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At least 325 records · Page 18

MOSFET and MOS capacitor responses to ionizing radiation

The ionizing radiation responses of metal oxide semiconductor (MOS) field-effect transistors (FETs) and MOS capacitors are compared. It is shown that the radiation-induced threshold voltage shift correlates closely with the shift in the MOS capacitor inversion voltage. The radiation-induced interface-state density of the MOSFETs and MOS capacitors was determined by several techniques. It is shown that the presence of 'slow' states can interfere with the interface-state measurements.

Benedetto, J. M.↗

Operation of integrating indium antimonide linear arrays at 65 K and below

The combination of a FET switch non-CCD readout architecture with high-quality mesa-photovoltaic indium-antimonide detector material has led to high-performance integrating linear imagers in the 1- to 5-micron region. These devices operate in the temperature regime below 100 K and provide very good dark current and responsivity uniformity (+ or - 2 percent). Test data will show performance at 65 K for a 512-element array and 46 K for a 128-element array. Useful integration times of 3600 seconds at 46 K and greater than 12 seconds at 65 K have been achieved. For both devices, kTC read noise levels of less than 1200 electrons have been measured.

Bailey, G. C.↗

Two-dimensional infrared detector arrays

An introduction to overall IR array concepts and particular array designs is presented, and examples of laboratory and observational data obtained with IR arrays are given. Hybrid array designs, extrinsic silicon accumulation-mode charge injection devices, and switched-FET or switched-sample photoconductor techniques are summarized. Three recent astronomical observation projects which used IR arrays are examined.

Mccreight, C. R.↗

Development of optimized detector/spectrophotometer technology for low background space astronomy missions

This program was directed towards a better understanding of some of the important factors in the performance of infrared detector arrays at low background conditions appropriate for space astronomy. The arrays were manufactured by Aerojet Electrosystems Corporation, Azusa. Two arrays, both bismuth doped silicon, were investigated: an AMCID 32x32 Engineering mosiac Si:Bi accumulation mode charge injection device detector array and a metal oxide semiconductor/field effect transistor (MOS-FET) switched array of 16x32 pixels.

Jones, B.↗

1985 Annual Conference on Nuclear and Space Radiation Effects, 22nd, Monterey, CA, July 22-24, 1985, Proceedings

Basic mechanisms of radiation effects in structures and materials are discussed, taking into account the time dependence of interface state production, process dependent build-up of interface states in irradiated N-channel MOSFETs, bias annealing of radiation and bias induced positive charges in n- and p-type MOS capacitors, hole removal in thin-gate MOSFETs by tunneling, and activation energies of oxide charge recovery in SOS or SOI structures after an ionizing pulse. Other topics investigated are related to radiation effects in devices, radiation effects in integrated circuits, spacecraft charging and space radiation effects, single-event phenomena, hardness assurance and radiation sources, SGEMP/IEMP phenomena, EMP phenomena, and dosimetry and energy-dependent effects. Attention is given to a model of the plasma wake generated by a large object, gate charge collection and induced drain current in GaAs FETs, simulation of charge collection in a multilayer device, and time dependent dose enhancement effects on integrated circuit transient response mechanisms.

Jones, C. W.↗

10-30 GHz monolithic GaAs travelling-wave divider/combiner

A four-way monolithic GaAs traveling-wave power divider/combiner has been designed, fabricated and evaluated. With a design center frequency of 20 GHz, a bandwidth of from 10 GHz to 30 GHz has been measured. The insertion loss per dividing or combining action is less than 0.5 dB, with isolation between ports no worse than 20 dB. The input/output VSWRs are better than 2:1 across the same band. This divider/combiner can readily be used with monolithic GaAs power FET amplifiers to produce a several-fold increase in output powers over the 10 to 30 GHz frequency range.

Tserng, H. Q.↗

Ka-band monolithic gain control amplifier

A monolithic gain control amplifier for Ka-band has been developed based on 0.25 micron-gate-length dual-gate FETs fabricated on ion-implanted material. A single-stage monolithic amplifier gives a gain of 6 dB at 31 GHz including fixture losses with a gain control range of over 20 dB. The device and IC design and fabrication are described.

