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At least 307 records · Page 17

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NASA NTRS1980

Feasibility of Kevlar 49/PMR-15 Polyimide for High Temperature Applications

Kevlar 49 aramid organic fiber reinforced PMR-15 polyimide laminates were characterized to determine the applicability of the material to high temperature aerospace structures. Kevlar 49/3501-6 epoxy laminates were fabricated and characterized for comparison with the Kevlar 49/PMR-15 polyimide material. Flexural strengths and moduli and interlaminar shear strengths were determined from 75 F to 600 F for the PMR-15 and from 75 F to 450 F for the Kevlar/3501-6 epoxy material. The effects of hydrothermal and long-term elevated temperature exposures on the flexural strengths and moduli and the interlaminar shear strengths were also studied.

Hanson, M. P.↗

NASA NTRS1980

Characterization of PMR-15 polyimide composition in thermo-oxidatively exposed graphite fiber composites

The contributions of individual resin components to total resin weight loss in 600 F air aged Celion 6000/PMR-15 polyimide composites were determined from the overall resin weight loss in the composite by chemically separating the PMR-15 matrix resin into its monomeric components. The individual resin components were also analyzed by spectroscopic techniques in order to elucidate curing and degradation mechanisms of the PMR-15 matrix resin. The isothermal weight loss of the individual resin components during prolonged 600 F thermo-oxidative aging of the composite was correlated to the changes observed in the Fourier Transform infrared spectra and Fourier Transform nuclear magnetic resonance spectra of the individual resin components. The correlation was used to identify the molecular site of the thermo-oxidative changes in PMR-15 polyimide matrix resin during 600 F curing the prolonged 600 F thermo-oxidative aging.

Alston, W. B.↗

NASA NTRS1980

Tackifier for addition polyimides

A modification to the addition polyimide, LaRC-160, was prepared to improve tack and drape and increase prepeg out-time. The essentially solventless, high viscosity laminating resin is synthesized from low cost liquid monomers. The modified version takes advantage of a reactive, liquid plasticizer which is used in place of solvent and helps solve a major problem of maintaining good prepeg tack and drape, or the ability of the prepeg to adhere to adjacent plies and conform to a desired shape during the lay up process. This alternate solventless approach allows both longer life of the polymer prepeg and the processing of low void laminates. This approach appears to be applicable to all addition polyimide systems.

Butler, J. M.↗

NASA NTRS1980

Addition polyimide end cap study

The characterization of addition polyimides with various end caps for adhesive applications at 120-250 C environments is discussed. Oligometric polyimides were prepared from 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 3,3'-methylenedianiline which were end-capped with functionally reactive moities which cause crosslinking when the oligomers are heated to 200-400 C. The syntheses of the oligomers are outlined. The thermolysis of the oligomers was studied by differential scanning calorimetry and the resulting polymers were characterized by differential thermal analysis and adhesive performance. The adhesive data include lap shear strengths on titanium 6-4 adherends both before and after aging for 1000 hours at 121 C and/or 232 C.

St.clair, T. L.↗

NASA NTRS1981

Tackifier for addition polyimides containing monoethylphthalate

An improvement of addition polyimides wherein an essentially solventless, high viscosity laminating resin is synthesized from low cost liquid monomers is disclosed. The improved process takes advantage of a reactive, liquid plasticizer such as monoethylphthalate (MEP) which is used in lieu of an alcohol solvent, and helps solve a major problem of maintaining good prepreg tack and drape, or the ability of the prepreg to adhere to adjacent plies and conform to a desired shape during the layup process. This improvement results in both longer life of the polymer prepreg and the processing of low void laminate and appears to be applicable to all addition polyimide systems.

St.clair, T. L.↗

NASA NTRS1980

Graphite polyimide fabrication research for supersonic cruise aircraft

Advanced fabrication processes and adhesive bonding methods have been developed for the fabrication of full scale fiberglass-polyimide honeycomb stiffened HTS-1 graphite/PMR-15 polyimide panels that meet the design criteria for an upper wing panel of the NASA YF-12 aircraft. Detailed manufacturing, bonding, and autoclave cure procedures are presented. Nondestructive test methods including pulse echo and through-transmission ultrasonic C-scan and laser holography were developed to detect flaws in components and the completed panels. Panels were tested in shear at room temperature and 533 K (500 F) following a variety of thermal exposures to obtain load, deflection and failure analysis data.

Freeman, W. T., Jr.↗

NASA NTRS1980

Feasibility of Kevlar 49/PMR-15 polyimide for high temperature applications

Kevlar 49 aramid organic fiber reinforced PMR-15 polyimide laminates were characterized to determine the applicability of the material to high temperature aerospace structures. Kevlar 49/3501-6 epoxy laminates were fabricated and characterized for comparison with the Kevlar 49/PMR-15 polyimide material. Flexural strengths and moduli and interlaminar shear strengths were determined from 75 to 600 F for the PMR-15 and from 75 to 450 F for the Kevlar 49/3501-6 epoxy material. The study also included the effects of hydrothermal and long-term elevated temperature exposures on the flexural strengths and moduli and the interlaminar shear strengths.

