Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “Electron cooling”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 289 records · Page 16
All sourcesNASA NTRSDOE OSTI
DOE OSTI2021

Designing Energy-Efficient Quantum Computers Through Prediction and Reduction of Cooling Requirements for Cryogenic Electronics

Quantum computing has been identified as a “wild card” by the International Energy Agency in predicting future global data center energy usage. This is primarily because both uncertainty in the extent to which quantum computing will be adopted, and uncertainty in the power consumption of individual quantum data centers. Unlike the classical counterparts, quantum computers need to be maintained at near absolute zero, requiring energy-intensive cryogenic cooling systems. Therefore, as quantum computers scale up from existing 50 qubit technology demonstrations to the 10,000 to 100,000 qubit systems that will be able to solve complex problems, the energy consumption of both the electronics and the required cooling systems will also increase. To predict this scaling, this work analyzes the energy requirements for both computation and cooling of quantum hardware. We show that the energy requirements for cooling of quantum computers is determined by several computing system parameters, including the number and type of physical qubits, the operating temperature, the packaging efficiency of the system, and the split between circuits operating at cryogenic temperatures and those operating at room temperature. The energy requirements can then be found based on thermal system parameters such as cooling efficiency and cryostat heat transfer. Analysis of these parameters shows that the energy required for cooling is significantly larger than that required for computation, a reversal from energy usage patterns seen in conventional computing. The results and discussions provide a road-map for creating energy efficient quantum computers through the selection of computer architectures and cryogenic system configurations that minimize cooling requirements.

energy efficiency↗
DOE OSTI2022

Electron subband degeneracy heat pump for cryogenic cooling

An unconventional method of solid-state cryogenic cooling utilizing the electron subband degeneracy of semiconductor heterostructures is discussed in this Letter. The working principle of using the electrons as the working medium to perform cyclic heat pumping under electrostatic subband "expansion" and "compression" is discussed. The calculated base temperature can reach below dilution refrigeration temperatures with the fundamental limit set by electron-phonon interaction. Using an ultra-wide GaAs quantum well as an example, the cooling power per unit volume is estimated to reach $0.85\ \rm \mu W/cm^3$ at $25\ \rm mK$ with a hot-side temperature of $42.5\ \rm mK$, suitable for applications such as quantum computing.

Wang, Chulin↗
NASA NTRS2000

Fabrication of an Aluminum Based Hot Electron Mixer for Terahertz Applications

Aluminum based diffusion cooled hot electron bolometers (HEB) mixers, predicted to have better noise, bandwidth and to require less LO power than Nb based diffusion cooled HEBs, have been fabricated. Preliminary DC tests were performed. The bolometer elements consisted of short (0.1 to 0.3 micron), narrow (0.08 to 0. 15 micron) and thin (11 nm) aluminum wires connected to large contact pads consisting of a novel trilayer Al/Ti/Au. The patterns were defined by electron beam lithography and the metal deposition involved a double angle process, the Aluminum wires being deposited straight on and the pads being deposited at a 45 degree angle without breaking vacuum. The Al/Ti/Au trilayer was developed to provide a way of making contact between the aluminum wire and the gold antenna. The Titanium layer acts as a diffusion barrier to avoid damage of the Aluminum contact and bolometer wire and to lower the transition temperature of the pads to below that of the bolometer wire. The Au layer avoids the formation of an oxide on the Ti layer and provides good electrical contact to the IF/antenna structure. The resistance of the bolometers as a function of temperature was measured. It is clear that below the transition temperature of the wire (1.8K) but above the transition temperature of the contact pads (0.6K), the proximity effect drives most of the bolometer wire normal, causing a very broad transition. This effect should not affect the performance of the bolometers since they will be operated at a temperature below the TC of the pads. This is evident from the IV characteristics measured at 0.3K. RF characterization tests will begin shortly.

Echternach, P. M.↗
DOE OSTI2025

High average current HVDC electron gun for EIC hadron cooling

A critical R&D initiative for the Electron Ion Collider (EIC) involves the design of an electron gun capable of gen erating a high average current and high-brightness electron beam for the hadron cooler. This is essential to preserve hadron beam quality and achieve the collider’s luminosity target of 1 × 10 34 s −1 cm −2 . For an energy recovery linac (ERL)-based hadron cooler, the gun must deliver a high average current of 98.5 mA, a normalized transverse emittance of less than 2 mm−mrad, and a bunch charge of up to 2.5 nC. This proceeding outlines the high-voltage design of a DC gun operating at 500 kV, with conditioning capability up to 600 kV. The design incorporates several unique fea tures, including the use of inverted ceramic at this voltage level, active cooling for the cathode, and large single-crystal multi-alkali cathodes grown on a silicon carbide substrate. High-brightness electron sources are also pivotal for other ad vanced applications, such as high-intensity gamma sources, future 𝑒 + 𝑒 − colliders, and ultra-deep UV sources for the semiconductor industry. Additionally, this paper provides an overview of the hadron cooling approaches planned or proposed for the EIC.

