear analysis was not accurate at loads above the DUL. The nonlinear analysis more accurately predicted the strain at high values of applied load, and even predicted complicated nonlinear response characteristics, such as load reversals, at the observed failure load of the test panel. In order to understand the failure mechanism of the panel, buckling and first ply failure analyses were performed. The buckling load was 17 percent above the observed failure load while first ply failure analyses indicated significant material damage at and below the observed failure load.

Davis, D. Dale, Jr.↗
DOE OSTI2021

Large rotations of the grain-scale stress tensor during yielding set the stage for failure

The stress-state within individual grains in a polycrystal determine the fate of the aggregate including mechanical failure. By tracking the evolution of the stress tensor throughout the elastoplastic transition, large rotations of the stress-state, which have long been theorized to occur, are observed experimentally for the first time. These stress rotations (~15°) are more than an order of magnitude larger than the concomitant crystallographic lattice reorientations (~0.9°) well-known to occur during metal plasticity. Furthermore, these rotations are accompanied by a decrease in stress triaxiality within certain grains, promote strain softening, and set the stage for failure at an early stage of deformation. Finally, these results provide a completely new perspective through which to contemplate the question of “hot-spots” responsible for failure of high-performance structural materials.

36 MATERIALS SCIENCE↗
NASA NTRS1982

Design solutions for the solar cell interconnect fatigue fracture problem

Mechanical fatigue of solar cell interconnects is a major failure mechanism in photovoltaic arrays. A comprehensive approach to the reliability design of interconnects, together with extensive design data for the fatigue properties of copper interconnects, has been published. This paper extends the previous work, developing failure prediction (fatigue) data for additional interconnect material choices, including aluminum and a variety of copper-Invar and copper-steel claddings. An improved global fatigue function is used to model the probability-of-failure statistics of each material as a function of level and number of cycles of applied strain. Life-cycle economic analyses are used to evaluate the relative merits of each material choce. The copper-Invar clad composites demonstrate superior performance over pure copper. Aluminum results are disappointing.

Mon, G. R.↗
NASA NTRS2017

Multiscale Fiber Kinking: Computational Micromechanics and a Mesoscale Continuum Damage Mechanics Models

In this work, the fiber kinking phenomenon, which is known as the failure mechanism that takes place when a fiber reinforced polymer is loaded under longitudinal compression, is studied. A computational micromechanics model is employed to interrogate the assumptions of a recently developed mesoscale continuum damage mechanics (CDM) model for fiber kinking based on the deformation gradient decomposition (DGD) and the LaRC04 failure criteria.

Herraez, Miguel↗
DOE OSTI2022

Mechanical Properties of High-Temperature Fiber-Reinforced Thermoset Composites with Plain Weave and Unidirectional Carbon Fiber Fillers

Fiber-reinforced thermoset composites are a class of materials that address the arising needs from the aerospace and hypersonic industries for high specific strength, temperature-resistant structural materials. Among the high-temperature resistant thermoset categories, phenolic triazine (PT) cyanate esters stand out thanks to their inherent high degradation temperature, glass transition temperature, and mechanical strength. Despite the outstanding properties of these thermosets, the performance of carbon fiber composites using PT cyanate esters as matrices has not been thoroughly characterized. This work evaluated PT and carbon fiber composites’ compressive properties and failure mechanisms with different fiber arrangements. A PT resin with both plain weave (PW) and non-crimped unidirectional (UD) carbon fiber mats was analyzed in this research. Highly loaded thermoset composites were obtained using process temperatures not exceeding 260 °C, and the composites proved to retain compressive strength at temperatures beyond 300 °C. Compressive testing revealed that PT composites retained compressive strength values of 50.4% of room temperature for UD composites and 61.4% for PW composites. Post-compressive failure observations of the gage section revealed that the mechanisms for failure evolved with temperature from brittle, delamination-dominant failure to shear-like failure promoted by the plastic failure of the matrix. This study demonstrated that PT composites are a good candidate for structural applications in harsh environments.

