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At least 181 records · Page 10

AIN-Based Packaging for SiC High-Temperature Electronics

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

Savrun, Ender↗

NASA SpaceCube Intelligent Multi-Purpose System for Enabling Remote Sensing, Communication, and Navigation in Mission Architectures

New, innovative CubeSat mission concepts demand modern capabilities such as artificial intelligence and autonomy, constellation coordination, fault mitigation, and robotic servicing –all of which require vastly more processing resources than legacy systems are capable of providing. Enabling these domains within a scalable, configurable processing architecture is advantageous because it also allows for the flexibility to address varying mission roles, such as a command and data-handling system, a high-performance application processor extension, a guidance and navigation solution, or an instrument/sensor interface. This paper describes the NASA SpaceCube Intelligent Multi-Purpose System (IMPS), which allows mission developers to mix-and-match 1U (10 cm × 10 cm) CubeSat payloads configured for mission-specific needs. The central enabling component of the system architecture to address these concerns is the SpaceCube v3.0 Mini Processor. This single-board computer features the 20nm Xilinx Kintex UltraScale FPGA combined with a radiation-hardened FPGA monitor, and extensive IO to integrate and interconnect varying cards within the system. To unify the re-usable designs within this architecture, the CubeSat Card Standard was developed to guide design of 1U cards. This standard define spinout configurations, mechanical, and electrical specifications for 1U CubeSat cards, allowing the backplane and mechanical enclosure to be easily extended. NASA has developed several cards adhering to the standard (System-on-Chip, power card, etc.), which allows the flexibility to configure a payload from a common catalog of cards.

Advanced Avionics, Hybrid Processing, Data Process↗

Optical communications link design for the tracking and data acquisition system

The communications performances of laser intersatellite links for a future NASA data-relay system are analyzed, and block diagrams of necessary optical terminals are generated based on technology projected to be available by 1992. Direct-detection optical communications subsystems are selected to interconnect two geosynchronous (GEO) satellites separated by 160 deg along the GEO arc and to interconnect a low-earth-orbit (LEO) satellite and either of the GEO satellites. The terminal designs are based on power budget calculations performed for the various links with and without an optical background in either the receiver or transmitter fields of view (FOVs). Optical antennas with 18-cm and 30-cm primary mirror diameters on the LEO and GEO satellites can achieve a 0.000001 average bit error rate during normal operations in each of the forward and return optical links with beginning-of-life (BOL) power margins of approximately 7 dB. With an optical background in the receiver FOV, communications in the GEO-GEO return link are interrupted, the LEO-GEO return link is undegraded, and the GEO-GEO and LEO-GEO forward links remain functional with reduced BOL power margins. With an optical background in the transmitter FOV, the GEO-GEO forward and return links are noticeably degraded, the LEO-GEO return link is only slightly degraded, and the LEO-GEO forward link remains undegraded.

Marshalek, R. G.↗

Enhanced plasma current collection from weakly conducting solar array blankets

Among the solar cell technologies to be tested in space as part of the Solar Array Module Plasma Interactions Experiment (SAMPIE) will be the Advanced Photovoltaic Solar Array (APSA). Several prototype twelve cell coupons were built for NASA using different blanket materials and mounting techniques. The first conforms to the baseline design for APSA which calls for the cells to be mounted on a carbon loaded Kapton blanket to control charging in GEO. When deployed, this design has a flexible blanket supported around the edges. A second coupon was built with the cells mounted on Kapton-H, which was in turn cemented to a solid aluminum substrate. A final coupon was identical to the latter but used germanium coated Kapton to control atomic oxygen attack in LEO. Ground testing of these coupons in a plasma chamber showed considerable differences in plasma current collection. The Kapton-H coupon demonstrated current collection consistent with exposed interconnects and some degree of cell snapover. The other two coupons experienced anomalously large collection currents. This behavior is believed to be a consequence of enhanced plasma sheaths supported by the weakly conducting carbon and germanium used in these coupons. The results reported here are the first experimental evidence that the use of such materials can result in power losses to high voltage space power systems.