43 PARTICLE ACCELERATORS↗
DOE OSTI2025

Dissociative electron recombination and rotational cooling of the deuterated triatomic hydrogen ions H 2 ⁡D + and D 2 ⁢H +

We have measured the dissociative recombination (DR) of the deuterated triatomic hydrogen ions H 2 ⁡D + and D 2 ⁢H + as a function of storage time at the Cryogenic Storage Ring (CSR). Both molecular ions were stored for up to 1000 s inside the cryogenic vacuum of the CSR prior to the electron recombination measurements, allowing them to cool to their lowest rotational states. We implement a comprehensive model for all relevant processes to predict the internal state evolution of the ions during storage inside the CSR, employing calculated radiative transition strengths and state-selective rate coefficients for electron collisions. Our DR rate coefficient measurements with deuterated triatomic hydrogen ions in defined quantum states allow for meaningful comparisons with state-of-the-art theoretical calculations, paving the way for a better understanding of the complex DR process for polyatomic molecular ions.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
NASA NTRS1992

Using electron scattering to probe the environment of cluster cooling flows

The electron-scattered surface brightness profiles are calculated for a strong central source embedded in a cluster cooling flow, and the profiles are used to discuss the physical state of the gas in the flow and the behavior of the central source. The effects of temporal variations in the luminosity of the central source are calculated for a burst model and a source whose luminosity increases linearly with time. If the emission from the central AGN is polarized, the surface brightness profiles have cusps along the direction of the projection of the normal to the polarization vector on the sky. The 2D surface brightness profiles produced by beamed radiation are calculated.

Wise, Michael W.↗
DOE OSTI2022

Experimental and analytical study of the hydrodynamic and single and two-phase convective heat transfer performance of flexible PDMS microchannels with micropillar arrays

Various copper and silicon based thermal management systems are used in the cooling of electronics. However, the rigid nature of these materials along with their high thermal and electrical conductivity pose a difficulty in developing direct contact embedded flexible cooling systems that can offer robust cooling performance. The low density, thermal stability, chemical inertness, and electrical insulation of Polydimethylsiloxane (PDMS) make it an ideal material to develop lightweight direct contact thermal management systems for electronics. Its ease of fabrication with tunable flexibility provides the opportunity to go beyond traditional electronics and develop advanced active and passive thermal management systems for a wide–range of applications in foldable and wearable electronics, liquid cooling garments, microgravity, and electric motors. In this study, a flexible PDMS based microchannel with micropillar arrays, which enhance the thermal performance of the device through capillary-assisted flow, has been developed. The hydrodynamic and convection heat transfer performance of three PDMS wick pillar geometries, ranging from a porosity of 0.8–0.91, are investigated and compared under single-phase and two-phase conditions. Dielectric coolant FC-3283 is employed and permeability measurements are made for mass fluxes ranging from 53 kg/m 2 s to 369 kg/m 2 s. Given its conformability, the device demonstrates a deviation from Darcy’s Law, within the laminar regime, with an increasing permeability with mass flux at the rate of ~0.5–0.8 Darcy/(kg/m 2 s). A semi-analytical model has been developed and reported to quantify the conformability of the device. The heat transfer performance is experimentally evaluated using the same dielectric fluid for mass flux ranging from 105 kg/m 2 s to 420 kg/m 2 s with heat fluxes ranging from 1.5 W/cm 2 to 16 W/cm 2 . Heat transfer coefficients of up to 7000 W/m 2 K are observed, which are comparable to copper and silicon microchannels. The effect of porosity on the single phase thermal performance has been evaluated against the pumping power to provide a basis for thermal management system design. Finally, high-speed imaging is performed to study the two-phase flow characteristics to provide insight into the vapor formation and removal.

42 ENGINEERING↗
NASA NTRS2012

Computational Fluid Dynamics (CFD) Analysis Of Optical Payload For Lasercomm Science (OPALS) sealed enclosure module

Computational Fluid Dynamics (CFD) using the commercial CFD package CFDesign has been performed at NASA Jet Propulsion Laboratory (JPL) California Institute of Technology (Caltech) in support of the Phaeton Early Career Hire Program's Optical Payload for Lasercomm Science (OPALS) mission. The OPALS project is one which involves an International Space Station payload that will be using forced convection cooling in a hermetically sealed enclosure at 1 atm of air to cool "off-the-shelf" vendor electronics. The CFD analysis was used to characterize the thermal and fluid flow environment within a complicated labyrinth of electronics boards, fans, instrumentation, harnessing, ductwork and heat exchanger fins. The paradigm of iteratively using CAD/CAE tools and CFD was followed in order to determine the optimum flow geometry and heat sink configuration to yield operational convective film coefficients and temperature survivability limits for the electronics payload. Results from this current CFD analysis and correlation of the CFD model against thermal test data will be presented. Lessons learned and coupled thermal / flow modeling strategies will be shared in this paper.

