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At least 253 records · Page 14

Multiple-Cantilever Torque Sensor

Sensitivity to spurious loads small. High stiffness, high resolution, and ease of fabrication among features of specially designed torque sensor. Device flexible and sensitive to torque about its cylindrical axis and stiff enough to be insensitive to bending about any perpendicular axis. Measures and transmits torque between driving and driven plates.

Lurie, Boris J.↗

Diffractive Optic Fluid Shear Stress Sensor

Light scattering off particles flowing through a two-slit inteference pattern can be used to measure the shear stress of the fluid. We have designed and fabricated a miniature diffractive optic sensor based on this principle.

fluid shear stress micro sensor non-invasive senso↗

Diffractive Optic Fluid Shear Stress Sensor

Light scattering off particles flowing through a two-slit interference pattern can be used to measure the shear stress of the fluid. We have designed and fabricated a miniature diffractive optic sensor based on this principle.

optics↗

Research study of pressure instrumentation

To obtain a more vibration resistant pressure sensor for use on the Space Shuttle Main Engine, a proximity probe based, diaphragm type pressure sensor breadboard was developed. A fiber optic proximity probe was selected as the sensor. In combination with existing electronics, a thermal stability evaluation of the entire probe system was made. Based upon the results, a breadboard design of the pressure sensor and electronics was made and fabricated. A brief series of functional experiments was made with the breadboard to calibrate, thermally compensate, and linearize its response. In these experiments, the performance obtained in the temperature range of -320 F (liquid N2) to +200 F was comparable to that of the strain gage based sensor presently in use on the engine. In tests at NASA-Marshall Space Flight Center (MSFC), after some time at or near liquid nitrogen temperatures, the sensor output varied over the entire output range. These large spurious signals were attributed to condensation of air in the sensing gap. In the next phase of development of this sensor, an evaluation of fabrication techniques toward greater thermal and mechanical stability of the fiber probe assembly must be made. In addition to this, a positive optics to metal seal must be developed to withstand the pressure that would result from a diaphragm failure.

Hoogenboom, L.↗

Development of InSb charge-coupled infrared imaging devices: Linear imager

The following results were accomplished in the development of charge coupled infrared imaging devices: (1) a four-phase overlapping gate with 9 transfers (2-bits) and 1.0-mil gate lengths was successfully operated, (2) the measured transfer efficiency of 0.975 for this device is in excellent agreement with predictions for the reduced gate length device, (3) mask revisions of the channel stop metal on the 8582 mask have been carried out with the result being a large increase in the dc yield of the tested devices, (4) partial optical sensitivity to chopped blackbody radiation was observed for an 8582 9-bit imager, (5) analytical consideration of the modulation transfer function degradation caused by transfer inefficiency in the CCD registers was presented, and (6) for larger array lengths or for the insertion of isolated bits between sensors, improvements in InSb fabrication technology with corresponding decrease in the interface state density are required.

Phillips, J. D.↗

A high frequency silicon pressure sensor

Theoretical and design considerations as well as fabrication and experimental work involved in the development of high-frequency silicon pressure sensors with an ultra-small diaphragm are discussed. A sensor is presented with a rectangular diaphragm of 0.0127 cm x 0.0254 cm x 1.06 micron; the sensor has a natural frequency of 625 kHz and a sensitivity of 0.82 mv/v-psi. High-frequency results from shock tube testing and low-frequency (less than 50 kHz) comparison with microphones are given.

Kahng, S. K.↗

Electronically scanned multichannel pressure transducer system for cryogenic environments

Research into the application of custom doped piezoresistive silicon pressure sensors has led to a multichannel pressure sensor design that will operate accurately and reliably at cryogenic temperatures. The thermal effects upon multichannel pressure sensors are mapped by thermal calibrations and are represented by sets of nth order coefficients specific to each sensor. The thermal offset and sensitivity variations are corrected by computer algorithms which scan the sensors, recall correction coefficients from thermally induced sensor variations, and apply these to correct the sensor's output measurement uncertainty to within 0.5 percent of full scale output for combined offset and sensitivity. A prototype sensor system has been fabricated, and performance test data are presented.

Chapman, John J.↗

A hybrid electronically scanned pressure module for cryogenic environments

Pressure is one of the most important parameters measured when testing models in wind tunnels. For models tested in the cryogenic environment of the National Transonic Facility at NASA Langley Research Center, the technique of utilizing commercially available multichannel pressure modules inside the models is difficult due to the small internal volume of the models and the requirement of keeping the pressure transducer modules within an acceptable temperature range well above the -173 degrees C tunnel temperature. A prototype multichannel pressure transducer module has been designed and fabricated with stable, repeatable sensors and materials optimized for reliable performance in the cryogenic environment. The module has 16 single crystal silicon piezoresistive pressure sensors electrostatically bonded to a metalized Pyrex substrate for sensing the wind tunnel model pressures. An integral temperature sensor mounted on each silicon micromachined pressure sensor senses real-time temperature fluctuations to within 0.1 degrees C to correct for thermally induced non-random sensor drift. The data presented here are from a prototype sensor module tested in the 0.3 M cryogenic tunnel and thermal equilibrium conditions in an environmental chamber which approximates the thermal environment (-173 degrees C to +60 degrees C) of the National Transonic Facility.

