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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 235 records · Page 13

Scalable DAQ system operating the CHIPS-5 neutrino detector

The CHIPS R&D project focuses on development of low-cost water Cherenkov neutrino detectors through novel design strategies and resourceful engineering. This work presents an end-to-end DAQ solution intended for a recent 5 kt CHIPS prototype, which is largely based on affordable mass-produced components. Much like the detector itself, the presented instrumentation is composed of modular arrays that can be scaled up and easily serviced. A single such array can carry up to 30 photomultiplier tubes (PMTs) accompanied by electronics that generate high voltage in-situ and deliver time resolution of up to 0.69 ns. In addition, the technology is compatible with the White Rabbit timing system, which can synchronize its elements to within 100 ps. While deployment issues did not permit the presented DAQ system to operate beyond initial evaluation, the presented hardware and software successfully passed numerous commissioning tests that demonstrated their viability for use in a large-scale neutrino detector, instrumented with thousands of PMTs.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Automated Detection of Qubit Structures on Quantum Chips

In this study, YOLO (You Only Look Once), a well-known object detection and image segmentation model, is used to detect qubits on a quantum chip. The model is trained by exposing it to various images of objects of interest and by tweaking various training parameters to allow the model to learn from a limited and highly specialized dataset of SEM imagery. The model was provided with numerous images of qubits and various prominent features of note located on a qubit. These detections were then integrated into a simple GUI, allowing for real-time feedback alongside SEM usage. This will allow us to create various functions enabling automated functions like chip-wide scanning, auto-focusing, and image correction.

Perjuste, Ruth [Wellesley Coll.]↗

Notch insensitivity in fatigue failure of chopped carbon fiber chip-reinforced composites using experimental and computational analysis

This study focuses on the notch effect on the fatigue failure of chopped carbon fiber chip-reinforced sheet molding compound (SMC) composites by using both experimental and numerical methods. The S-N diagrams of notched specimens are first obtained experimentally, which exhibit large scatter and are shown to depend on the spatial distribution of local fiber orientations. After considering the effect of this spatial distribution by adopting a new fatigue damage parameter to normalize the results, we achieve a much better correlation in the normalized S-N diagram for all the notched specimens with different hole diameters. Next, compared with the fatigue results of smooth specimens without notches, we find that SMC composites under tension-tension fatigue loading exhibit notch-insensitivity, which renders this type of composites a better candidate in joints or similar applications. Meanwhile, the fatigue failure mechanisms of notched SMC composites are explored through a microstructure characterization procedure. On this basis, a computational micromechanics model considering the notch effect and an improved multi-scale progressive damage fatigue law, calibrated by coupon-level fatigue tests of smooth SMC composites under different loading conditions, are employed to predict the fatigue behavior of notched SMC composites. We show that detailed failure processes and fatigue life of notched SMC composites can be efficiently and adequately predicted by this computational framework.

36 MATERIALS SCIENCE↗

Experimental and computational analysis of bending fatigue failure in chopped carbon fiber chip reinforced composites

With a better balance among good mechanical performance, high freedom of design, and low material and manufacturing cost, chopped carbon fiber chip reinforced sheet molding compound (SMC) composites show great potential in different engineering applications. Here in this paper, bending fatigue behaviors of SMC composites considering the heterogeneous fiber orientation distributions have been thoroughly investigated utilizing both experimental and computational methods. First, four-point bending fatigue tests are performed with designed SMC composites, and the local modulus is adopted as a metric to represent the local fiber orientation of two opposing sides. Interestingly, SMC composites with and without large discrepancy in local modulus of opposing sides show different fatigue behaviors. Interrupted tests are conducted to explore the bending fatigue failure mechanism, and the damage processes of valid specimens are also closely examined. We find that the fatigue failure of SMC composites under four-point bending is governed by crack propagation instead of crack initiation. Because of this, the heterogeneous local fiber orientations of both sides of the specimen influence fatigue life. The microstructure of the lower side shows a direct influence while that of the upper side also exhibiting influence which becomes more prominent for high cycle fatigue cases. Furthermore, a hybrid micro–macro computational model is proposed to efficiently study the cyclic bending behavior of SMC composites. The region of interest is reconstructed with a modified random sequential absorption algorithm to conserve all the microstructural details including the heterogeneous fiber orientation, while the rest of the regions are modeled as homogenized macro-scale continua. Combined with a framework to capture the progressive fatigue damage under cyclic bending, the bending fatigue behaviors of SMC composites are accurately captured by the hybrid computational model comparing with our experimental analysis.

