Measuring bond strength of Capsule to Fill Tube Assembly (CFTA) at cryogenic temperatures
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Available low temperature thermocouple information and services
Voltage vs temperature data for thermocouple pairs at low temperatures - cryogenic temperature
VOLTAGE↗
Cryogenic Electronics development for High Energy Physics
In the quest to study the fundamental nature of matterand the universe, High Energy Physics (HEP) experimentsoften operate in extreme conditions that lie well outside thestandard operating range of integrated circuits. Two prominentexamples of such extreme environments are the irradiationlevels experienced at high luminosity colliders, as well asoperation at cryogenic temperatures. Cryogenic electronicsis a broad term that encompasses circuits operating at temperatures below the standard operating limit (-55°C in the caseof military grade electronics), all the way down to millikelvin,as in the case of superconducting circuits. Cryogenic circuitshave a long history and have found applications in abroad spectrum of applications, such as infrared focal planearrays, PET, quantum science. While CMOS circuits have beenreliably operated at deep cryogenic temperatures (<4.2K),this article focuses on applications down to liquid Nitrogen(77K), and provides an overview on the design considerations,benefits, and unique challenges pertaining to cryogenic CMOSICs for large HEP experiments.
46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
Scattering-type scanning near-field optical microscopy with Akiyama piezo-probes
Recent developments of the scattering-type scanning near-field optical microscope at cryogenic temperatures (cryogenic s-SNOM or cryo-SNOM) have led to many breakthroughs in the studies of low energy excitations in quantum materials. However, the simultaneous demands on vibration isolation, low base temperature, precise nano-positioning, and optical access make the construction of a cryo-SNOM a daunting task. Adding to the overhead space required for a cryo-SNOM is the atomic force microscopy control, which predominantly utilizes a laser-based detection scheme for determining the cantilever tapping motion. In this work, we provide an alternative and straightforward route to performing s-SNOM using metal-coated Akiyama probes, where the cantilever tapping motion is detected through a piezoelectric signal. We show that the Akiyama-based cryo-SNOM attains high spatial resolution, good near-field contrast, and is able to perform imaging with a significantly more compact system compared to other cryo-SNOM implementations. Our results firmly establish the potential of s-SNOM based on self-sensing piezo-probes, which can easily accommodate far-infrared wavelengths and high magnetic fields in the future.
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
Evaluation of GE-167 Silicone Rubber (RTV) For Possible Service As A Moisture-Barrier For Certain Strain Gage Applications
The Langley Research Center uses strain gages in a wide variety of demanding test environments. Strain gage installations, depending on the testing scenario, may see high temperatures, cryogenic temperature, moisture accumulation, mechanical abuse, or any combination of these conditions. At Langley, there is often a need to provide protection for strain gages against moisture and mechanical abuse, especially when large-scale, harsh environment testing is to be encountered. This technical memorandum discusses the evaluation of a room temperature curing silicone rubber sealant manufactured by the General Electric Company for consideration as a moisture-barrier for certain strain gage installations.
Hare, David A.↗
Development of magnetostrictive active members for control of space structures
The goal of this Phase 2 Small Business Innovative Research (SBIR) project was to determine the technical feasibility of developing magnetostrictive active members for use as truss elements in space structures. Active members control elastic vibrations of truss-based space structures and integrate the functions of truss structure element, actively controlled actuator, and sensor. The active members must control structural motion to the sub-micron level and, for many proposed space applications, work at cryogenic temperatures. Under this program both room temperature and cryogenic temperature magnetostrictive active members were designed, fabricated, and tested. The results of these performance tests indicated that room temperature magnetostrictive actuators feature higher strain, stiffness, and force capability with lower amplifier requirements than similarly sized piezoelectric or electrostrictive active members, at the cost of higher mass. Two different cryogenic temperature magnetostrictive materials were tested at liquid nitrogen temperatures, both with larger strain capability than the room temperature magnetostrictive materials. The cryogenic active member development included the design and fabrication of a cryostat that allows operation of the cryogenic active member in a space structure testbed.
