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At least 253 records · Page 14

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NASA NTRS1982

Lamp reliability studies for improved satellite rubidium frequency standard

In response to the premature failure of Rb lamps used in Rb atomic clocks onboard NAVSTAR GPS satellites experimental and theoretical investigations into their failure mechanism were initiated. The primary goal of these studies is the development of an accelerated life test for future GPS lamps. The primary failure mechanism was identified as consumption of the lamp's Rb charge via direct interaction between Rb and the lamp's glass surface. The most effective parameters to accelerate the interaction between the Rb and the glass are felt to be RF excitation power and lamp temperature. Differential scanning calorimetry is used to monitor the consumption of Rb within a lamp as a function of operation time. This technique yielded base line Rb consumption data for GPS lamps operating under normal conditions.

Frueholz, R. P.↗

NASA NTRS2011

Fracture in Phenolic Impregnated Carbon Ablator

The thermal protection materials used for spacecraft heat shields are subjected to various thermal-mechanical loads during an atmospheric entry which can threaten the structural integrity of the system. This paper discusses the development of a novel technique to understand the failure mechanisms inside thermal protection materials. The focus of research is Phenolic Impregnated Carbon Ablator (PICA). It has successfully flown on the Stardust spacecraft and is the TPS material chosen for the Mars Science Laboratory (MSL) and Dragon spacecraft. Although PICA has good thermal properties, structurally, it is a weak material. In order to thoroughly understand failure in PICA, fracture tests were performed on FiberForm* (precursor of PICA), virgin and charred PICA materials. Several samples of these materials were tested to investigate failure mechanisms at a microstructural scale. Stress-strain data were obtained simultaneously to estimate the fracture toughness. It was found that cracks initiated and grew in the FiberForm when a critical stress limit was reached such that the carbon fibers separated from the binder. However, both for virgin and charred PICA, crack initiation and growth occurred in the matrix (phenolic) phase. Both virgin and charred PICA showed greater strength values compared to FiberForm coupons, confirming that the presence of the porous matrix helps in absorbing the fracture energy.

Agrawal, Parul↗

NASA NTRS1981

Fracture and failure: Analyses, mechanisms and applications; Proceedings of the Symposium, Los Angeles, CA, March 17-20, 1980

Papers are presented on the application of fracture mechanics to spacecraft design, fracture control applications on the Space Shuttle reaction control thrusters, and an assessment of fatigue crack growth rate relationships for metallic airframe materials. Also considered are fracture mechanisms and microstructural relationships in Ni-base alloy systems, the use of surface deformation markings to determine crack propagation directions, case histories of metallurgical failures in the electronics industry, and a failure analysis of silica phenolic nozzle liners.

Tung, P. P.↗

DOE OSTI2020

Investigation of Failure Modes, Mechanisms and Driving Forces for Electrically Conductive Adhesives as Interconnects in PV Modules

In this work we describe our current progress into investigating the reliability of ECA interconnects for PV modules. Preliminary thermal cycling experiments demonstrated that both cohesive and adhesive failure of the ECA joint are relevant failure modes that result in an increase of the joints electrical resistance. A thorough viscoelastic characterization of the candidate ECA was conducted to enable accurate numerical modeling of the joint’s response to thermal cycling. Combined with critical and subcritical fracture measurements, the numerical model elucidates that an additional fatigue mechanism exists which can result in fracture well below subcritical debonding threshold values. It is also demonstrated that fracture of the ECA is more sensitive to humidity than temperature and subcritical debonding mechanisms do exist which are again more sensitive to humidity.

41 EE - Solar Energy Technologies Office (EE-4S)↗

NASA NTRS1992

Microstructure-failure mode correlations in braided composites

Explication of the fracture processes of braided composites is needed for modeling their behavior. Described is a systematic exploration of the relationship between microstructure, loading mode, and micro-failure mechanisms in carbon/epoxy braided composites. The study involved compression and fracture toughness tests and optical and scanning electron fractography, including dynamic in-situ testing. Principal failure mechanisms of low sliding, buckling, and unstable crack growth are correlated to microstructural parameters and loading modes; these are used for defining those microstructural conditions which are strength limiting.

