Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “Diffusion Bonding”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 199 records · Page 11
All sourcesNASA NTRSDOE OSTI
NASA NTRS1972

The structure of hydrophobic gas diffusion electrodes.

The 'flooded agglomerate' model of the Teflon-bonded gas diffusion electrode is discussed. A mathematical treatment of the 'flooded agglomerate' model is given; it can be used to predict the performance of the electrode as a function of measurable physical parameters.

Giner, J.↗
NASA NTRS2026

Thermal Inspection for the Assessment of Adhesively Bonded Metal Adherents

Certification of adhesively bonded structures is currently a challenge for aircraft manufacturers. The ability to certify bonds in primary structure can reduce dependence on fasteners and this will enable more efficient manufacturing. For example, drilling holes and installing fasteners in bonded joints can be a potentially significant bottleneck in airframe manufacturing. In addition, fasteners increase the airframe weight and can add stress concentration areas. Reducing fastener count can accelerate manufacturing and improve aircraft performance. NASA is currently investigating nondestructive evaluation (NDE) techniques to assess bond integrity. For example, bond thickness influences bond strength and therefore NDE techniques are being investigated to determine bond thickness. For bonded metal structures, there is a large difference in the thermal diffusivity between the 7075 aluminum alloy metal adherends and aircraft grade adhesive. Multi-layered thermal models show a large variation in the thermal response for bondline adhesive thicknesses that vary from 100 to 300 microns for adherend thicknesses of 0.163 cm. Experimental through-transmission thermal measurements reveal promise to quantitatively characterize the bondline thickness. Results were validated with X-ray computed tomography and optical microscopy measurements, and influence of porosity on the thermal model and measurements are investigated.

bondline thickness↗
NASA NTRS1995

Foil Patches Seal Small Vacuum Leaks

Report discloses technique to patch holes in nickel-alloy rocket-engine nozzle parts prior to vacuum brazing. Technique involves lightly spot-welding nickel foil 0.002 in. thick over hole patched, then spot-welding corrosion-resistant steel foil of same thickness over nickel foil. Once patches subject to pressure and temperature of vacuum brazing, nickel foil diffuses to bond with nickel-alloy nozzle, making vacuum-tight seal.

Spiegel, Kirk W.↗
NASA NTRS2005

Bifunctional catalytic electrode

The present invention relates to an oxygen electrode for a unitized regenerative hydrogen-oxygen fuel cell and the unitized regenerative fuel cell having the oxygen electrode. The oxygen electrode contains components electrocatalytically active for the evolution of oxygen from water and the reduction of oxygen to water, and has a structure that supports the flow of both water and gases between the catalytically active surface and a flow field or electrode chamber for bulk flow of the fluids. The electrode has an electrocatalyst layer and a diffusion backing layer interspersed with hydrophilic and hydrophobic regions. The diffusion backing layer consists of a metal core having gas diffusion structures bonded to the metal core.

Cisar, Alan↗
NASA NTRS1992

Theoretical study of the BeLi, BeNa, MgLi, MgNa, and AlBe molecules and their negative ions

The alkaline earth-alkali diatomics are found to have weak bonds, because the diffuse alkali valence s orbitals cannot form a bond of sufficient strength to pay the promotion energy of the alkaline-earth atoms. This leads to van der Waals bonding in the neutrals as well as the negative ions. In fact, the negative ions have larger binding energies than the neutrals as a result of the much larger polarizability of the negative ion. The binding energy of AlBe is significantly larger than the Be-alkali molecules, due to a covalent contribution to the bonding. The binding energy in AlBe(-) is considerably larger than AlBe; the binding energy of the X 3Sigma(-) state of AlBe(-) is computed to be 1.36 eV, as compared with 0.57 eV for the X 2Pi state of AlBe.

Bauschlicher, Charles W., Jr.↗
NASA NTRS2023

Oxidation of Silicon Particles Suspended in Mullite Matrix With Dual-Mode Vacancy Diffusion of Oxygen

Mullite bond coats filled with silicon particles have recently been proposed for the next generation of environmental barrier coatings (EBCs). The sacrificial oxidation of the silicon particles eliminates some of the environmental durability issues associated with traditional EBC designs. To investigate this novel design approach, a mathematical formulation and resulting numerical method have been developed for simulating the oxidation of silicon particles embedded in a mullite matrix. The focus is on the oxidation of the silicon in a dry oxygen environment where the oxidant is presumably oxygen. Oxygen transport from the exterior environment through the mullite is assumed to occur via two lattice defect diffusion mechanisms. As a result, the rate of oxygen transport is dictated by the self-diffusivity of the lattice defects. The numerical method is implemented using the COMSOL Multiphysics® program (COMSOL, Inc.). The method is applied to simulate the oxidation of silicon particles in a mullite pellet in recent oxidation experiments. Numerical results compare favorably with the oxidation behavior observed in the oxidation experiments. The numerical method is also used to investigate the effects of various features of the mullite-silicon particle system on the oxidation behavior.