Geddes, J.↗

Switching Circuit Regulates Solenoid Current

New circuit requires no heat sink and is compact. Parts cost no more than those of linear regulator. Switching regulator repeatedly causes solenoid current to build up to maximum level, then to decay to minimum level: thus current ripples about commanded intermediate level. FET's dissipate significant amounts of power only during brief turn-on and turn-off intervals.

Simon, Richard A.↗

Dual-polarization 8.45 GHz traveling-wave maser

An 8.5 GHz dual-channel, dual-polarization traveling-wave maser (TWM) amplifier was installed in the XKR solar system radar cone at DSS 14. The TWM is based on the Blk IIA 8.45 GHz maser structure, with two of the four maser stages being used for each channel, and each maser half then followed by a high-performance GaAs FET amplifier to achieve the desired net gain. A shortened low-noise input waveguide and an orthogonal-mode junction which is cooled to 4.5 K feeds each amplifier chain. The rotation of an external polarizer permits the polarization of each channel to be defined as either linear or circular. A circular waveguide switch was also developed to provide for noise calibration and to protect the maser from incident transmitter power.

Quinn, R. B.↗

Development of a P-I-N HgCdTe photomixer for laser heterodyne spectrometry

An improved HgCdTe photomixer technology was demonstrated employing a p-i-n photodiode structure. The i-region was near intrinsic n-type HgCdTe; the n-region was formed by B+ ion implantation; and the p-region was formed either by a shallow Au diffusion or by a Pt Schottky barrier. Experimental devices in a back-side illuminated mesa diode configuration were fabricated, tested, and delivered. The best photomixer was packaged in a 24-hour LN2 dewar along with a cooled GaAs FET preamplifier. Testing was performed by mixing black-body radiation with a CO2 laser beam and measuring the IF signal, noise, and signal-to-noise ratio in the GHz frequency range. Signal bandwidth for this photomixer was 1.3 GHz. The heterodyne NEP was 4.4 x 10 to the -20 W/Hz out to 1 GHz increasing to 8.6 x 10 to the -10 W/Hz at 2 GHz. Other photomixers delivered on this program had heterodyne NEPs at 1 GHz ranging from 8 x 10 to the -20 to 4.4 x 10 to the -19 W/Hz and NEP bandwidths from 2 to 4 GHz.

Bratt, Peter R.↗

A 2385 MHz, 2-stage low noise amplifier design

This article shows the design aspects of a 2.385 GHz low noise preamplifier with a .7 dB noise figure and 16.5 dB gain using the NE 67383 FET. The design uses a unique method in matching the input which achieves optimum noise figure and unconditional stability.

Sifri, Jack D.↗

Microwave performance of InAlAs/InGaAs/InP MODFET's

Modulation-doped InAlAs/InGaAs/InP structures were grown by molecular beam epitaxy and fabricated into FETs with excellent RF gain performance. The intrinsic transconductance was about 400 mS/mm at 300 K. Current gain cutoff frequencies of up to 26.5 GHz were obtained in 1-micron gate devices. Extremely small S12 and large S21 led to a very large F(max) of 62 GHz. These results represent the best reported figures for 1-micron devices in this material system, and slightly better than those obtained in recently developed pseudomorphic modulation-doped field effect transistors.

Peng, C. K.↗

X-band system performance of the very large array

The Very Large Array (VLA) is being equipped to receive telemetry from Voyager 2 during the Neptune encounter in 1989. Cryogenically cooled amplifiers are being installed on each of the 27 antennas. These amplifiers are currently a mix of field effect transistors (FETs) and high electron mobility transistors (HEMTs) and exhibit zenith system temperatures that range from 30 to 52 K. The system temperatures and aperture efficiencies determined during the past year are summarized. The nominal values of the noise diode calibration are compared with derived values made under the assumption of a uniform atmosphere over the array. Gain values are determined from observations of unresolved radio sources whose flux densities are well known. The tests suggest that the completed VLA will have a ratio of gain to system temperature that is approximately 4.4 dB above that of a single 64 m antenna of the Deep Space Network.