Hall, Samuel Ernesto↗
DOE OSTI2022

MECHANICAL PERFORMANCE EVALUATION OF THE PRINTED CIRCUIT HEAT EXCHANGER CORE EXPERIMENTS UNDER TENSION AND PRESSURE LOADING

The printed circuit heat exchanger (PCHE) has small channels with high surface area, making them an efficient solution for next-generation nuclear plants (NGNPs). These PCHEs are fabricated through a diffusion bonding process. This fabrication step changes the microstructure of wrought metal plates. The current ASME design code does not support the PCHE design for NGNPs due to a lack of test data. Hence, there has been initiative towards elevated temperature mechanical property characterization of the diffusion bonded material. One of the most common channel shapes is a semicircular channel with sharp corners. These corners act as a stress riser at the diffusion bonding interface. Evaluating elevated temperature mechanical performance of diffusion bonded material in the presence of stress risers is an essential step towards the ASME code development of PCHE design. This study selected two specimen geometries: the first is a PCHE bar specimen for tensile loading with three rows and three columns of channels, and the second is a lab-scaled PCHE with six rows and eight columns of channels. A set of elevated temperature monotonic and cyclic tests were conducted on the PCHE bar specimen to evaluate the mechanical performance under axial tensile loadings to study the failure mechanism. The lab-scaled PCHE specimens were tested under overpressure loads at room temperature, and pressure creep and pressure creep-fatigue loadings to mimic the realistic loading conditions observed in typical NGNPs. The X-ray scans of channeled specimens show interesting observations. The test results and observations are presented in the paper.

36 MATERIALS SCIENCE↗
NASA NTRS1980

Hot tensile tests of Inconel 718

The physical metallurgy of near-solidus integranular cracking in Inconel 718 welds was investigated. The data, although inconclusive, suggest at least two mechanisms which might explain intergranular cracking (microfissuring) in the heat-affected zone of several high temperature alloys. One theory is based on the separation of intergranular liquid while the other involves mechanical failure of solid ligaments surrounded by intergranular liquid. Both mechanisms concentrate strain in the grain boundaries resulting in low strain (1%) intergranular brittleness. The mechanisms reported might also pertain to the physical metallurgy of casting, powder metallurgy sintering and hot isostatic pressing.

Source record↗
NASA NTRS1990

Space station common module network topology and hardware development

Conceptual space station common module power management and distribution (SSM/PMAD) network layouts and detailed network evaluations were developed. Individual pieces of hardware to be developed for the SSM/PMAD test bed were identified. A technology assessment was developed to identify pieces of equipment requiring development effort. Equipment lists were developed from the previously selected network schematics. Additionally, functional requirements for the network equipment as well as other requirements which affected the suitability of specific items for use on the Space Station Program were identified. Assembly requirements were derived based on the SSM/PMAD developed requirements and on the selected SSM/PMAD network concepts. Basic requirements and simplified design block diagrams are included. DC remote power controllers were successfully integrated into the DC Marshall Space Flight Center breadboard. Two DC remote power controller (RPC) boards experienced mechanical failure of UES 706 stud-mounted diodes during mechanical installation of the boards into the system. These broken diodes caused input to output shorting of the RPC's. The UES 706 diodes were replaced on these RPC's which eliminated the problem. The DC RPC's as existing in the present breadboard configuration do not provide ground fault protection because the RPC was designed to only switch the hot side current. If ground fault protection were to be implemented, it would be necessary to design the system so the RPC switched both the hot and the return sides of power.