Hanson, M. P.↗

NASA NTRS1980

Fabrication of LARC 160/NR150B2 hybrid matrix polyimide composites

Graphite-polyimide composite materials exhibit high performance, low weight, and good thermal-oxidative stability, making them promising candidates for Space Shuttle applications. However, no single material is excellent in all respects: processibility, thermal-oxidative stability, toughness, and mechanical properties. This paper describes the development of hybrid matrix composite laminates that combine the attributes of two polyimide resins, NR150B2 and LARC 160, while avoiding their drawbacks. High quality laminates were fabricated from each resin system, and hybrid laminates were successfully co-cured, evaluated, and optimized.

Bergren, O. D.↗

NASA NTRS1981

A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber will also be discussed.

Saint Clair, A. K.↗

NASA NTRS1981

Formulation and characterization of polyimide resilient foams of various densities for aircraft seating applications

Light weight, heat and fire resistant low smoke generating polyimide foams are developed for aircraft seating applications. The material is upgraded and classified into groups for fabrication of cushions possessing acceptable comfort properties. Refinement and selection of foaming processes using a variety of previously developd foaming techniques and definition of property relationships to arrive at the selection and classfication of polyimide foams into five groups in accordance with predetermined ILD values are emphasized.

Gagliani, J.↗

NASA NTRS1982

Electrically conductive palladium containing polyimide films

Lightweight, high temperature resistant, electrically conductive, palladium containing polyimide films and methods for their preparation are described. A palladium (II) ion-containing polyamic acid solution is prepared by reacting an aromatic dianhydride with an equimolar quantity of a palladium II ion-containing salt or complex and the reactant product is cast as a thin film onto a surface and cured at approximately 300 C to produce a flexible electrically conductive cyclic palladium containing polyimide. The source of palladium ions is selected from the group of palladium II compounds consisting of LiPdCl4, PdS(CH3)2Cl2Na2PdCl4, and PdCl2. The films have application to aerodynamic and space structures and in particular to the relieving of space charging effects.

Taylor, L. T.↗

NASA NTRS1982

LARC-TPI: A multi-purpose thermoplastic polyimide

A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.

St.clair, A. K.↗

NASA NTRS1981

Novel improved PMR polyimides

The development of a class of high-temperature-resistant resins known as PMR polyimides has been reported by Serafini et al. (1972). Serafini and Vannucci (1975) found that the lower formulated molecular weight (FMW) compositions exhibited increased resin flow, but with some sacrifice in elevated temperature thermo-oxidative stability. Vannucci (1977) reported that the resin flow characteristics of the PMR composition having an FMW of 1500 could be varied by controlling the degree of resin advancement or imidization. The current investigation is concerned with an alternative approach to obtain improved flow PMR polyimides without sacrificing the desirable thermo-oxidative characteristics. The new approach is based on the utilization of a chemically compatible flow modifying agent. This agent is N-phenylnadimide (PN). The determination of the processing characteristics and properties of PN modified PMR/Celion 6000 composites is discussed.

Pater, R. H.↗

NASA NTRS1981

A multi-purpose thermoplastic polyimide

Saint Clair, A. K.↗

NASA NTRS1982

Addition polyimide adhesives containing various end groups

Addition polyimode oligomers have been synthesized from 3,3 prime, 4,4 prime-benzophenone tetracarboxylic acid dianhydride and 3,3 prime-methylenedianiline using a variety of latent crosslinking groups as end-caps. The nominal 1300 molecular weight imide prepolymers were isolated and characterized for solubility in amide, chlorinated and ether solvents, melt-flow and cure properties, glass transition temperature, and thermal stability on heating in an air atmosphere. Adhesive strengths of the polyimides were obtained both at ambient and elevated temperatures before and after aging at 232 C. Properties of the novel addition polyimides were compared to a known nadic end-capped adhesive, LARC-13.

Saint Clair, A. K.↗

NASA NTRS1983

Aromatic Polyimides With Group VI Linkages

New polymer system combines thermal and solvent resistant properties of aromatic polyimides with processability of PPX polymers. PPX polymers include polyphenylene oxide, polyphenylene sulfide, and polyphenylene sulfone classes. Generally more processable by hot melt or thermoplastic techniques than aromatic polyimides. PPX systems more susceptible to attack by solvents and have lower glass transition temperatures than PI group.

St. Clair, T. L.↗

NASA NTRS1984

Improved Polyimide Intumescent Coating

New polyimide intumescent coating uses titanium dioxide and glass microballons as nucleating agents to improve foaming characteristics of commercially-available polyimide precursor resin. Used for coating interior surfaces in commercial aircraft.

Salyer, I. O.↗

NASA NTRS1982

Application of ion-induced nucleation mass spectrometry in the analysis of trace gases evolved from a polyimide film during the thermal curing stages

Trace gases evolved from a polyimide film during its thermal curing stages have been studied using ion-induced nucleation mass spectrometry. The technique involved exposing the test gas sample to a low energy beta source and recording the masses of the ion-induced molecular clusters formed in the reaction chamber. On the basis of the experimentally observed molecular cluster spectra, it has been concluded that the dominant trace component had a molecular weight of 87 atomic mass units. This component has been identified as a molecule of dimethylacetamide (DMAC) which had been used as a solvent in the preparation of the test polyimide specimen. This identification has been further confirmed by comparing the spectra of the test gas sample and the DMAC calibration sample obtained with a conventional mass spectrometer. The advantages of the ion-induced nucleation mass spectrometer versus the conventional mass spectrometer are discussed.

Smith, A. C.↗