Johnson, Bruce G.↗
Comparison of the Effects of Tool Geometry for Friction Stir Welding Thin Sheet Aluminum Alloys for Aerospace Applications
In this presentation, the results of a recent study on the effect of pin tool design for friction stir welding thin sheets (0.040") of aluminum alloys 2024 and 7075 are provided. The objective of this study was to investigate and document the effect of tool shoulder and pin diameter, as well as the presence of pin flutes, on the resultant microstructure and mechanical properties at both room temperature and cryogenic temperature. Specifically, the comparison between three tools will include: FSW process load analysis (tool forces required to fabricate the welds), Static Mechanical Properties (ultimate tensile strength, yield strength, and elongation), and Process window documenting the range of parameters that can be used with the three pin tools investigated. All samples were naturally aged for a period greater than 10 days. Prior research has shown 7075 may require post weld heat treatment. Therefore, an additional pair of room temperature and cryogenic temperature samples was post-weld aged to the 7075-T7 condition prior to mechanical testing.
Merry, Josh↗
Distributed fibre-optic temperature sensor for cryogenic applications based on detection of boson components of Raman light scattering
The possibility of designing a distributed fibre-optic sensor, allowing one to measure cryogenic temperatures (to liquid nitrogen boiling point), is experimentally demonstrated. The principle of operation of the sensor is based on measuring the intensity of boson peaks of Raman scattering in a fibre material, which are spaced by 1 to 3 THz from the probe frequency. The measurements are performed using a single-mode telecommunication fibre with a 15-μm-thick polyimide coating. The probe wavelength is 1.55 μm, the sensor spatial resolution is 4 m, and the averaging time is 60 s. Experiments are carried out in the temperature range of 75.6 – 79.6 K, with a temperature resolution of 0.5 K. (paper)
36 MATERIALS SCIENCE↗
Characterization of Al-Cu-Li Alloy 2090 Near Net Shape Extrusion
Aluminum-lithium (Al-Li) alloys near net shape extrusions are being evaluated for potential application in launch vehicle structures. The objective of this study was to determine tensile and fracture properties, corrosion resistance, and weldability of integrally stiffened panels of Al-Cu-Li alloy 2090 in the T8 temper. The microstructure was pre-dominantly unrecrystallized. Texture analyses revealed the presence of fiber components in the stiffeners and a combination of fiber and rolling components in the skin. Variations in grain morphology and texture through the extruded cross section were correlated with the tensile, fracture, and corrosion behavior. Tensile strengths at room and cryogenic temperatures of the 2090 extrusions were similar to other 2090 product forms and were higher than 2219-T87, the primary structural material in the Space Shuttle external tank; however, ductilities were lower. The fracture resistance of the 2090 extrusion was lower than 2219-T87 plate at room temperature. At cryogenic temperatures, tensile ductility and fracture behavior of the 2090 extrusion were similar to other 2090 product forms but were lower than 2219-T87 plate. The exfoliation and stress corrosion resistance of the 2090 extrusion compared favorably with the characteristics of other 2090 product forms. The weldability and weldment properties of the extrusions were similar to 2090 and 2219 plates.
Birt, M. J.↗
Fatigue Life of Flow-Formed Aluminum 2195 and 6061 Alloys
The successful design and fabrication of metallic cryotanks for commercial aviation applications require lightweight, durable materials capable of withstanding high pressures and cryogenic temperatures through tens of thousands of thermomechanical refueling cycles. Flow forming is an advanced manufacturing technique that offers high-rate production and scalability for fabricating integrally stiffened cylinders suitable for cryotank applications. This work establishes the durability of flow-formed aluminum alloys by characterizing their fatigue life performance under conditions that mimic cryotank refueling cycles. Residual stresses in flow-formed aluminum-lithium (Al-Li) 2195-T6 cylinders were assessed using the contour method and found to be minimal. Fatigue life testing was conducted on flow-formed Al-Li 2195-T6 at room temperature and cryogenic temperatures (-321°F [-196°C]), with wrought Al-Li 2195-T6 serving as a baseline for comparison. Results showed that flow-formed materials exhibited fatigue performance comparable to or better than wrought materials, with no statistically significant differences observed between different specimen orientations relative to processing directions. Fractography revealed reduced delaminations in the flow-formed Al-Li 2195 samples as compared to wrought, indicating potential improvement to the microstructure that could result in improved service properties. Texture analysis using electron backscattered diffraction (EBSD) indicated recrystallization during heat treatment, potentially contributing to reduced delamination susceptibility. These findings demonstrating flow-formed material durability coupled with the high manufacturing efficiency of flow forming, makes flow forming an attractive process to produce aircraft cryotanks.
