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At least 181 records · Page 10
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Kinematical and mechanical aspects of wafer slicing

Some recently achieved results concerning the technological fundamentals of slurry sawing are presented. The specific material removal process and the related kinematic and geometric contact conditions between workpiece and saw blade are described. The result of a functional description of the slurry sawing process is presented, expressing the main process criteria, such as infeed per stroke, specific removal rate, specific tool wear, and vertical stroke intensity, in terms of the dominating process parameters, such as stroke length, width of workpiece, stroke frequency, specific cutting force and slurry specification.

Werner, P. G.↗
NASA NTRS1990

A semiempirical method for obtaining fuselage normal areas from fuselage Mach sliced areas

An aircraft designed to meet low sonic boom or shaped ground overpressure signature requirements has a volume and lift equivalent area distribution which is in close agreement with the equivalent areas of a desired theoretical curve. Final-stage design modifications of the aircraft's geometry to meet this requirement are usually made through adjustments to the fuselage normal cross-section areas that are derived from the corresponding fuselage equivalent areas by iterative methods. The time required to obtain a good agreement between the desired low-boom area distribution and the conceptual aircraft total area distribution can be reduced by using a semi-empirical method which eliminates much of the final trial-and-error iteration previously employed. Fuselages from conceptual aircraft designed to generate low sonic boom ground overpressures at cruise Mach numbers of 2.0 and 3.0 were used as examples to examine the method's capabilities and limitations. Results indicated that the method has merit as a design tool consistent with other linear theory methods.

Mack, Robert J.↗
NASA NTRS1995

Slices: A Scalable Partitioner for Finite Element Meshes

A parallel partitioner for partitioning unstructured finite element meshes on distributed memory architectures is developed. The element based partitioner can handle mixtures of different element types. All algorithms adopted in the partitioner are scalable, including a communication template for unpredictable incoming messages, as shown in actual timing measurements.

partitioner finite element meshes parallel computi↗
NASA NTRS1988

Multi-wafer slicing with a fixed abrasive

A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.

Schmid, Frederick↗
NASA NTRS2001

Modular electronics packaging system

A modular electronics packaging system includes multiple packaging slices that are mounted horizontally to a base structure. The slices interlock to provide added structural support. Each packaging slice includes a rigid and thermally conductive housing having four side walls that together form a cavity to house an electronic circuit. The chamber is enclosed on one end by an end wall, or web, that isolates the electronic circuit from a circuit in an adjacent packaging slice. The web also provides a thermal path between the electronic circuit and the base structure. Each slice also includes a mounting bracket that connects the packaging slice to the base structure. Four guide pins protrude from the slice into four corresponding receptacles in an adjacent slice. A locking element, such as a set screw, protrudes into each receptacle and interlocks with the corresponding guide pin. A conduit is formed in the slice to allow electrical connection to the electronic circuit.

Hunter, Don J.↗