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At least 217 records · Page 12

Thermal coupling of a heat flux sensor

The conditions of thermal coupling were investigated in relationship to the development of sensors for local thermal flux measurements of component surfaces. The dependence of the transfer function on heat conductivity coefficient of the measured object and the influence of the contact resistance at the sensor boundaries are discussed in terms of known results and investigations.

Kaiser, E.↗

Post heat treatment effects on double layer metal structures for VLSI applications

The realization of high yield double layer metal systems using wet chemistry processes and the ability to extend yields beyond that attainable with wet chemistry by means of post sintering processes at temperatures below 500 C for potential applications in very large scale integration structures were studied. Yields in excess of 98% and average total contact resistance of less than 150 ohms and 200 ohms were realized for a series of 560 vias of 0.5 X 0.5 mils and 0.2 X 0.2 mils in size, respectively.

Wade, T. E.↗

Electrical characteristics of amorphous iron-tungsten contacts on silicon

The electrical characteristics of amorphous Fe-W contacts have been determined on both p-type and n-type silicon. The amorphous films were obtained by cosputtering from a composite target. Contact resistivities of 1 x 10 to the -7th and 2.8 x 10 to the -6th were measured on n(+) and p(+) silicon, respectively. These values remain constant after thermal treatment up to at least 500 C. A barrier height of 0.61 V was measured on n-type silicon.

Finetti, M.↗

MOD silver metallization for photovoltaics

Photovoltaic cells require back side metallization and a collector grid system on the front surface. Both front and back surface metallizations should have good adhesion, low contact resistance, low sheet resistance, long term stability, and their deposition methods should not degrade the n-p junction. Advantages and disadvantages of different deposition methods are discussed.

Vest, G. M.↗

Metalizing Solar Cells by Selective Electroplating

Contact patterns traced by laser scanning. Conductor paths deposited on silicon solar-cell wafers by laser irradiation followed by electroplating. Laser-assisted metalization technique offers better resolution and lower contact resistance than does conventional metalization by screen printing. At the same time, less expensive than metalization with masks and photolithography.

Dutta, S.↗

p/n InP homojunction solar cells with a modified contacting scheme by liquid phase epitaxy

p/n InP homojunction solar cells with a modified contacting scheme have been fabricated from wafers grown by liquid phase epitaxy. A p(+)-In(0.53)Ga(0.47)As contacting layer is incorporated in the cell structure to reduce contact resistance and to eliminaate surface spiking problems at the front surface. The highest conversion efficiency (total area) obtained under AM0 illumination is 15.0 percent. The corresponding open-circuit voltage, short-circuit current density, and fill factor for the best cell are 0.866 V, 29.3 mA/sq cm, and 81.0 percent, respectively.

Choi, K. Y.↗

Ink jet assisted metallization for low cost flat plate solar cells

Computer-controlled ink-jet-assisted metallization of the front surface of solar cells with metalorganic silver inks offers a maskless alternative method to conventional photolithography and screen printing. This method can provide low cost, fine resolution, reduced process complexity, avoidance of degradation of the p-n junction by firing at lower temperature, and uniform line film on rough surface of solar cells. The metallization process involves belt furnace firing and thermal spiking. With multilayer ink jet printing and firing, solar cells of about 5-6 percent efficiency without antireflection (AR) coating can be produced. With a titanium thin-film underlayer as an adhesion promoter, solar cells of average efficiency 8.08 percent without AR coating can be obtained. This efficiency value is approximately equal to that of thin-film solar cells of the same lot. Problems with regard to lower inorganic content of the inks and contact resistance are noted.

Teng, K. F.↗

Testing Conductive Films For Continuity

Apparatus tests thin conductive films for continuity without touching them. Specimen irradiated with 10-keV electrons; then noncontacting electrostatic probe scans specimen and measures charge on spot directly under it. Avoids damage to film and error from contact resistance resulting from touching film with conventional probe. Developed to determine integrity of conductive coats applied to surfaces of dielectric materials to inhibit accumulation of electrostatic charges.

