NASA NTRS · 19820037826
A multi-purpose thermoplastic polyimide
Abstract
A linear thermoplastic polyimide, LARC-TPI, has been characterized and developed for a variety of high-temperature applications. In its fully imidized form, this new material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI is being evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100% void-free laminates for flexible circuit applications. The further development of LARC-TPI as a potential molding powder, composite matrix resin, high-temperature film and fiber is also discussed.
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Saint Clair, A. K., Saint Clair, T. L.. 1981-10-01. A multi-purpose thermoplastic polyimide. https://ntrs.nasa.gov/citations/19820037826
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