Chapman, J. J.↗

Carbon Nanotube Biosensors for Space Molecule Detection and Clinical Molecular Diagnostics

Both space molecule detection and clinical molecule diagnostics need to develop ultra sensitive biosensors for detection of less than attomole molecules such as amino acids for DNA. However all the electrode sensor systems including those fabricated from the existing carbon nanotubes, have a background level of nA (nanoAmp). This has limited DNA or other molecule detection to nA level or molecules whose concentration is, much higher than attomole level. A program has been created by NASA and NCI (National Cancer Institute) to exploit the possibility of carbon nanotube based biosensors to solve this problem for both's interest. In this talk, I will present our effort on the evaluation and novel design of carbon nanotubes as electrode biosensors with strategies to minimize background currents while maximizing signal intensity.The fabrication of nanotube electrode arrays, immobilization of molecular probes on nanotube electrodes and in vitro biosensor testing will also be discussed.

Han, Jie↗

Plasma-enhanced chemical vapor deposition of multiwalled carbon nanofibers

Plasma-enhanced chemical vapor deposition is used to grow vertically aligned multiwalled carbon nanofibers (MWNFs). The graphite basal planes in these nanofibers are not parallel as in nanotubes; instead they exhibit a small angle resembling a stacked cone arrangement. A parametric study with varying process parameters such as growth temperature, feedstock composition, and substrate power has been conducted, and these parameters are found to influence the growth rate, diameter, and morphology. The well-aligned MWNFs are suitable for fabricating electrode systems in sensor and device development.

Nanotechnology/instrumentation/methods↗

Silicon Nanotips Antireflection Surface for Micro Sun Sensor

We have developed a new technique to fabricate antireflection surface using silicon nano-tips for use on a micro sun sensor for Mars rovers. We have achieved randomly distributed nano-tips of radius spanning from 20 nm to 100 nm and aspect ratio of ~200 using a two-step dry etching process. The 30(deg) specular reflectance at the target wavelength of 1 (mu)m is only about 0.09 %, nearly three orders of magnitude lower than that of bare silicon, and the hemispherical reflectance is ~ 8%. By changing the density and aspect ratio of these nanotips, the change in reflectance is demonstrated. Using surfaces covered with these nano-tips, the critical problem of ghost images that are caused by multiple internal reflections in a micro sun sensor was solved.

antireflection↗

Certifying Acoustic Emission for the Crack Inspection of Integrated Pressure Components

To address the limitations of other nondestructive evaluation (NDE) methods on integrated components due to access constraints, a novel Acoustic Emission (AE) pressure vessel health test was developed in accordance with ASME BPVC.V Article 12. This test was then validated using notched Ti-6Al-4V panels taken to a stress level equivalent to 1.1 times the Maximum Allowable Working Pressure (MAWP) of a flight pressure vessel. The assessment involved utilizing JSC small sample Probability of Detection (POD) calculations, which represents the initial step towards obtaining flight certification for an NDE technique. A robust filtering technique that specifically identifies crack growth was formulated with the assistance of industry partners. This detection method exhibited superior detection ability compared to other NDE methods or microscopy. Within industry, the presence of a group of triangulated energetic crack-like indications typically leads to supplemental inspection or the failure of a tank. The experimental results confirm that this approach, commonly applied to more robust tanks, can be viably extended to integrated aerospace pressure components in scenarios where components can be subjected to pressures up to 1.1 times the MAWP. The testing process encountered delays due to sensor delivery and panel fabrication. Thus far, samples with crack initiators have shown energy levels 10 times higher than blunted controls. This suggests a trend where high individual and total cluster energy could be employed as acceptance criteria. Moreover, the cumulative energy of clusters might serve as a foundation for estimating crack sizes; however, this aspect requires further assessment and localized supplemental inspections are preferred.

certifying↗

Ultra-Sensitive Transition-Edge Sensors for the Background Limited Infrared/Sub-mm Spectrograph (BLISS)

