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At least 199 records · Page 11

Evaluation of Inorganic/Organic Separators

Thirty-six (36) experimental 40AH sealed silver-zinc cells were constructed during phase I of this two (2) phase program. These cells were divided into six (6) groups of six (6) cells each. Each group of six (6) cells was evenly divided into two batches of three (3) cells each. Groups 1 through 4 each featured a different inorganic filler material in the slurry used to coat the separator substrate. Groups 5 and 6 featured an alternate method of separator bag construction. With the exception of the various separator materials, the parts and processes used to produce these thirty-six (36) cells were the same as those used to make the HR40-7 cell. The two (2) batches of cells in each cell group differed only in the lots of solutions and other separator slurry components used. Each cell was given two formation charge/discharge cycles prior to being shipped to NASA Lewis Research Center. Phase II of the program consisted of constructing another thirty-six (36) 40AH experimental cells in six (6) groups of six (6) cells each. Each group was distinguished by the type of precoated separator material used to fabricate separator bags. A new method of separator bag construction was used in this phase of the program. These cells were given two (2) formation cycles and shipped to NASA Lewis Research Center.

Donnel, C. P., III↗

Slicing of silicon into sheet material: Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project

Multiblade slurry sawing is used to slice 10 cm diameter silicon ingots into wafers 0.024 cm thick using 0.050 cm of silicon per slice (0.026 cm kerf loss). Total slicing time is less than twenty hours, and 143 slices are produced simultaneously. Productivity (slice area per hour per blade) is shown as a function or blade load and thickness, and abrasive size. Finer abrasive slurries cause a reduction in slice productivity, and thin blades cause a reduction of wafer accuracy. Sawing induced surface damage is found to extend 18 microns into the wafer.

Holden, S. C.↗

Borehole hydraulic coal mining system analysis

The borehole hydraulic coal mining system accesses the coal seam through a hole drilled in the overburden. The mining device is lowered through the hole into the coal seam where it fragments the coal with high pressure water jets which pump it to the surface as a slurry by a jet pump located in the center of the mining device. The coal slurry is then injected into a pipeline for transport to the preparation plant. The system was analyzed for performance in the thick, shallow coal seams of Wyoming, and the steeply pitching seams of western Colorado. Considered were all the aspects of the mining operation for a 20-year mine life, producing 2,640,000 tons/yr. Effects on the environment and the cost of restoration, as well as concern for health and safety, were studied. Assumptions for design of the mine, the analytical method, and results of the analysis are detailed.

Floyd, E. L.↗

A fusible heat sink concept for extravehicular activity /EVA/ thermal control

This paper describes the preliminary design and analysis of a heat sink system, utilizing a phase change slurry material, to be used for astronaut and equipment cooling during manned space missions. During normal use, excess heat in the liquid cooling garment (LCG) coolant is transferred to a regenerable fusible heat sink. Recharge is accomplished by disconnecting the heat sink from the liquid cooling garment and placing it in an onboard freezer for simultaneous slurry refreeze and power supply recharge.

Roebelen, G. J., Jr.↗

Development of coal-feeding systems at the Morgantown Energy Research Center

Systems for feeding crushed and pulverized coal into coal conversion reactor vessels are described. Pneumatic methods for feeding pulverized coal, slurry feeders, and coal pumps, methods for steam pickup, and a method for drying a water-coal slurry in a steam fluidized bed subsequent to feeding the coal into a reactor vessel are included.

Hobday, J. M.↗

Large area Czochralski silicon

The overall cost effectiveness of the Czochralski process for producing large-area silicon was determined. The feasibility of growing several 12 cm diameter crystals sequentially at 12 cm/h during a furnace run and the subsequent slicing of the ingot using a multiblade slurry saw were investigated. The goal of the wafering process was a slice thickness of 0.25 mm with minimal kerf. A slice + kerf of 0.56 mm was achieved on 12 cm crystal using both 400 grit B4C and SiC abrasive slurries. Crystal growth experiments were performed at 12 cm diameter in a commercially available puller with both 10 and 12 kg melts. Several modifications to the puller hoz zone were required to achieve stable crystal growth over the entire crystal length and to prevent crystallinity loss a few centimeters down the crystal. The maximum practical growth rate for 12 cm crystal in this puller design was 10 cm/h, with 12 to 14 cm/h being the absolute maximum range at which melt freeze occurred.

Rea, S. N.↗

Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project

Fabrication of a prototype large capacity multiple blade slurry saw is considered. Design of the bladehead which will tension up to 1000 blades, and cut a 45 cm long silicon ingot as large as 12 cm in diameter is given. The large blade tensioning force of 270,000 kg is applied through two bolts acting on a pair of scissor toggles, significantly reducing operator set-up time. Tests with an upside-down cutting technique resulted in 100% wafering yields and the highest wafer accuracy yet experienced with MS slicing. Variations in oil and abrasives resulted only in degraded slicing results. A technique of continuous abrasive slurry separation to remove silicon debris is described.

Holden, S. C.↗

Stratospheric aerosols - Undissolved granules and physical state

The physical state of stratospheric aerosol particles was studied along with the nature of included undissolved granules. It was found that: (1) undissolved granules are present in only a third of the aerosol particles and are not always associated with a slurry matrix, (2) those undissolved particles usually contain only sulfur and sodium or undetectable light elements, (3) all stratospheric aerosols have a similar appearance: a volatile slurry mixture of crystalline-like material in a liquid matrix, and (4) variations in the relative amounts of liquid and crystalline materials at different times cause variations in particle spreading.

