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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 253 records · Page 14
All sourcesNASA NTRSDOE OSTI
NASA NTRS1992

Broadband vertical interconnects using slot-coupled shielded microstrip lines

A full-wave space-domain integral equation analysis of aperture coupled shielded microstrip lines is presented based on the Equivalence Principle. The formulation includes the capability to model multilayered substrates through the derivation of the associated dyadic Green's functions which represent the layers through impedance boundary conditions. The method of moments is used to solve for the line currents and slot voltage with even and odd mode excitations which are then interpreted through transmission line analysis to determine the two-port scattering parameters. A parametric study together with experimental data is presented which demonstrates the behavior of the coupler and the accuracy of the technique.

Vandenberg, Norman L.↗
NASA NTRS1991

High density packaging and interconnect of massively parallel image processors

This paper presents conceptual designs for high density packaging of parallel processing systems. The systems fall into two categories: global memory systems where many processors are packaged into a stack, and distributed memory systems where a single processor and many memory chips are packaged into a stack. Thermal behavior and performance are discussed.

Carson, John C.↗
NASA NTRS1992

Architecture for Survivable Systems Processing (ASSP). Technology benefits for Open System Interconnects

The Architecture for Survivable Systems Processing (ASSP) program is a two phase program whose objective is the derivation, specification, development and validation of an open system architecture capable of supporting advanced processing needs of space, ground, and launch vehicle operations. The output of the first phase is a set of hardware and software standards and specifications defining this architecture at three levels. The second phase will validate these standards and develop the technology necessary to achieve strategic hardness, packaging density, throughput requirements, and interoperability/interchangeability.

Wood, Richard J.↗
NASA NTRS1997

High Frequency Interconnects on Silicon Substrates

The measured propagation constant of coplanar waveguide (CPW) on silicon wafers as a function of the line dimensions and the resistivity of the Si wafer; CPW on GaAs wafers as a function of the line dimensions, and thin film microstrip (TFMS) polyimide fabricated with polyimide on the surface of a silicon wafer is presented. It is shown that the attenuation of CPW on 2500 Omega-cm Si wafers and-of TFMS with a polyimide thickness of 4 micrometer or greater is comparable to the attenuation of similar lines on GaAs.

Ponchak, George E.↗
NASA NTRS1999

Advanced Interconnect Roadmap for Space Applications

This paper presents the NASA electronic parts and packaging program for space applications. The topics include: 1) Forecasts; 2) Technology Challenges; 3) Research Directions; 4) Research Directions for Chip on Board (COB); 5) Research Directions for HDPs: Multichip Modules (MCMs); 6) Research Directions for Microelectromechanical systems (MEMS); 7) Research Directions for Photonics; and 8) Research Directions for Materials. This paper is presented in viewgraph form.

Galbraith, Lissa↗
NASA NTRS2006

Nano-interconnection for microelectronics and polymers with benzo-triazole

Benzo-Triazole (BTA) is considered as an important bridging material that can connect an organic polymer to the metal electrode on silicon wafers as a part of the microelectronics fabrication technology. We report a detailed process of surface induced 3-D polymerization of BTA on the Cu electrode material which was measured with the Ultraviolet Photoemission Spectroscopy (UPS), X-ray Photoemission Spectroscopy (XPS), and Scanning Tunneling Microscope (STM). The electric utilization of shield and chain polymerization of BTA on Cu surface is contemplated in this study.

Park, Yeonjoon↗
NASA NTRS1996

Global Interconnectivity Between Mobile Satellite and Terrestrial Users: Call Signalling Issues and Challenges

This paper will discuss some of the challenges in connecting mobile satellite users and mobile terrestrial users in a cost efficient manner and with a grade of service comparable to that of satellite to fixed user calls. Issues arising from the translation between the mobility management protocols resident at the satellite Earth station and those resident at cellular switches - either GSM (Group Special Mobile) or IS-41 (used by U.S. digital cellular systems) type - will be discussed. The impact of GSM call routing procedures on the call setup of a satellite to roaming GSM user will be described. Challenges facing provision of seamless call handoff between satellite and cellular systems will be given. A summary of the issues explored in the paper are listed and future work outlined.

mobile satellite usersGroup Special MobileGSMdigit↗
NASA NTRS2001

Three-dimensional modular electronic interconnection system

A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.

