Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “SEMICONDUCTOR MATERIALS”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 343 records · Page 19
All sourcesNASA NTRSDOE OSTI
NASA NTRS1985

Crystal Growth of Device Quality Gaas in Space

The GaAs research evolves about these key thrust areas. The overall program combines: (1) studies of crystal growth on novel approaches to engineering of semiconductor material (i.e., GaAs and related compounds); (2) investigation and correlation of materials properties and electronic characteristics on a macro- and microscale; and (3) investigation of electronic properties and phenomena controlling device applications and device performance. This effort is aimed at the essential ground-based program which would insure successful experimentation with and eventually processing of GaAs in near zero gravity environment. It is believed that this program addresses in a unique way materials engineering aspects which bear directly on the future exploitation of the potential of GaAs and related materials in device and systems applications.

Gatos, H. C.↗
NASA NTRS1985

Energy Stability of Thermocapillary Convection in Models of the Float Zone Process

The energy-stability of thermocapillary convection in models of the float-zone, crystal-growing process was studied. Stability limits, as functions of pertinent parameters, that will identify conditions which will not allow the existence of an undesirable oscillatory flow instability were determined. Such instabilities may occur in the space processing of semiconductor materials. The determination of the stability limits will involve two sets of numerical computations: (1) solution of the nonlinear governing equations together with the appropriate boundary conditions to determine the basic state (in general, velocity, pressure and temperature fields and the displacement of free surfaces and interfaces); and (2) solution of a nonlinear Euler-Lagrange systems for the energy-stability limit. Both computations, while difficult, should be within the scope of available computer capability and available concepts in numerical analysis. Finite-element methods are attractive candidates for the numerical work.

Neitzel, G. P.↗
NASA NTRS1986

Overcash, D. R.

The objectives of this investigation were to determine the characteristics of semiconductor devices at low temperatures. The output characteristics of several currently available semiconductor devices and devices fabricated at Marshall Space Flight Center were measured over a range of gate voltages. Large variations in low-temperature performance, not only from type to type, but from field effect transistor (FET) to FET of the same type were obtained. By increasing the carrier concentrations at low temperatures through extra heavy doping, metal oxide semiconductor field effect transistor (MOSFET) device was fabricated that operated at 4.2K. To verify the low-temperature operation of a heavily doped device, this procedure was repeated. Their noise spectrum was analyzed at 4.2K. Suggestions were made as to possible fabrication methods, techniques, and other semiconductor materials that might improve the device charactersitics at low temperatures. A procedure for using an electric field to drift dopants through the insulating oxide to produce a very thin, heavily doped region under the gate of a MOSFET was initiated. Capacitance s a function of voltage plots was suggested as a method for determining the level of dopant drift.

Source record↗
NASA NTRS1985

Acoustic emission monitoring crack propagation in single crystal silicon

The feasibility of acoustic emission (AE) monitoring of cracking and crack propagation in Si semiconductor materials was evaluated experimentally. A double torsion load relaxation method was employed wherein the propagation velocity and the AE levels in precracked (but not notched) boron-doped wafers were recorded simultaneously. A numerical model for the critical stress intensity factor (KIC) was used to relate the crack growth velocity, the instantaneous load and the load relaxation rate. All specimens were monitored with acoustic transducers at six points and examined with SEM after failure. The AE levels reached a peak amplitude of 70 dB at a KIC of 0.997 MNm to the -3/2 for cracking in the 111 plane. No AE was detected before the load reached the KIC, indicating that no subcritical crack growth occurs in Si. The results support the use of AE for monitoring crack propagation in crystal Si.

Chen, C. P.↗
NASA NTRS1987

Growing II/VI Semiconductors With Double Decantation

Concept for growing single crystals combines sheet solidification with controlled cooling. Proposed method for II/VI semiconductor compounds cools newly solidified crystal gradually and nearly isothermally so few defects formed. Method obtains maximum amount of crystal from minimum amount of melt. Double decantation causes sheet crystal to cool first in liquid, then in gas. Vessel tilted to pour off molten semiconductor material. Second tilt, in opposite direction, pours off encapsulant.