Filatovs, G. J.↗

NASA NTRS1993

Test-to-Failure of a Two-Grid, 30-cm-dia. Ion Accelerator System

To determine the failure mechanism and erosion characteristics of an ion accelerator system due to erosion by charge-exchange ions a test was performed in which a 30-cm-diameter, 2-grid ion accelerator system was tested to failure. The erosion charcteristics observed in this test, however, imply significantly shorter accelerator grid life times than typically stated in the literature. Finally, the test suggests that structural failure is probably not the most likely first failure mechanism for the accelerator grid.

distortion↗

NASA NTRS2007

Strain Gauges Indicate Differential-CTE-Induced Failures

A method of detecting mechanical failure induced by variation in temperature at an adhesive bond between two materials that have different coefficients of thermal expansion (CTEs) involves monitoring of strain-gauge readings. This method can be regarded as an exploitation of the prior observation that the readings of strain gauges commonly used in tensile and compressive testing of material specimens include features indicative of incremental failures in the specimens. In this method, one or more strain gauges are bonded to either or both of the two materials near the bond between the materials. (The adhesive used to bond the strain gauges would not ordinarily be the same as the one used to bond the two materials). Then strain-gauge readings are recorded as the temperature of the materials is varied through a range of interest. Any significant discontinuity in the slope of the resulting strain-versus-temperature curve(s) is taken to be a qualitative indication of a failure of the bond between the two materials and/or a failure within one of the materials in the vicinity of the bond. The method has been demonstrated in experiments on specimens consisting of polyacrylonitrile-fiber/epoxy-matrix laminated composite plates bonded by epoxy to smaller plates made, variously, of aluminum, titanium, and a low-CTE nickel/iron alloy. In preparation for each experiment, strain gauges were bonded, by use of cryogenic-rated adhesives, to the composite plate near the corners of the metal plate (see Figure 1). In each experiment, strain-gauge and temperature readings were taken as the specimen was cooled from room temperature to 20 K. The specimens were then returned to room temperature and ultrasonically inspected for damage in the bond region. No failure events were detectable in the strain-gauge readings from the composite/ titanium and composite/low-thermalexpansion- alloy specimens, and ultrasonic inspection of these specimens revealed no damage. However, failure events were seen in the strain-gauge readings from the composite/aluminum specimens (see Figure 2), and ultrasonic inspection confirmed that there was damage in the bond regions of these specimens.

Harris, Brian↗

NASA NTRS1981

The application of fracture mechanics to failure analysis of photovoltaic solar modules

Cracking of silicon solar cells and solar module transparent cover panels such as glass or polymethylmethacrylate (PMMA) is a major cause of photovoltaic solar module failure in field service. Silicon and cover materials are brittle, and cracking of these materials is expected to result from the extension of preexisting flaws under stress. Study of the cracking mechanisms is therefore an appropriate area for the application of fracture mechanics principles. In this study, fracture mechanics techniques were employed to identify the mode of crack propagation, to examine the fracture-initiating flaw, to estimate the nature and magnitude of fracture stress in the field, and to predict analytically the service lifetime. Recommendations for corrective actions are also made.

Chen, C. P.↗

NASA NTRS2017

In-Situ Observations of Longitudinal Compression Damage in Carbon-Epoxy Cross Ply Laminates Using Fast Synchrotron Radiation Computed Tomography

The role of longitudinal compressive failure mechanisms in notched cross-ply laminates is studied experimentally with in-situ synchrotron radiation based computed tomography. Carbon/epoxy specimens loaded monotonically in uniaxial compression exhibited a quasi-stable failure process, which was captured with computed tomography scans recorded continuously with a temporal resolutions of 2.4 seconds and a spatial resolution of 1.1 microns per voxel. A detailed chronology of the initiation and propagation of longitudinal matrix splitting cracks, in-plane and out-of-plane kink bands, shear-driven fiber failure, delamination, and transverse matrix cracks is provided with a focus on kink bands as the dominant failure mechanism. An automatic segmentation procedure is developed to identify the boundary surfaces of a kink band. The segmentation procedure enables 3-dimensional visualization of the kink band and conveys the orientation, inclination, and spatial variation of the kink band. The kink band inclination and length are examined using the segmented data revealing tunneling and spatial variations not apparent from studying the 2-dimensional section data.