Leung, Philip L.↗

Inverse problems and optimal experiment design in unsteady heat transfer processes identification

Experimental-computational methods for estimating characteristics of unsteady heat transfer processes are analyzed. The methods are based on the principles of distributed parameter system identification. The theoretical basis of such methods is the numerical solution of nonlinear ill-posed inverse heat transfer problems and optimal experiment design problems. Numerical techniques for solving problems are briefly reviewed. The results of the practical application of identification methods are demonstrated when estimating effective thermophysical characteristics of composite materials and thermal contact resistance in two-layer systems.

Artyukhin, Eugene A.↗

Directly deposited current collecting grids for AMTEC electrodes

Current collection in electrodes for the alkali metal thermal to electric converter (AMTEC) has been improved by using molybdenum grids to decrease sheet and contact resistance in RhW and PtW electrodes. The grids are directly deposited on the solid electrolyte either by sputter- or photodeposition. Comparison of electrodes having such underlying grids with those without such grids has shown power produced in an AMTEC cell to be increased by as much as 35 percent.

Ryan, M. A.↗

Thermostructural applications of heat pipes for cooling leading edges of high-speed aerospace vehicles

Heat pipes have been considered for use on wing leading edge for over 20 years. Early concepts envisioned metal heat pipes cooling a metallic leading edge. Several superalloy/sodium heat pipes were fabricated and successfully tested for wing leading edge cooling. Results of radiant heat and aerothermal testing indicate the feasibility of using heat pipes to cool the stagnation region of shuttle-type space transportation systems. The test model withstood a total seven radiant heating tests, eight aerothermal tests, and twenty-seven supplemental radiant heating tests. Cold-wall heating rates ranged from 21 to 57 Btu/sq ft-s and maximum operating temperatures ranged from 1090 to 1520 F. Follow-on studies investigated the application of heat pipes to cool the stagnation regions of single-stage-to-orbit and advanced shuttle vehicles. Results of those studies indicate that a 'D-shaped' structural design can reduce the mass of the heat-pipe concept by over 44 percent compared to a circular heat-pipe geometry. Simple analytical models for heat-pipe startup from the frozen state (working fluid initially frozen) were adequate to approximate transient, startup, and steady-state heat-pipe performance. Improvement in analysis methods has resulted in the development of a finite-element analysis technique to predict heat-pipe startup from the frozen state. However, current requirements of light-weight design and reliability suggest that metallic heat pipes embedded in a refractory composite material should be used. This concept is the concept presently being evaluated for NASP. A refractory-composite/heat-pipe-cooled wing leading edge is currently being considered for the National Aero-Space Plane (NASP). This concept uses high-temperature refractory-metal/lithium heat pipes embedded within a refractory-composite structure and is significantly lighter than an actively cooled wing leading edge because it eliminates the need for active cooling during ascent and descent. Since the NASP vehicle uses cryogenic hydrogen to cool structural components and then burns this fuel in the combustor, hydrogen necessary for descent cooling only, when the vehicle is unpowered, is considered to be a weight penalty. Details of the design of the refractory-composite/heat-pipe-cooled wing leading edge are currently being investigated. Issues such as thermal contact resistance and thermal stress are also being investigated.

Camarda, Charles J.↗

Progress in p(+)n InP solar cells fabricated by thermal diffusion

The performance results of our most recently thermally diffused InP solar cells using the p(+)n (Cd,S) structures are presented. We have succeeded in fabricating cells with measured AMO, 25 C V(sub oc) exceeding 880 mV (bare cells) which to the best of our knowledge is higher than previously reported V(sub oc) values for any InP homojunction solar cells. The cells were fabricated by thinning the emitter, after Au-Zn front contacting, from its initial thickness of about 4.5 microns to about 0.6 microns. After thinning, the exposed surface of the emitter was passivated by a thin (approximately 50A) P-rich oxide. Based on the measured EQY and J(sub sc)-V(sub oc) characteristics of our experimental high V(sub oc) p(+)n InP solar cells, we project that reducing the emitter thickness to 0.3 microns, using an optimized AR coating, maintaining the surface hole concentration of 3 x 10(exp 18)cm(sup -3), reducing the grid shadowing from actual 10.55 percent to 6 percent and reducing the contact resistance will increase the actual measured 12.57 percent AMO 25 C efficiency to about 20.1 percent. By using our state-of-the-art p(+)n structures which have a surface hole concentration of 4 x 10(exp 18)cm(sup -3) and slightly improving the front surface passivation, an even higher practically achievable AMO, 25 C efficiency of 21.3 percent is projected.