Morrison, Andrew D.↗
NASA NTRS1986

High band gap 2-6 and 3-5 tunneling junctions for silicon multijunction solar cells

A multijunction silicon solar cell of high efficiency is provided by providing a tunnel junction between the solar cell junctions to connect them in series. The tunnel junction is comprised of p+ and n+ layers of high band gap 3-5 or 2-6 semiconductor materials that match the lattice structure of silicon, such as GaP (band gap 2.24 eV) or ZnS (band gap 3.6 eV). Each of which has a perfect lattice match with silicon to avoid defects normally associated with lattice mismatch.

Daud, Taher↗
NASA NTRS1988

Imaging Of Directional-Solidification Interfaces

X-ray and gamma-ray technique developed at NASA Langley Research Center enables melt/solid interface to be observed visually during crystal growth by directional solidification in Bridgman furnace. Technique used to observe movement and shape of interface in germanium and in lead tin telluride. Valuable tool in efforts to grow seeded semiconductor materials in Bridgman furnaces.

Fripp, Archibald L., Jr.↗
NASA NTRS1988

Electron Beam "Writes" Silicon On Sapphire

Method of growing silicon on sapphire substrate uses beam of electrons to aid growth of semiconductor material. Silicon forms as epitaxial film in precisely localized areas in micron-wide lines. Promising fabrication method for fast, densely-packed integrated circuits. Silicon deposited preferentially in contaminated substrate zones and in clean zone irradiated by electron beam. Electron beam, like surface contamination, appears to stimulate decomposition of silane atmosphere.

Heinemann, Klaus↗
NASA NTRS1987

High-temperature electronics

In recent years, there was a growing need for electronics capable of sustained high-temperature operation for aerospace propulsion system instrumentation, control and condition monitoring, and integrated sensors. The desired operating temperature in some applications exceeds 600 C, which is well beyond the capability of currently available semiconductor devices. Silicon carbide displays a number of properties which make it very attractive as a semiconductor material, one of which is the ability to retain its electronic integrity at temperatures well above 600 C. An IR-100 award was presented to NASA Lewis in 1983 for developing a chemical vapor deposition process to grow single crystals of this material on standard silicon wafers. Silicon carbide devices were demonstrated above 400 C, but much work remains in the areas of crystal growth, characterization, and device fabrication before the full potential of silicon carbide can be realized. The presentation will conclude with current and future high-temperature electronics program plans. Although the development of silicon carbide falls into the category of high-risk research, the future looks promising, and the potential payoffs are tremendous.

Seng, Gary T.↗
NASA NTRS1987

Analysis of the fluid dynamics and heat transfer during micro-gravity Bridgman-Stockbarger growth of semiconductors in steady periodic gravitational fields

The effect of periodic variations in the magnitude and direction of gravitational acceleration on buoyancy-driven convection in the melt during microgravity growth of low Prandtl number semiconductor materials in Brigdman-Stockbarger configuration is investigated through the numerical solution of the transient Navier-Stokes and energy equations. Results are presented over a wide range of Rayleigh numbers and frequency spectrum of periodic g-level variations corresponding to conditions present on earth and on board spacecrafts. The frequency response of convection in the melt during growth is found to be similar to that of a first order dynamic system with a cutoff frequency determined by the diffusion of momentum in the system. Results indicate that during growth of small diameter Germanium crystals, convection in the melt is insensitive to the measured g-gitter on board the shuttle.

Griffin, Patrick R.↗
NASA NTRS1989

Composite Semiconductor Substrates

Epitaxial structure of three semiconductor materials - silicon, gallium arsenide, and cadmium telluride - makes possible integrated monolithic focal-plane arrays of photodectors. Silicon layer contains charge-coupled devices, gallium arsenide layer contains other fast electronic circuitry, and cadmium telluride layer serves as base for array of mercury cadmium telluride infrared sensors. Technique effectively combines two well-established techniques; metalorganic chemical-vapor deposition (MOCVD) and molecular-beam epitaxy (MBE). Multilayer structure includes HgCdTe light sensors with Si readout devices and GaAs signal-processing circuits. CdTe layer provides base for building up HgCdTe layer.