Bergan, Andrew C.↗

DOE OSTI2024

Robustness and printed sensor qualification

A limiting factor of additive manufactured (AM) sensors for in-pile applications is the development of appropriate interconnection and packaging strategies that can maintain reliable performance in extreme environments. Failure mechanisms in these harsh conditions could include, but not limited to, materials interaction (i.e., intermetallic formation) and coefficient of thermal expansion (CTE) mismatch between the individual components of the sensors. To mitigate premature failure and enable the successful sustained operation of AM sensors, non-destructive qualification tests are used as an intermediate process control step used for verifying robustness and reliability of the sensor before they are deployed. A materials system of interest is the use of barium strontium titanium oxide (BST) films on stainless steel 316L (SS316L) substrate. Due to BST’s high dielectric constant and tunable dielectric properties, there is an interest for its application as an insulation/encapsulation layer for capacitive strain gauges when printed on structural materials. Previous work on the BST/SS316L material system, however, showed that the BST cracks when exposed to temperatures up to 600 °C due to CTE mismatch between the printed BST film and the metallic substrate. When comparing different fabrication techniques, less surface cracking was observed in the samples that deposited thinner (i.e., 2-20 μm) than samples that were thicker (i.e., 135 µm – 300 µm). The objective of this report is to establish a qualification process that will determine and address any challenges (i.e., mechanical failure of thick prints) of the AM sensor prior to its application in experimental tests. To demonstrate the qualification process in this report, laser spallation and uniaxial tensile tests using dynamic and quasi-static loading, respectively, will be discussed.

36 - MATERIALS SCIENCE↗

NASA NTRS2000

Compound Semiconductor Devices for Space Applications

Application of semiconductor devices in high reliability space systems requires a thorough understanding of the reliability and failure mechanisms associated with the selected devices. This paper provides a description of the reliability and qualification issues related to the application of compound semiconductor devices in critical space systems. A discussion of common failure mechanisms, radiation effects and other reliability concerns is provided along with a discussion of methods for technology qualification for high reliability space applications.

Kayali, Sammy↗

NASA NTRSDate not supplied

Robustness of Semi-Superjunction 4H-SiC Power DMOSFETs to Single-Event Burnout from Heavy Ion Bombardment

We compare the failure mechanism and performance of a silicon carbide (SiC) semi-superjunction (semi-SJ) power DMOSFET against pure SJ and conventional DMOSFET when struck by a single heavy ion. The Single-Event Burnout (SEB) failure mechanism was identified as the thermal runaway from second breakdown resulting in mesoplasma formation. The semi-SJ design shifts the mesoplasma location from the drift/substrate interface seen in the control device structures to a location along the center of the P-pillar and closer towards the DMOSFET surface, thus significantly improving the SEB threshold voltage. The SEB threshold voltage varies with pillar width and ratio of pillar thickness to drift layer thickness. A maximum value of SEB threshold voltage is reached when the pillar to drift layer ratio is 0.9 and the pillar width is 2.4 μm. The semi-SJ SEB/breakdown voltage ratio is 100% and 13% higher than the pure SJ and conventional DMOSFET, respectively. Using a new figure of merit (FOM), which accounts for the tradeoff between SEB threshold voltage and on-state performance, we find that the SiC semi-SJ DMOSFET achieves a FOM that is 1.8 and 8 times higher than SJ and conventional DMOSFET, respectively, making the semi-SJ a competitive candidate for radiation hardened applications.