EBF3↗
Active Co-Storage of Cryogenic Propellants for Lunar Explortation
Long-term storage of cryogenic propellants is a critical requirement for NASA's effort to return to the moon. Liquid hydrogen and liquid oxygen provide the highest specific impulse of any practical chemical propulsion system, and thus provides the greatest payload mass per unit of launch mass. Future manned missions will require vehicles with the flexibility to remain in orbit for months, necessitating long-term storage of these cryogenic liquids. For decades cryogenic scientific satellites have used dual cryogens with different temperatures to cool instruments. This technology utilizes a higher temperature cryogen to provide a stage that efficiently intercepts a large fraction of the heat that would otherwise be incident on the lower temperature cryogen. This interception reduces the boil-off of the lower temperature cryogen and increasing the overall life-time of the mission. The Active Co-Storage concept is implemented similarly; the 101 K liquid oxygen thermally shields the 24 K liquid hydrogen. A thermal radiation shield that is linked to the liquid oxygen tank shrouds the liquid hydrogen tank, thereby preventing the liquid hydrogen tank from being directly exposed to the 300 K external environment. Modern cryocooler technology can eliminate the liquid oxygen boil-off and also cool the thermal radiation shield thereby reducing the liquid hydrogen boil-off to a small fraction of the unshielded rate. The thermal radiation shield can be a simple conductive shroud or a more sophisticated but lighter Broad Area Cooling (BAC) shroud. The paper describes the design impact of an active co-storage system for the Altair Descent Vehicle. This paper also compares the spacecraft-level impacts of the conductive shroud and the BAC shroud active co-storage concepts with a passive storage option in the context of the different scales of spacecraft that will be used for the lunar exploration effort - the Altair Ascent and Descent Vehicles, the Orion, and the Ares V Earth Departure Stage. The paper also reports on a subscale test of this active co-storage configuration. The test tank is 0.7 m in diameter, approximately one-third the dimension of tanks that would be needed in a lunar ascent module. A thin-walled fiberglass skirt supports and isolates the tank from a 100 K stage. A similar thin-walled skirt supports the lOOK stage from the ambient temperature structure. An aluminum shield with a heavy MLI blanket surrounds the tank and is attached at the 100 K stage. In this initial phase of the project, there is no tank on the 100 K stage, but it is actively cooled by a single-stage cryocooler similar in design to the one used on the RHESSI mission. The test configuration includes a number of innovative elements, including a helical support heat exchanger and an external thermodynamic vent/heat interception system. To avoid the complexity of an explosive gas handling system, testing will be done with liquid helium and liquid neon as simulant fluids. The properties of these fluids bracket the properties of liquid hydrogen. Instrumentation allows tank temperature and shield temperature profiles, tank liquid levels, and pressure drops through the flow lines, to be measured.
Mustafi, S.↗
Cryogenic Temperature-Gradient Foam/Substrate Tensile Tester
The figure shows a fixture for measuring the tensile strength of the bond between an aluminum substrate and a thermally insulating polymeric foam. The specimen is meant to be representative of insulating foam on an aluminum tank that holds a cryogenic liquid. Prior to the development of this fixture, tensile tests of this type were performed on foam/substrate specimens immersed in cryogenic fluids. Because the specimens were cooled to cryogenic temperatures throughout their thicknesses, they tended to become brittle and to fracture at loads below true bond tensile strengths. The present fixture is equipped to provide a thermal gradient from cryogenic temperature at the foam/substrate interface to room temperature on the opposite foam surface. The fixture includes an upper aluminum block at room temperature and a lower aluminum block cooled to -423 F (approx. -253 C) by use of liquid helium. In preparation for a test, the metal outer surface (the lower surface) of a foam/substrate specimen is bonded to the lower block and the foam outer surface (the upper surface) of the specimen is bonded to the upper block. In comparison with the through-the-thickness cooling of immersion testing, the cryogenic-to-room-temperature thermal gradient that exists during testing on this fixture is a more realistic approximation of the operational thermal condition of sprayed insulating foam on a tank of cryogenic liquid. Hence, tensile tests performed on this fixture provide more accurate indications of operational bond tensile strengths. In addition, the introduction of the present fixture reduces the cost of testing by reducing the amount of cryogenic liquid consumed and the time needed to cool a specimen.