Nouhi, Akbar↗
NASA NTRS1988

Communications technology

The objective of the Communications Technology Program is to enable data transmission to and from low Earth orbit, geostationary orbit, and solar and deep space missions. This can be achieved by maintaining an effective, balances effort in basic, applied, and demonstration prototype communications technology through work in theory, experimentation, and components. The program consists of three major research and development discipline areas which are: microwave and millimeter wave tube components; solid state monolithic integrated circuit; and free space laser communications components and devices. The research ranges from basic research in surface physics (to study the mechanisms of surface degradation from under high temperature and voltage operating conditions which impacts cathode tube reliability and lifetime) to generic research on the dynamics of electron beams and circuits (for exploitation in various micro- and millimeter wave tube devices). Work is also performed on advanced III-V semiconductor materials and devices for use in monolithic integrated analog circuits (used in adaptive, programmable phased arrays for microwave antenna feeds and receivers) - on the use of electromagnetic theory in antennas and on technology necessary for eventual employment of lasers for free space communications for future low earth, geostationary, and deep space missions requiring high data rates with corresponding directivity and reliability.

Sokoloski, Martin M.↗
NASA NTRS1988

Epitaxial thin film growth in outer space

A new concept for materials processing in space exploits the ultravacuum component of space for thin-film epitaxial growth. The unique LEO space environment is expected to yield 10-ftorr or better pressures, semiinfinite pumping speeds, and large ultravacuum volume (about 100 cu m) without walls. These space ultravacuum properties promise major improvement in the quality, unique nature, and throughput of epitaxially grown materials, including semiconductors, magnetic materials, and thin-film high-temperature superconductors.

Ignatiev, Alex↗
NASA NTRS1990

Tunable-Quantum-Well Infrared Detector

Proposed detector of infrared photons based on photon-assisted, resonant quantum-mechanical tunneling between adjacent energy wells in its semiconductor structure. Wavelength adjusted by changing applied voltage. Device contains alternating layers of different seminconductors which form double-quantum-well electron-energy structure. Tunable-quantum-well detectors made on single chip constitutes line imager. Many such devices stacked to form two-dimensional imaging device. Signal-processing circuitry integrated into chip at its lower end. Potential barriers and wells produced by alternating layers of different semiconductor materials. Steepness of slope proportional to applied electric field. Electric field and thicknesses and heights of barriers selected to favor photon-assisted, resonant quantum-mechanical tunneling at chosen photon frequency.

Maserjian, Joseph↗
NASA NTRS1990

Controlling Gas-Flow Mass Ratios

Proposed system automatically controls proportions of gases flowing in supply lines. Conceived for control of oxidizer-to-fuel ratio in new gaseous-propellant rocket engines. Gas-flow control system measures temperatures and pressures at various points. From data, calculates control voltages for electronic pressure regulators for oxygen and hydrogen. System includes commercially available components. Applicable to control of mass ratios in such gaseous industrial processes as chemical-vapor depostion of semiconductor materials and in automotive engines operating on compressed natural gas.

Morris, Brian G.↗
NASA NTRS1991

Rapid Dry Etching Of Photoresists Without Toxic Gases

Experimental dry etching technique strips photoresists from semiconductor wafers without damaging semiconductor materials. Makes use of afterglow existing downstream from plasma generated by radio-frequency electric field. Constituents of afterglow react with sacrificial polymer to make reactive gases that quickly etch-away photoresist. Strips quickly at room temperature; not necessary to heat substrates. No hazardous or toxic chemicals used.

Lerner, Narcinda R.↗
NASA NTRS1990

An Ohmic model for charge transport in a semiconductor

This analysis applies to a quasi-neutral region of uniformly doped semiconductor material. The objective is to solve for the current density in terms of the carrier density and the electric potential boundary values. It is shown that the combined effects of drift and diffusion can be calculated by assuming the current density to obey Ohm's law, but with modified electric potential boundary values.

Edmonds, Larry D.↗
NASA NTRS1991

Silicon carbide, an emerging high temperature semiconductor

In recent years, the aerospace propulsion and space power communities have expressed a growing need for electronic devices that are capable of sustained high temperature operation. Applications for high temperature electronic devices include development instrumentation within engines, engine control, and condition monitoring systems, and power conditioning and control systems for space platforms and satellites. Other earth-based applications include deep-well drilling instrumentation, nuclear reactor instrumentation and control, and automotive sensors. To meet the needs of these applications, the High Temperature Electronics Program at the Lewis Research Center is developing silicon carbide (SiC) as a high temperature semiconductor material. Research is focussed on developing the crystal growth, characterization, and device fabrication technologies necessary to produce a family of silicon carbide electronic devices and integrated sensors. The progress made in developing silicon carbide is presented, and the challenges that lie ahead are discussed.

Matus, Lawrence G.↗