36 MATERIALS SCIENCE↗

Automated Lane Centering: An Off-the-Shelf Computer Vision Product vs. Infrastructure-Based Chip-Enabled Raised Pavement Markers

Safe autonomous vehicle (AV) operations depend on an accurate perception of the driving environment, which necessitates the use of a variety of sensors. Computational algorithms must then process all of this sensor data, which typically results in a high on-vehicle computational load. For example, existing lane markings are designed for human drivers, can fade over time, and can be contradictory in construction zones, which require specialized sensing and computational processing in an AV. But, this standard process can be avoided if the lane information is simply transmitted directly to the AV. High definition maps and road side units (RSUs) can be used for direct data transmission to the AV, but can be prohibitively expensive to establish and maintain. Additionally, to ensure robust and safe AV operations, more redundancy is beneficial. A cost-effective and passive solution is essential to address this need effectively. In this research, we propose a new infrastructure information source (IIS), chip-enabled raised pavement markers (CERPMs), which provide environmental data to the AV while also decreasing the AV compute load and the associated increase in vehicle energy use. CERPMs are installed in place of traditional ubiquitous raised pavement markers along road lane lines to transmit geospatial information along with the speed limit using long range wide area network (LoRaWAN) protocol directly to nearby vehicles. This information is then compared to the Mobileye commercial off-the-shelf traditional system that uses computer vision processing of lane markings. Our perception subsystem processes the raw data from both CEPRMs and Mobileye to generate a viable path required for a lane centering (LC) application. To evaluate the detection performance of both systems, we consider three test routes with varying conditions. Our results show that the Mobileye system failed to detect lane markings when the road curvature exceeded ±0.016 m -1 . For the steep curvature test scenario, it could only detect lane markings on both sides of the road for just 6.7% of the given test route. On the other hand, the CERPMs transmit the programmed geospatial information to the perception subsystem on the vehicle to generate a reference trajectory required for vehicle control. The CERPMs successfully generated the reference trajectory for vehicle control in all test scenarios. Moreover, the CERPMs can be detected up to 340 m from the vehicle’s position. Our overall conclusion is that CERPM technology is viable and that it has the potential to address the operational robustness and energy efficiency concerns plaguing the current generation of AVs.

33 ADVANCED PROPULSION SYSTEMS↗

On-chip learning of hyper-spectral data for real time target recognition

As the focus of our present paper, we have used the cascade error projection (CEP) learning algorithm (shown to be hardware-implementable) with on-chip learning (OCL) scheme to obtain three orders of magnitude speed-up in target recognition compared to software-based learning schemes. Thus, it is shown, real time learning as well as data processing for target recognition can be achieved.

on-chip learning Cascade Error Projection real tim↗

A Single Chip CMOS APS Digital Camera

A complete programmable digital camera-on-a-chip based on low power active pixel sensor technology is implemented as a single CMOS integrated circuit.

imaging sensor camera-on-a-chip digital camera↗

A 1-Gigabit Memory System on a multi-Chip Module for Space Applications

Current spaceborne applications desire compact, low weight, and high capacity data storage systems along with the additional requirement of radiation tolerance. This paper discusses a memory system on a multi-chip module (MCM) that is designed for space applications.

data storage data storage systems multi-chip modul↗

Compact Multimedia Systems in Multi-chip Module Technology

This tutorial paper shows advanced multimedia system designs based on multi-chip module (MCM) technologies that provide essential computing, compression, communication, and storage capabilities for various large scale information highway applications.!.

Multi-Chip Module Technology↗

A 90 GHz Amplifier Assembled Using Flip-Chip Technology

This letter reports the performance of a novel single-stage W-band amplifier fabricated utilizing flip-chip bump-bonding. We have bump-bonded a high-speed, low-noise InP high electron mobility transistor (HEMT) device onto a separately fabricated passive circuit having a GaAs substrate.