Vailhe, Christophe↗
SiC and GaN Devices With Cryogenic Cooling
This article presents the cryogenically cooled application for wide bandgap (WBG) semiconductor devices. Characteristics of silicon carbide (SiC) and gallium nitride (GaN) at cryogenic temperatures are illustrated. SiC MOSFETs exhibit increased on-state resistance and slower switching speed at cryogenic temperatures. However, cryogenic cooling provides low ambient temperature environment and thus enables the SiC converter to operate at lower junction temperature to achieve higher efficiency compared to room temperature cooling. A cryogenically cooled MW-level SiC inverter prototype is developed and demonstrated the feasibility of operating high-power SiC converter with cryogenic cooling. GaN HEMTs exhibit more than five times on-state resistance reduction and faster switching speed at cryogenic temperatures which makes GaN HEMTs an excellent candidate for cryogenic power electronics applications. The significantly reduced on-state resistance of GaN devices provides the possibility to operate them at a current level much higher than rated current at cryogenic temperatures. A GaN double pulse test (DPT) circuit is constructed and demonstrated that GaN HEMTs can operate at nearly four times of rated current at cryogenic temperatures. Challenges of utilizing WBG device with cryogenic cooling are discussed and summarized.
42 ENGINEERING↗
Development of Individually Addressable Micro-Mirror-Arrays for Space Applications
We have been developing a 32 x 32 prototype array of individually addressable Micro-Mirrors capable of operating at cryogenic temperature for Earth and Space Science applications. Micro-Mirror-Array technology has the potential to revolutionize imaging and spectroscopy systems for NASA's missions of the 21st century. They can be used as programmable slits for the Next Generation Space Telescope, as smart sensors for a steerable spectrometer, as neutral density filters for bright scene attenuation etc. The, entire fabrication process is carried out in the Detector Development Laboratory at NASA, GSFC. The fabrication process is low temperature compatible and involves integration of conventional CMOS technology and surface micro-machining used in MEMS. Aluminum is used as the mirror material and is built on a silicon substrate containing the CMOS address circuit. The mirrors are 100 microns x l00 microns in area and deflect by +/- 10 deg induced by electrostatic actuation between two parallel plate capacitors. A pair of thin aluminum torsion straps allow the mirrors to tilt. Finite-element-analysis and closed form solutions using electrostatic and mechanical torque for mirror operation were developed and the results were compared with laboratory performance. The results agree well both at room temperature and at cryogenic temperature. The development demonstrates the first cryogenic operation of two-dimensional Micro-Mirrors with bi-state operation. Larger arrays will be developed meeting requirements for different science applications. Theoretical analysis, fabrication process, laboratory test results and different science applications will be described in detail.