Ulvestad, J. S.↗

Development of a unit cell for a Ge:Ga detector array

Two modules of gallium-doped germanium (Ge:Ga) infrared detectors with integrated multiplexing readouts and supporting drive electronics were designed and tested. This development investigated the feasibility of producing two-dimensional Ge:Ga arrays by stacking linear modules in a housing capable of providing uniaxial stress for enhanced long-wavelength response. Each module includes 8 detectors (1x1x2 mm) mounted to a sapphire board. The element spacing is 12 microns. The back faces of the detector elements are beveled with an 18 deg angle, which was proved to significantly enhance optical absorption. Each module includes a different silicon metal-oxide semiconductor field effect transistor (MOSFET) readout. The first circuit was built from discrete MOSFET components; the second incorporated devices taken from low-temperature integrated circuit multiplexers. The latter circuit exhibited much lower stray capacitance and improved stability. Using these switched-FET circuits, it was demonstrated that burst readout, with multiplexer active only during the readout period, could successfully be implemented at approximately 3.5 K.

Source record↗

Recent developments on a 128 x 128 indium antimonide/FET switch hybrid imager for low-background applications

By combining high-quality mesa photovoltaic indium antimonide detector material with a silicon x-y FET switch multiplexer, a useful infrared area detector has been developed. This device is intended for low-background applications, where high sensitivity is required. Initial characterization of the detector at 80 K showed a KTC limited read noise of less than 1000 electrons, good dark current, responsivity uniformity, and a maximum readout rate of 10 MHz. The hybrid mating technology has sufficient precision to allow expansion to a 256 x 256 format. The dark current in the detector material is sufficiently low to allow full-frame integration, even with arrays as large as 256 x 256 elements.

Bailey, Gary C.↗

Test of IR arrays on the Kuiper Airborne Observatory

NASA's Kuiper Airborne Observatory, which is a C-141 transport aircraft equipped with a 90-cm, all-reflective altazimuth telescope, has been engaged in the Kuiper Infrared Technology Experiment. Attention is presently given to the Experiment's flight series for state-of-the-art two-dimensional, 500-element arrays that use either blocked impurity band or bulk silicon devices. The switched FET readout scheme used on the three arrays flown thus far yields exceptionally low crosstalk. System sensitivities are found to be sufficient for the detection of both pointlike and extended sources; several of each type have been used in staring and scanning experiments.

Russell, R. W.↗

Noise-margin limitations on gallium-arsenide VLSI

Two factors which limit the complexity of GaAs MESFET VLSI circuits are considered. Power dissipation sets an upper complexity limit for a given logic circuit implementation and thermal design. Uniformity of device characteristics and the circuit configuration determines the electrical functional yield. Projection of VLSI complexity based on these factors indicates that logic chips of 15,000 gates are feasible with the most promising static circuits if a maximum power dissipation of 5 W per chip is assumed. While lower power per gate and therefore more gates per chip can be obtained by using a popular E/D FET circuit, yields are shown to be small when practical device parameter tolerances are applied. Further improvements in materials, devices, and circuits wil be needed to extend circuit complexity to the range currently dominated by silicon.

Long, Stephen I.↗

Hybrid Infrared Imager

Experimental device has low noise and high uniformity. Infrared imaging device combines array of InSb photodetectors with array of silicon field-effect-transistor switches. InSb chip forms roof over Si chip, each InSb detector cell engaging indium bump on corresponding Si switch cell below it. FET switches in 128-by-128 array turn on in sequence, read out charges on 128-by-128 array of photodetectors and multiplex them in serial output that represents pattern of light on array of photodetectors. Useful in sensitive infrared cameras for astronomy, medicine, inspection, and military surveillance. Reads out image data at rates up to 10 MHz and expands to 256-by-256 array.

Bailey, Gary C.↗