NASA NTRS · 20080004089
Multi-wafer slicing with a fixed abrasive
Abstract
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
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Schmid, Frederick, Khattak, Chandra P., Smith, Maynard B.. 1988-03-01. Multi-wafer slicing with a fixed abrasive. https://ntrs.nasa.gov/citations/20080004089
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