Dutta, Sanghamitra B.↗
Cryogenic Quenching Process for Electronic Part Screening
The use of electronic parts at cryogenic temperatures (less than 100 C) for extreme environments is not well controlled or developed from a product quality and reliability point of view. This is in contrast to the very rigorous and well-documented procedures to qualify electronic parts for mission use in the 55 to 125 C temperature range. A similarly rigorous methodology for screening and evaluating electronic parts needs to be developed so that mission planners can expect the same level of high reliability performance for parts operated at cryogenic temperatures. A formal methodology for screening and qualifying electronic parts at cryogenic temperatures has been proposed. The methodology focuses on the base physics of failure of the devices at cryogenic temperatures. All electronic part reliability is based on the bathtub curve, high amounts of initial failures (infant mortals), a long period of normal use (random failures), and then an increasing number of failures (end of life). Unique to this is the development of custom screening procedures to eliminate early failures at cold temperatures. The ability to screen out defects will specifically impact reliability at cold temperatures. Cryogenic reliability is limited by electron trap creation in the oxide and defect sites at conductor interfaces. Non-uniform conduction processes due to process marginalities will be magnified at cryogenic temperatures. Carrier mobilities change by orders of magnitude at cryogenic temperatures, significantly enhancing the effects of electric field. Marginal contacts, impurities in oxides, and defects in conductor/conductor interfaces can all be magnified at low temperatures. The novelty is the use of an ultra-low temperature, short-duration quenching process for defect screening. The quenching process is designed to identify those defects that will precisely (and negatively) affect long-term, cryogenic part operation. This quenching process occurs at a temperature that is at least 25 C colder than the coldest expected operating temperature. This quenching process is the opposite of the standard burn-in procedure. Normal burn-in raises the temperature (and voltage) to activate quickly any possible manufacturing defects remaining in the device that were not already rejected at a functional test step. The proposed inverse burn-in or quenching process is custom-tailored to the electronic device being used. The doping profiles, materials, minimum dimensions, interfaces, and thermal expansion coefficients are all taken into account in determining the ramp rate, dwell time, and temperature.
Sheldon, Douglas J.↗
Cryogenic fiber optic temperature sensor and method of manufacturing the same
This invention teaches the fiber optic sensors temperature sensors for cryogenic temperature range with improved sensitivity and resolution, and method of making said sensors. In more detail, the present invention is related to enhancement of temperature sensitivity of fiber optic temperature sensors at cryogenic temperatures by utilizing nanomaterials with a thermal expansion coefficient that is smaller than the thermal expansion coefficient of the optical fiber but larger in absolute value than the thermal expansion coefficient of the optical fiber at least over a range of temperatures.
Kochergin, Vladimir↗
Investigation of minimum operating temperatures for cryogenic wind tunnels
Total temperatures corresponding to the onset of condensation effects were determined for flow over a 0.137-m NACA 0012-64 airfoil mounted in the Langley 1/3-m transonic wind tunnel. Tests were carried out at a total pressure range from 1.2 to 4.5 atm and at free-stream Mach numbers of 0.75, 0.85, and 0.95. No condensation effects were found to occur until total temperatures were below those associated with free-stream saturation. Significant increases in Reynolds number may apparently be obtained by operation at wind tunnel temperatures below those associated with local saturation over the airfoil but above those where effects first occur. For the 0.85 and 0.95 Mach numbers the increase in Reynolds number was at least 15% over those achieved at local saturation conditions for the same pressure range. Higher pressures may have had some detrimental effect in the 0.95 Mach number test.
Hall, R. M.↗
Characterization and Failure Analysis of 650 V Enhancement-Mode GaN HEMT for Cryogenically-Cooled Power Electronics
In order to evaluate the feasibility of newly developed GaN devices in a cryogenically-cooled converter, this paper characterizes a 650 V enhancement-mode Gallium-Nitride high-electron-mobility transistor (GaN HEMT) at cryogenic temperatures. The characterization includes both static and dynamic behaviors. The results show that this GaN HEMT is an excellent device candidate to be applied in cryogenic-cooled applications. For example, transconductance at cryogenic temperature (93 K) is 2.5 times higher than one at room temperature (298 K), and accordingly, peak di/dt during turn-on transients at cryogenic temperature is around 2 times of that at room temperature. Moreover, the on-resistance of the channel at cryogenic temperature is only one-fifth of that at room temperature. The corresponding explanations of performance trends at cryogenic temperatures are also given from the view of semiconductor physics. In addition, several device failures were observed during the dynamic characterization of GaN HEMTs at cryogenic temperatures. The ultra-fast switching speed induced high di/dt and dv/dt at cryogenic temperatures amplifies the negative effects of parasitics inside the switching loop. Based on failure waveforms, two failure modes were classified, and detailed failure mechanisms caused by ultra-fast switching speed are given in this paper.
Static and dynamic characterization↗