SiC↗

NASA NTRS1971

An experimental study of the mechanism of failure of rocks under borehole jack loading

Laboratory and field tests with an experimental jack and an NX-borehole jack are reported. The following conclusions were made: Under borehole jack loading, a circular opening in a brittle solid fails by tensile fracturing when the bearing plate width is not too small. Two proposed contact stress distributions can explain the mechanism of tensile fracturing. The contact stress distribution factor is a material property which can be determined experimentally. The borehole tensile strength is larger than the rupture flexural strength. Knowing the magnitude and orientation of the in situ stress field, borehole jack test results can be used to determine the borehole tensile strength. Knowing the orientation of the in situ stress field and the flexural strength of the rock substance, the magnitude of the in situ stress components can be calculated. The detection of very small cracks is essential for the accurate determination of the failure loads which are used in the calculation of strengths and stress components.

Van, T. K.↗

DOE OSTI2022

High strain-rate compression behavior of polymeric rod and plate Kelvin lattice structures

The compressive high strain-rate behavior of polymeric Kelvin lattice structures with rod-based or plate-based unit cells was investigated through experimental techniques and finite element simulations. Polymeric lattice structures with 5x5x5 unit cell geometries were manufactured on the millimeter scale using vat polymerization additive manufacturing and tested at low (0.001/s) and high (1000/s) strain-rates. High strain-rate experiments were performed and validated for a viscoelastic split-Hopkinson (Kolsky) pressure bar system (SHPB) coupled with high-speed imaging and digital image correlation (DIC). Experimental results at both low and high strain-rates show the formation of a localized deformation band which was more prevalent in low relative density specimens and low strain-rate experiments. Strain-rate effects of lattice specimens strongly correlate with effects of the base polymer material; both bulk polymer and lattice specimen demonstrated strain-rate hardening, strain-rate stiffening, and decreased fracture strain under dynamic loading. Results show mechanical failure properties and energy absorption depended strongly on the relative density of the lattice specimen and exhibited distinct scaling between relative density and geometry type (rod, plate) and loading rate. High relative density plate-lattices demonstrated inferior mechanical properties to rod-lattices; however, there exists a critical relative density for a given mechanical property (17%- 28%) below which plate-lattices outperform rod-lattices of similar mass. As a result, high strain-rate explicit finite element simulations were performed and showed good agreement with the mechanical failure trends and deformation modes observed in the experiments.

36 MATERIALS SCIENCE↗

NASA NTRS2001

Creep/Rupture Behavior of Melt-Infiltrated SiC/SiC Composites Being Investigated

The failure behavior of melt-infiltrated SiC/SiC ceramic matrix composites is under investigation at the NASA Glenn Research Center as part of NASA's Ultra-Efficient Engine Technology Program. This material was originally developed under the High Speed Research Office's Enabling Propulsion Materials Program. Creep and rupture data provide accelerated testing information to predict material behavior under engine use situations (1500 to 2400 F). This information gives insights into various material development paths to improve composites as well as improve understanding of failure mechanisms. The left figure shows the fracture surface of a CMC material following over 200 hr of testing at 2400 F. This surface demonstrates the kind of fibrous pullout desirable for maximum crack deflection, hence non-brittle failure. Microscopy suggests that creep and rupture of these materials can best be considered as a probabilistic property, rather than a material property. Fiber failure occurs first in isolated regions, while stronger adjacent fibers remain intact. The right figure shows a region where oxide deposits blur and round the fiber images. Because the oxidation kinetics of SiC are well understood, this oxide scale can be used as a measure of the length of time various regions of the composites have been exposed to the environment, hence providing vital information regarding the sequence of failure. The oxide scale in the right figure indicates an early failure of this tow of fibers, whereas adjacent tows remain oxide free, suggesting failure much later in time. The path of various cracks can be followed throughout the composite in this manner, suggesting failure mechanisms.