Computational Fluid Dynamics (CFD)↗
NASA NTRS1971

High density electronic packaging module with improved cooling assembly

Cold plate increases heat transfer within high density electronic module. Tapered pins improve heat transfer process by providing larger surface pressure with increased planar area. Cooling technique increases thermal contact where planar area is limited, interface pressure increases the heat transfer coefficient.

Martin, J. H.↗
NASA NTRSDate not supplied

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics.

Mercury↗
NASA NTRSDate not supplied

Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics

Mercury↗
DOE OSTI2026

Metal additively manufactured wavy fin cold-plate architecture for improved thermal-hydraulic performance

Rapid growth in artificial intelligence and data center workloads demands high-performance liquid cooling to manage increasing chip power. This study presents two metal-additive-manufactured cold plates with sinusoidal fins, constant-amplitude wavy fins and linearly variable-amplitude wavy fins and compares them against metal-additive-manufactured straight fins using experiments conducted at 1 kW heat dissipation as well as high-fidelity 3D conjugate computational fluid dynamic simulations. The cold plates were printed in AlSi10Mg material and underwent design using a Python-automated workflow prior to manufacture and testing. The experiments show that wavy fins reduce the normalized thermal resistance by 35 to 45 % at water flow rates from 1 to 4 LPM. At a fixed 20 kPa pressure drop, the variable-waviness design lowered peak surface temperature by 9 °C and thermal resistance by 51 %, while edge-channel maldistribution in the constant wavy fin design limited gains. A thermal resistance breakdown revealed that 55–63 % of the total thermal resistance in wavy designs comes from base heat conduction, 27–33 % from fin heat conduction, and 9–13 % from fin heat convection, indicating the need to address conduction bottlenecks. Parametric sweeps identify a 3 mm fin pitch as optimal, and that horizontal inlet/outlet manifolds further reduce pressure drop by 30–60 % and thermal resistance by 9–16 % relative to vertical inlet-outlet manifolds. The results yield comprehensive guidelines for fin geometry, manifold alignment, material selection and additive-manufacturing constraints to realize high-performance liquid-cooled cold plates for power-dense electronics.

3d printing↗
NASA NTRS1992

Electron impact cross-sections and cooling rates for methane

Energy transfer between electrons and methane gas by collisional processes plays an important role in the thermal balance of electrons in the atmospheres and ionospheres of planets and satellites in the outer solar system. The literature is reviewed for electron impact cross-sections for methane in this paper. Energy transfer rates are calculated for elastic and inelastic processes using a Maxwellian electron distribution. Vibrational, rotational, and electronic excitation and ionization are included. Results are presented for a wide range of electron temperatures and neutral temperatures.

Gan, L.↗
DOE OSTI2023

Single and Double-Sided Jet Impingement Cooling for SiC-Based Power Modules

Efficient thermal management of power electronics systems is crucial for higher reliability. With the miniaturization of systems, high-loss-density electronics require cooling systems that can extract a large amount of heat. This study explored a liquid-jet-impingement-based direct substrate cooling system for single-sided and double-sided cooling to improve heat extraction efficiency and improve the power density by reducing the volume and mass. The cooling system was implemented for a SiC-based direct bonded copper substrate. Numerical simulations were performed to determine the effects of nozzle diameter, the number of nozzles, and nozzle array orientation on single-sided cooling and thermal performance gain over double-sided cooling. A novel manifold design was proposed that reduced the volume and mass of the manifold and still achieved the target power density. The performance of the proposed design was compared with the pin-fin-based cooling system used in the BMW I3 module, and a comparative analysis was done.

Barua, Himel↗
NASA NTRS1990

Electron scattering and the distances to cluster cooling flows

Cluster cooling flows have electron-scattering optical depths which are estimated to be about 0.01. Many of the cluster-dominant galaxies centered in cluster cooling flows have active nuclei, and about 1 percent of the luminosity from the active nuclei should appear as diffuse, scattered radiation. It is shown here that detection of this scattered radiation at radio wavelengths can provide a measure of the distance to the cluster that is independent of the Hubble constant. Observations of the scattered surface brightness profile can also be used to test for clumpiness in the gas, for variations in the central radio source on time scales less than 100,000 yr, and for the degree of beaming of radiation from the central source.

Wise, Michael W.↗