We report progress in fabricating ultra-sensitive superconducting transition-edge sensors (TESs) for BLISS. BLISS is a suite of grating spectrometers covering 35-433 micron with R approx. 700 cooled to 50 mK that is proposed to fly on the Japanese space telescope SPICA. The detector arrays for BLISS are TES bolometers readout with a time domain SQUID multiplexer. The required noise equivalent power (NEP) for BLISS is NEP = 10(exp -19) W/Hz(exp 1/2) with an ultimate goal of NEP= 5 x 10(exp -20) W/Hz(exp 1/2) to achieve background limited noise performance. The required and goal response times are tau = 150 ms and tau = 50ms respectively to achieve the NEP at the required and goal optical chop frequency 1-5 Hz. We measured prototype BLISS arrays and have achieved NEP = 6 x 10(exp -18) W/Hz(exp 1/2) and tau = 1.4 ms with a Ti TES (T(sub C) = 565 mK) and NEP approx. 2.5 x 10(exp -19) W/Hz(exp 1/2) and tau approximates 4.5 ms with an Ir TES (T(sub C) = 130 mK). Dark power for these tests is estimated at 1-5 fW.

transition-edge sensors (TESs)↗

High Temperature Testing with Sapphire Fiber White-Light Michelson Interferometers

In the design of new aerospace materials, developmental testing is conducted to characterize the behavior of the material under severe environmental conditions of high stress, temperature, and vibration. But to test these materials under extreme conditions requires sensors that can perform in harsh environments. Current sensors can only monitor high temperature test samples using long throw instrumentation, but this is inherently less accurate than a surface mounted sensor, and provides no means for fabrication process monitoring. A promising alternative is the use of sapphire optical fiber sensors. Sapphire is an incredibly rugged material, being extremely hard (9 mhos), chemically inert, and having a melting temperature (over 2000 C). Additionally, there is a extensive background of optical fiber sensors upon which to draw for sapphire sensor configurations.

Barnes, A.↗

Capacitive Position Sensor For Accelerometer

Capacitive position sensor measures displacement of proof mass in prototype accelerometer described in "Single-Crystal Springs for Accelerometers" (NPO-18795). Sensor is ultrasensitive, miniature device operating at ultra-high frequency and described in more detail in "Ultra-High-Frequency Capacitive Displacement Sensor," (NPO-18675). Advances in design and fabrication of prototype accelerometer also applicable to magnetometers and other sensors in which sensed quantities measured in terms of deflections of small springs.

Vanzandt, Thomas R.↗

Inflight optical measurement of antenna surfaces

A technology base was developed for a wide variety of applications oriented sensors to meet requirements for the fabrication, assembly, test, surface figure monitoring, and ultimately surface figure active control of large space antennas. An optical sensor technique is described which establishes an ideal centerline at each beam during fabrication or later during assembly. Deviations from the centerline, either in lateral deformation or in twist, are measured to produce limit warnings or to evoke active control at the building machine.

Neiswander, R. S.↗

Germanium Lift-Off Masks for Thin Metal Film Patterning

A technique has been developed for patterning thin metallic films that are, in turn, used to fabricate microelectronics circuitry and thin-film sensors. The technique uses germanium thin films as lift-off masks. This requires development of a technique to strip or undercut the germanium chemically without affecting the deposited metal. Unlike in the case of conventional polymeric lift-off masks, the substrate can be exposed to very high temperatures during processing (sputter deposition). The reason why polymeric liftoff masks cannot be exposed to very high temperatures (greater than 100 C) is because (a) they can become cross linked, making lift-off very difficult if not impossible, and (b) they can outgas nitrogen and oxygen, which then can react with the metal being deposited. Consequently, this innovation is expected to find use in the fabrication of transition edge sensors and microwave kinetic inductance detectors, which use thin superconducting films deposited at high temperature as their sensing elements. Transition edge sensors, microwave kinetic inductance detectors, and their circuitry are comprised of superconducting thin films, for example Nb and TiN. Reactive ion etching can be used to pattern these films; however, reactive ion etching also damages the underlying substrate, which is unwanted in many instances. Polymeric lift-off techniques permit thin-film patterning without any substrate damage, but they are difficult to remove and the polymer can outgas during thin-film deposition. The outgassed material can then react with the film with the consequence of altered and non-reproducible materials properties, which, in turn, is deleterious for sensors and their circuitry. The purpose of this innovation was to fabricate a germanium lift-off mask to be used for patterning thin metal films.

Brown, Ari↗

SEPS guidance and navigation autonomy selection via mission analysis

A systematic rationale for selecting a cost-effective guidance and navigation (G & N) autonomy level for the solar electric propulsion stage (SEPS) vehicle is developed. After a definition of autonomy levels, a mission analysis is performed for representative SEPS missions using realistic G & N sensor hardware. Cost data for fabricating, integrating and refurbishing onboard avionics hardware and the ground costs corresponding to each autonomy level are generated. Results are presented that indicate performance of various G & N sensor hardware sets and the dominating factors which influence G & N autonomy level selection.

Causey, W.↗