Farlow, N. H.↗

Slicing of silicon into sheet material: Silicon sheet growth development for the large area silicon sheet task of the Low Cost Silicon Solar Array project

The limits of blade tolerance were defined. The standard blades are T-2 thickness tolerance. Good results were obtained by using a slurry fluid consisting of mineral oil and a lubricity additive. Adjustments of the formulation and fine tuning of the cutting process with the new fluid are necessary. Test results and consultation indicate that the blade breakage encountered with water based slurries is unavoidable. Two full capacity (974 wafer) runs were made on the large prototype saw. Both runs resulted in extremely low yield. However, the reasons for the low yield were lack of proper technique rather than problems with machine function. The test on the effect of amount of material etched off of an as-sawn wafer on solar cell efficiency were completed. The results agree with previous work at JPL in that the minimum material removed per side that gives maximum efficiency is on the order of 10 microns.

Fleming, J. R.↗

Analysis and Evaluation of Processes and Equipment in Tasks 2 and 4 of the Low-cost Solar Array Project

The significant economic data for the current production multiblade wafering and inner diameter slicing processes were tabulated and compared to data on the experimental and projected multiblade slurry, STC ID diamond coated blade, multiwire slurry and crystal systems fixed abrasive multiwire slicing methods. Cost calculations were performed for current production processes and for 1982 and 1986 projected wafering techniques.

Goldman, H.↗

Slicing of Silicon into Sheet Material. Silicon Sheet Growth Development for the Large Area Silicon Sheet Task of the Low Cost Silicon Solar Array Project

Tests on mineral oil slurries show that the potential for workability and low cost is present. However, slurries tested to date which had sufficient lubricity exhibited wafer breakage problems near the end of the run for as-yet unknown reasons. The first test of the large prototype saw under cutting force control was largely successful in that the controller worked perfectly. Unfortunately a technique error (excessive stroke shortening) caused blade breakage and low yield. The latest run of the large saw pointed up the fact that an indication of end-of-stoke vertical motion, or bounce, is necessary. A circuit to provide such indication was fabricated and installed. Preliminary tests show it to be excessively noise sensitive; therefore, work on grounding and shielding to reduce this sensitivity is in progress.

Fleming, J. R.↗

Internal coating of air cooled gas turbine blades

Six coating systems were evaluated for internal coating of decent stage (DS) eutectic high pressure turbine blades. Sequential deposition of electroless Ni by the hydrazine process, slurry Cr, and slurry Al, followed by heat treatment provided the coating composition and thickness for internal coating of DS eutectic turbine blades. Both NiCr and NiCrAl coating compositions were evaluated for strain capability and ductile to brittle transition temperature.

Ahuja, P. L.↗

Sintered plaque characteristics

The structural transformations occurring during sintering, the fabrication of a slurry produced sintered plaque, are detailed. Degradation of the positive electrode in performance in cycling in a nickel hydrogen battery were traced to the quality of the sintered plaque. Electrode degradation was found to be a limiting factor in the battery cycle life. Details of microstructural characterization and distribution of pores, examination of plastic flow during shrinkage, and observations of the rounding of nickel powder particles during the slurry process are presented.

Vaidyanathan, H.↗

Field experience with various slicing methods

Wafer slicing using internal diameter (ID) saw, multiblade slurry (MBS) saw and multiwire slurry (MWS) saw techniques were evaluated. Wafer parameters such as bow, taper, and roughness which may not be important factors for solar cell fabrication, were considerably better for ID saw than those of the MBS and MWS saw. Analysis of add-on slicing cost indicated that machine productivity seems to be a major limiting factor for ID saw, while expendible material costs are a major factor for both MBS and MWS saw. Slicing experience indicated that the most important factors controling final wafer cost are: (1) silicon cost (wafer thickness + kerf loss); (2) add-on slicing cost, and (3) mechanical yield. There is a very strong interaction between these parameters, suggesting a necessity of optimization of these parameters.

Yoo, H. I.↗

System for slicing wafers

A newly patented process for slicing silicon wafers that has distinct advantages over methods now widely used is described. The primary advantage of the new system is that it allows the efficient slicing of a number of ingots simultaneously at high speed. The cutting action is performed mechanically, most often with diamond particles that are transported to the cutting zone by a fluid vehicle or have been made an integral part of the blade by plating or impregnation. The new system uses a multiple or ganged band saw, arranged and spaced so that each side, or length, segment of a blade element, or loop, provides a cutting function. Each blade is maintained precisely in position by guides as it enters and leaves each ingot. The cutting action is performed with a conventional abrasive slurry composed of diamond grit suspended in an oil- or water-based vehicle. The distribution system draws the slurry from the supply reservoir and pumps it to the injection tubes to supply it to each side of each ingot. A flush system is provided at the outer end of the work-station zone. In order to reduce potential damage, a pneumatically driven flushing fluid is provided.

Source record↗

Dewatering Peat With Activated Carbon

Proposed process produces enough gas and carbon to sustain itself. In proposed process peat slurry is dewatered to approximately 40 percent moisture content by mixing slurry with activated carbon and filtering with solid/liquid separation techniques.

Rohatgi, N. K.↗

Silicon slicing by fixed abrasive slicing technique

One of the major cost factors in silicon ingot technology adaptation for terrestrial photovoltaic application is in slicing boules into wafers. The most developed industrial practice is the Internal Diameter (ID) slicing. This method utilizes diamond cutting. The diamond stands up for long periods, hence, the cost of expendable materials is low. However, the ID technology as practiced today has poor material utilization. The Multiblade Slurry (MBS) method has low equipment and labor costs but its expendable material costs are high. Recently Multiwire Slurry (MWS) technology has shown very good material utilization, but its expendable material costs are even higher than MBS. The multiwire Fixed Abrasive Slicing Technique (FAST) still in advanced development stage, combines the low expendable material costs of ID method, the low labor and equipment costs of MBS and high material utilization of MWS.

Schmid, F.↗