Flood, D. J.↗

TAB interconnects for space concentrator solar cell arrays

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Avery, J.↗

The design, development and qualification of a lightweight antenna pointing mechanism

This paper describes the design, development, and qualification of a new lightweight and compact Antenna Pointing Mechanism (APM). The APM was specially designed to meet the stringent mass, envelope, and environmental requirements of OFFEQ experimental satellite. During the development phase, some problems were encountered with the brushless DC motors, slip ring contact resistance, and bearing drag torque. All of these problems were resolved, and two APM units have been operating successfully in orbit since April, 1995.

Shmulevitz, M.↗

Directly Deposited Current Collecting Grids for Alkali Metal Thermal-to-Electric Converter Electrodes

Current collection in porous thin film electrodes on solid electrolytes has been improved by using thick film grids to decrease sheet and contact resistance in RhW and PtW electrodes. The grids are directly deposited on the solid electrolyte either by sputter- or photodeposition, and the electrode deposited over the grid. Comparison of the performance of electrodes having such underlying grids with that of electrodes without such grids has shown performance, as measured by current or power produced, to be improved by 10-30% in electrodes with grids.

Ryan, M. A.↗

A New High Efficiency Segmented Thermoelectric Unicouple

To achieve high thermal-to-electric energy conversion efficiency, it is desirable to operate thermoelectric generator devices over large temperature gradients and also to maximize the thermoelectric performance of the materials used to build the devices. However, no single thermoelectric material is suitable for use over a very wide range of temperatures (approx. 300 - 1000 K). It is therefore necessary to use different materials in each temperature range where they possess optimum performance. This can be achieved in two ways: 1) multistage thermoelectric generators where each stage operates over a fixed temperature difference and is electrically insulated but thermally in contact with the other stages and 2) segmented generators where the p- and n-legs are formed of different segments joined in series. The concept of integrating new thermoelectric materials developed at the Jet Propulsion Laboratory (JPL) into a segmented thermoelectric generator has been presented in detail in earlier publications . This new generator is expected to operate over a 300-973 K temperature difference and will use novel segmented legs based on a combination of state-of-the-art thermoelectric materials and novel p-type Zn4Sb3, p-type CeFe4Sb12-based alloys and n-type CoSb3-based alloys. An increase in the conversion efficiency of about 60% is expected compared to conventional Bi2Te3- and PbTe-based generators. We present in this paper the latest experimental results from the bonding studies between the different segments of the p-legs, n-legs, and p-leg to n-leg interconnect. Evaluation of the bond quality was done by measuring the contact resistance across the joints as well as by detailed microstructure investigations to reveal any potential interdiffusion. Among the materials investigated as inter-layers between the different segments of the legs, Pd-Ag joining alloys have been found to provide mechanically stable and low electrical resistance bonds.

Caillat, T.↗

Numerical Methodology For Full-Body TPS Sizing And Optimization For Access-To-Space Vehicles

This paper presents details of the methodology and numerical procedures developed at NASA Ames for full-body TEXAS sizing and optimization for Access to Space vehicle concepts. The core of the procedures is a robust implicit solver for one dimensional transient heat conduction in reusable multilayer TEXAS stackups. The solver includes an arbitrary number of material layers, contact resistances between materials, temperature and pressure dependent material and surface properties, numerous boundary-condition options, and self-adaptive time stepping. The solver is coupled with the Access-to-Space material database of 23 candidate TPS and structural materials and a thermal-environment database obtained from trajectory-based fullbody Navier-Stokes computations of the external flowfield. The thermal environment and material response are coupled through the use of T-type heat transfer coefficients. TIPS sizing and weight optimization are performed at every surface point on the vehicle based on sizing constraints which include material temperature limits, maximum backwall temperature, and cumulative interior heat flux. Typical results are presented for a lifting body concept with 10000 surface points, which required 35 minutes to compute on an SGI Indigo 2.

Milos, Frank S.↗