silicon oxidation↗
NASA NTRS1990

Role of the interfacial thermal barrier in the effective thermal diffusivity/conductivity of SiC-fiber-reinforced reaction-bonded silicon nitride

Experimental thermal diffusivity data transverse to the fiber direction for composites composed of a reaction bonded silicon nitride matrix reinforced with uniaxially aligned carbon-coated silicon carbide fibers indicate the existence of a significant thermal barrier at the matrix-fiber interface. Calculations of the interfacial thermal conductances indicate that at 300 C and 1-atm N2, more than 90 percent of the heat conduction across the interface occurs by gaseous conduction. Good agreement is obtained between thermal conductance values for the oxidized composite at 1 atm calculated from the thermal conductivity of the N2 gas and those inferred from the data for the effective composite thermal conductivity.

Bhatt, Hemanshu↗
NASA NTRS1974

Eutectic bonding of boron-aluminum structural components. II

Eutectic bonding is a diffusion brazing process developed for fabricating boron-aluminum components from composite monolayer. This process relies on the diffusion of a thin surface film of copper into the aluminum matrix to form a liquid phase when heated above the copper-aluminum eutectic temperature of 1018 F. This type of fabrication offers design flexibility in that skin thickness may be varied, the stiffness geometry and orientation can be varied, and local reinforcement can be added. In addition, this type of boron-aluminum structure offers high efficiency. Also, this method of construction can be cost-comparative with complex titanium shapes; simple tooling permits easy layup, bonding is a one-step operation, and little finish machining is required.

Niemann, J. T.↗
NASA NTRS1995

Cleanliness evaluation of rough surfaces with diffuse IR reflectance

Contamination on bonding surfaces has been determined to be a primary cause for degraded bond strength in certain solid rocket motor bondlines. Hydrocarbon and silicone based organic contaminants that are airborne or directly introduced to a surface are a significant source of contamination. Diffuse infrared (IR) reflectance has historically been used as an effective technique for detection of organic contaminants, however, common laboratory methods involving the use of a Fourier transform IR spectrometer (FTIR) are impractical for inspecting the large bonding surface areas found on solid rocket motors. Optical methods involving the use of acousto-optic tunable filters and fixed bandpass optical filters are recommended for increased data acquisition speed. Testing and signal analysis methods are presented which provide for simultaneous measurement of contamination concentration and roughness level on rough metal surfaces contaminated with hydrocarbons.

Pearson, L. H.↗
NASA NTRS2012

Iridium Interfacial Stack - IrIS

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Spry, David↗
NASA NTRS2015

Alumina-Forming MAX Phases in Turbine Material Systems

Coatings for high temperature turbine components are based on low conductivity YSZ thermal barriers and protective NiAl, NiCoCrAlY bond coats. Good oxidation hot corrosion resistance, intermediate CTE, and strain tolerance of Ti2AlC and Cr2AlC MAX phases are thus of special interest. Their alumina scale growth follows a cubic law in accord with FeCrAlY alloys, with oxygen grain boundary diffusivity: Dgb 1.8 x 10-10 exp(-375 kJmole) m3s. Protective cubic kinetics are also found in high pressure burner rig (6 atm., 25 ms) and TGA tests of MAXthal 211Ti2AlC. The initial portion (0.1 hr) is dominated by fast TiO2 growth (with little evidence of scale volatility in high pressure water vapor, as found for SiO2 scales). Bulk Ti2AlC and Cr2AlC substrates show promise as potential bond coats for YSZ TBCs in 1000-1200 C furnace life (500 h) tests. Cr2AlC is proving to be very resistant to 700-900 C Na2SO4 hot corrosion and is of interest for disk alloys. Preliminary diffusion bonded Cr2AlC-superalloy hybrid couples have survived 1000 hr interrupted furnace tests at 800C with no indication of cracking or debonding. Diffusion zones of -NiAl+Cr7C3 were produced in these above 1000 C, but did not grow to any great extent after 1000 hr at 800 C. Processing as coatings presents challenges, however the basic properties of MAX phases provide novel opportunities for high temperature turbine components.

MAX phase↗
NASA NTRS1968

Bonding large area silicon wafers

Diffusion welding of large area silicon wafers without altering electrical properties of semiconductor devices in wafers

Source record↗