Hurst, Janet B.↗

NASA NTRSDate not supplied

A Procedure to Quantify Interlaminar Damage in Refractory Composites by In-Situ Micro-X-Ray Computed Tomography

Refractory composites are relevant for hot-structure applications on re-entry vehicles. To develop optimized high-performance hot structures, accurate material property data is required. Material properties that often limit design in two-dimensional (2-D) composites are interlaminar strengths. A better understanding of the failure mechanisms for interlaminar shear (ILS), interlaminar tension (ILT), and curved-beam interlaminar tension (CB-ILT) tests can provide insight on improving the design and fabrication of refractory composites. In-situ tests were performed to capture the progressive failure in American Society for Testing and Materials (ASTM) sized ILS (ASTM D3846), ILT (ASTM D7291), and CB-ILT (ASTM D6415) specimens. Before measuring internal damage of refractory composites specimens, the methodology of the test setup warrants a complete and thorough discussion. Detail on the test procedure, test stand design, micro-x-ray computed tomography (CT) configuration, data processing, and CT system uncertainty is discussed. Through keeping the many parameters of the CT system consistent, the uncertainty of the CT system was minimized, optimizing the quality of measurements. The overall quality of a CT scan can be quantified by three metrics: voxel resolution, minimal voxel resolution feature detection, and directional variability. A better understanding of the progressive failure mechanisms of refractory composites is provided by the results of both the present discussion and the one found in the accompanying paper titled “Analysis of Interlaminar Damage in Refractory Composites by In-Situ Micro-X-Ray Computed Tomography”.

In-situ micro-x-ray CT↗

DOE OSTI2023

Chapter 6: Abuse Response of Batteries Subjected to Mechanical Impact

Electrochemical and thermal models to simulate nominal performance and abuse response of lithium-ion cells and batteries have been reported widely in the literature. Studies on mechanical failure of cell components and how such events interact with the electrochemical and thermal response are relatively less common. This chapter outlines a framework developed under the Computer Aided Engineering for Batteries program to couple failure modes resulting from external mechanical loading to the onset and propagation of electrochemical and thermal events that follow. Starting with a scalable approach to implement failure criteria based on thermal, mechanical, and electrochemical thresholds, we highlight the practical importance of these models using case studies at the cell and module level. The chapter also highlights a few gaps in our understanding of the comprehensive response of batteries subjected to mechanical crash events, the stochastic nature of some of these failure events, and our approach to build safety maps that help improve robustness of battery design by capturing the sensitivity of some key design parameters to heat generation rates under different mitigation strategies.

abuse simulations↗

DOE OSTI2020

Surge-Energy and Overvoltage Ruggedness of P-Gate GaN HEMTs

An essential ruggedness of power devices is the capability of safely withstanding the surge energy. The surge ruggedness of the GaN high-electron-mobility transistor (HEMT), a power transistor with no or minimal avalanche capability, has not been fully understood. This article unveils the comprehensive physics associated with the surge-energy withstand process and the failure mechanisms of p-gate GaN HEMTs. Two commercial p-gate GaN HEMTs with Ohmic- and Schottky-type gate contacts are studied. Two circuits are developed to study the device surge ruggedness: an unclamped inductive switching circuit is first used to identify the withstand dynamics and failure mechanisms, and a clamped inductive switching circuit with a controllable parasitic inductance is then designed to mimic the surge energy in converter-like switching events. The p-gate GaN HEMT is found to withstand the surge energy through a resonant energy transfer between the device capacitance and the load/parasitic inductance rather than a resistive energy dissipation as occurred in the avalanche. If the device resonant voltage goes below zero, the device reversely turns on and the inductor is discharged. The device failure occurs at the transient of peak resonant voltage and is limited by the device overvoltage capability rather than the surge energy, dV/dt , or overvoltage duration. Almost no energy is dissipated in the resonant withstand process and the device failure is dominated by an electric field rather than a thermal runaway. Furthermore, these results provide critical understandings on the ruggedness of GaN HEMTs and important references for their qualifications and applications.

42 ENGINEERING↗