Anderson, P.↗
NASA NTRS2018

A Nonlocal Progressive Damage Model for Composite Materials

Fiber reinforced composite materials are widely used in aerospace structures due to their high specific stiffness and strength. These materials exhibit complex deformation, damage and failure mechanisms under high strain rate loading conditions. Many different failure criteria have been proposed in literature to describe the damage initiation and evolution of fiber reinforced composite materials. Most of these damage models are based on a local framework. In a local framework, the material behavior is based on a point-wise constitutive relation which is independent of the effect of the surrounding points. These models include stiffness degradation when damage initiates in the material, which within a local framework leads to a highly mesh dependent result. This could be overcome using a nonlocal finite element approach. In the current work, a nonlocal formulation based on the work by Andrade et al [1] is adapted to describe composite material behavior. The LS-DYNA rate dependent progressive damage model, MAT162 is employed to detect the initiation and evolution of damage in orthotropic composite materials. This model is developed as a FORTRAN user material subroutine in the LS-DYNA environment. The results of MAT162 with and without the nonlocal formulation are compared at different mesh densities to validate the model. The numerical analysis exhibits the advantages of the nonlocal formulation.

Kodagali, Karan↗
DOE OSTI2022

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Accelerated experiments conducted at NREL reveal that high-lead solder joints have better reliability than sintered silver under extreme thermal cycling conditions. Furthermore, efforts to develop a crack propagation model for the high-temperature materials are described.

ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2022

Bonded Interfaces for High-Temperature Power Electronics

Wide-bandgap devices have pushed the operational limit of semiconductor devices in automotive power electronics packages to higher temperatures (>200 degrees C). While a higher efficiency can be achieved through the use of wide-bandgap devices, the entire package must be re-designed with components that can withstand the higher temperature limits. Sintered silver and transient liquid phase bonds are potential candidates as bonded materials for use in higher temperatures however, the underlying mechanics of deformation under thermal loads and the resulting failure mechanisms in these materials are not well understood. Furthermore, thermomechanical modeling plays a key role in understanding the degradation behavior of bonded interface materials and for design optimization of power electronics packages.

ADVANCED PROPULSION SYSTEMS,DIRECT ENERGY CONVERSI↗
NASA NTRS2017

Applications of Fracture Mechanics to Quantitative Accelerated Life Testing of Plastic Encapsulated Microelectronics

Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.

Accelerated testing↗
NASA NTRS2014

Modeling Quasi-Static and Fatigue-Driven Delamination Migration

An approach was proposed and assessed for the high-fidelity modeling of progressive damage and failure in composite materials. It combines the Floating Node Method (FNM) and the Virtual Crack Closure Technique (VCCT) to represent multiple interacting failure mechanisms in a mesh-independent fashion. Delamination, matrix cracking, and migration were captured failure and migration criteria based on fracture mechanics. Quasi-static and fatigue loading were modeled within the same overall framework. The methodology proposed was illustrated by simulating the delamination migration test, showing good agreement with the available experimental data.

De Carvalho, N. V.↗
DOE OSTI2020

Failure analysis of field-failed bypass diodes

Defective bypass diodes are often found as the largest factor leading to power loss in solar modules. Here, we report on failure mechanisms by investigating shunted bypass diodes from a rooftop installation, using a combination of multiple characterizations including current–voltage analysis, thermal-runaway testing, X-ray computed tomography, lock-in thermography, focused ion-beam cross-section imaging, chemical decapsulation, optical microscopy, and scanning electron microscopy with energy-dispersive X-ray spectroscopy. Differing from static discharge typically associated with lightning strikes on modules, we found diode failure by the mechanism of thermal damage under continuous, long-term overstress in forward bias. Our conclusion is based on evidence of energy dissipated—the small to medium extent of melt-through on the Schottky diode face. The diode failure shows distortions or roughening of the Schottky diode metal-semiconductor interface with the die attach, and some failures are accompanied by die-attach solder melting. We propose that nonuniform irradiance on the modules caused diode shunting due to extended periods of heat dissipation in the modules, because modules in this string were placed in two different orientations. In contrast, a second parallel module string of the same module type on the same rooftop with a unique plane of array did not show any diode failures. The thermal damage failure of melt-through was caused by the long-term current generated by overstressing of diodes that may have had crystalline and impurity defects.

14 SOLAR ENERGY↗