Bolotin, Gary S.↗
NASA NTRS2010

Evaluation of Small Form Factor Fiber Optic Interconnects for the NASA Electronics Parts and Packaging Program (NEPP)

The Diamond AVIM optical fiber connector has been used for over a decade in flight environments. AVIM which stands for Aviation Intermediate Maintenance is always referenced as a fiber optic connector type from the DIN (Deutsches Institut fur Normung) family of optical fiber connectors. The newly available Mini AVIM and DMI (Definition Multimedia Interface) connectors also by Diamond provide similar features as the high performance AVIM with the added benefits of being small form factor for board mount and internal box use where long connectors and strain relief can not be accommodated. Transceiver, fiber laser technology and receiver optic technology based on small sized constraints will benefit the most by the reduction in connector form factor. It is for this reason that the Mini AVIM is being evaluated for multimode and single mode optical fiber use in both fiber based and cable based packaging configurations. In a fiber based termination, there are no cable materials to bond to the connector. The only bonding that is conducted is the mounting of the fiber with epoxy to the connector ferrules (which are called DMI ferrules). In a cable configuration, the compatibility of the connector subcomponents along with the upjacketing materials of the cable around the fiber needs to be considered carefully for termination fabrication. Cabled terminations will show greater insertion loss and high probability of failures during thermal cycling testing. This is due to the stressing of the combination of materials that each have different Coefficients of Thermal Expansion (CTE's) and that are bonded together to the connector subcomponents. As the materials flex during thermal excursions, forces are applied to the termination and can make the system fail if the grouping of materials (per their CTE's) are not compatible and this includes cable materials, epoxies, ferrule and connector body components. For this evaluation, multimode 100 micron core step index fiber was used for the fiber terminated condition, and single mode SMF-28 upjacketed with W.L. Gore Flexlite was used for the cabled configuration. For background purposes, a comparison is presented here for information purposes between the high performance AVIM connector features and the Mini AVIM small form factor connectors. Basic connector features are described here.

Ott, Melanie↗
NASA NTRS2015

Scheduled Peripheral Component Interconnect Arbiter

Systems and methods are described for arbitrating access of a communication bus. In one embodiment, a method includes performing steps on one or more processors. The steps include: receiving an access request from a device of the communication bus; evaluating a bus schedule to determine an importance of the device based on the access request; and selectively granting access of the communication bus to the device based on the importance of the device.

Nixon, Scott Alan↗
NASA NTRS2011

Data Interconnection Exploration

This project involves innovating the way the Quality Assurance organization at the Jet Propulsion Laboratory (JPL) tracks the receiving inspection of JPL Critical Items (JCI) procured from suppliers. The Quality Assurance organization uses a Microsoft Access based front-end to enter items into an inspection queue. The current design has grown to be much more than was expected when the inspection queue system was created in 2007. The goal is to migrate to a web based solution that will allow the handling of more data, multiple input interfaces, and customizable display options. This has been achieved by implementing a divided tables scheme, the use of ColdFusion programming language, and the usage of Web 2.0 technologies such as AJAX and jQuery. These updates will allow for future expansion as well as the standardization of inspection queues for the Quality Assurance organization. When engineers and scientists order flight hardware, they cannot use it straight away. After a spacecraft or a satellite has been launched, it will be impossible to repair; therefore, the parts used must be inspected to make sure they are operating correctly and within the required specifications. The task of inspecting these JPL Critical Items (JCI) falls on the Quality Assurance organization. One of the tools the receiving inspection group uses is a database to maintain a queue of inspections that need to be done and of inspections that have been completed. The current Access interface has worked well but increased amounts of data, multiple input interfaces, and changes to how data is handled have made it necessary to seek a new way of organizing items for inspection. In addition, the different inspection groups have recently been merged and each has different ways of keeping track of inspection information. The ultimate goal is for the new group to have one shared inspection queue and website. To achieve this goal, I have been working with Ian Luczon of Procurement Quality Assurance and 3 Myers Hawkins, another intern, to not only create the new queue for receiving inspection but also a central web portal for the newly combined inspection group.

flight hardware↗