FET amplifiers Millimeter wave FETs bump-bonding m↗

Evaluation of 10V Chip Polymer Tantalum Capacitors for Space Applications

Due to low ESR and safe failure mode, new technology chip polymer tantalum capacitors (CPTC) have gained popularity in the electronics design community, first in commercial applications, and now in hi-rel and space systems. The major drawbacks of these parts are high leakage currents, degradation under environmental stresses, and a relatively narrow temperature range of operating and storage conditions. Several studies have shown that a certain amount of moisture in polymer cathodes is necessary for a normal operation of the parts. This might limit applications of CPTCs in space systems and requires analysis of long-term exposure to deep vacuum conditions on their performance and reliability. High leakage currents and limited maximum operational temperature complicate accelerated testing that is necessary to assess long-term reliability and require new screening and qualification procedures for quality assurance. A better understanding of behavior of CPTCs as compared to traditional, MnO2, capacitors is necessary to develop adequate approaches for QA system for space applications. A specific of CPTCs is that different materials and processes might be used for low-voltage (10 V and less) and high-voltage (above 10 V) capacitors, so performance and degradation processes in these groups require separate analysis. In this work, that is a part of the NASA Electronic Parts and Packaging (NEPP) program, degradation of AC and DC characteristics under environmental stresses at different temperatures and voltages have been studied in nine lots of commercial and automotive grade capacitors rated to 10 V. Results of analysis of leakage currents, high temperature storage (HTS) up to 5000 hrs in vacuum and air at different temperatures, and Highly Accelerated Life Testing (HALT) in the range from 85 C to 145 C are presented. Temperature and voltage acceleration factors were calculated based on approximation of distributions of degradation rates with a general log-linear Weibull model. Mechanisms of degradation and failures, and requirements for screening and qualification testing are discussed.

Tantalum Capacitors↗

Developing High-Throughput Organ-on-a-Chip Models to Investigate the Effects of Ionizing Radiation on the Central Nervous System

One of the main health risks in human space exploration is central nervous system (CNS) damage by ionizing radiation due to exposure to the galactic cosmic rays (GCRs). In animal models, irradiation with simulated GCRs or their components has been shown to cause neuronal damage and neuroinflammation associated with cognitive and behavioral dysfunction. In general, the extent of CNS damage is partially regulated by the blood-brain barrier (BBB), which enables immune cells to enter the CNS. The main cellular regulators of BBB permeability are astrocytes, which also modulate neuronal death, immune responses and oxidative stress, and thus could serve as a robust CNS-specific target for countermeasure development. However, studies on BBB permeability and astrocyte functions in regulating CNS responses to ionizing radiation have been limited, especially in human tissue/organ analogs. Therefore, we established a high-throughput 3D organ-on-a-chip system to study human CNS and BBB impairments in response to ionizing radiation, based on commercially available OrganoPlates (Mimetas, Inc.) seeded with primary or induced pluripotent stem cell-derived human cells. We investigated both immediate and delayed CNS responses to major GCR components: 0.15-0.5 Gy 250MeV/n 4-He, and 0.3-0.8 Gy 600 MeV/n 56-Fe; as well as to 0.5-1 Gy X-rays. We observed ionizing radiation-mediated increases in BBB permeability that was exacerbated by astrocyte presence and accompanied by morphological changes in endothelial cells and tight junctions, altered cytokine profile including TNFa upregulation, and increased oxidative stress. We also quantified irradiation-mediated changes in astrocyte activation and neuronal functions, revealing major astrocyte damage mediated by 600MeV/n 56-Fe particles. Thus, we demonstrate that deep space radiation may contribute to CNS damage by disrupting both astrocyte and endothelial cell components of the blood-brain barrier. Our next steps include mapping and validating the transcriptomic changes induced by simulated GCRs and their components in human CNS models. Ultimately, we aim to uncover potential novel targets for countermeasure developments to mitigate CNS damage in long duration spaceflight.

Radiation↗