Hillard, G. Barry↗

Effects of voltage control in utility interactive dispersed storage and generation systems

When a small generator is connected to the distribution system, the voltage at the point of interconnection is determined largely by the system and not the generator. The effect on the generator, on the load voltage and on the distribution system of a number of different voltage control strategies in the generator is examined. Synchronous generators with three kinds of exciter control are considered, as well as induction generators and dc/ac inverters, with and without capacitor compensation. The effect of varying input power during operation (which may be experienced by generators based on renewable resources) is explored, as well as the effect of connecting and disconnecting the generator at ten percent of its rated power. Operation with a constant slightly lagging factor is shown to have some advantages.

Kirkham, H.↗

Development and refinement of test bed simulations

Lewis Research Center of NASA, with support from Rocketdyne, was engaged in non-real time computer simulation effort for the Space Station Freedom Electric Power System (EPS) EASY5, a simulation package, is used as the primary tool for this activity. Early in the design of the EPS, two test beds were set up at Lewis. The Integrated Test Bed (ITB), that combines and upgrades these test beds, is in the planning stage. The test beds are designed to functionally represent many of the components of the EPS and their interconnections. The simulation effort is primarily directed towards these test beds. Model verification is performed using test bed data.

Dravid, Narayan V.↗

Development and refinement of test bed simulations

Lewis Research Center of NASA, with support from Rocketdyne, has engaged in a nonreal-time computer simulation effort for the Space Station Freedom Electric Power System (EPS). EASYS, a simulation package, is used as the primary tool for this activity. Early in the design of the EPS, two test beds were set up at Lewis. The Integrated Test Bed (ITB) that combines and upgrades these test beds is in the planning stage. The test beds are designed to functionally represent many of the components of the EPS and their interconnections. The simulation effort is primarily directed towards these test beds. Model verification is performed using test bed data.

Dravid, N. V.↗

Using the System Complexity Metric (SCM) to Compare CO2 Removal Systems

A fundamental cause of difficulty in large engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, where there is no obvious mental model that correctly predicts its behavior. Higher system complexity is usually associated with higher cost and higher failure rate. Complexity is perceived if a system has many diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and unanticipated failure modes. Identifying and removing these signs of complexity should improve performance and reduce the cost and failure rate. Complexity can be directly measured by the number of components and their interactions. The System Complexity Metric (SCM) is defined as the sum of the number of parts in a system, N, plus the number of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of the system block diagram. SCM can be used to compare systems and to guide their redesign to reduce cost and failure rate. Carbon dioxide removal systems are analyzed using SCM, cost, and failure rate. As in previous work, cost is directly proportional to SCM and that failure rate increases as a power of SCM for large differences in SCM. The SCM ranking of carbon dioxide removal systems is the same as their ranking in detailed analysis and practice.

Harry W. Jones↗

Using the System Complexity Metric (SCM) to Compare CO2 Reduction Systems

A fundamental cause of difficulty in large engineering projects is their inherent complexity. An impression of complexity occurs if a system is simply difficult to understand, where there is no obvious mental model that correctly predicts its behavior. Higher system complexity is usually associated with higher cost and higher failure rate. Complexity is perceived if a system has many diverse components, multiple interactions and feedback loops, transients and dynamic behavior, and unanticipated failure modes. Identifying and removing these signs of complexity should improve performance and reduce the cost and failure rate. Complexity can be directly measured by the number of components and their interactions. The System Complexity Metric (SCM) is defined as the sum of the number of parts in a system, N, plus the number of the one-way interconnections between them, I. SCM = N + I. The SCM is easily determined by direct inspection of the system block diagram. SCM can be used to compare systems and to guide their redesign to reduce cost and failure rate. Carbon dioxide reduction systems are analyzed using SCM, cost, and failure rate. As in previous work, cost is directly proportional to SCM and that failure rate increases as a power of SCM for large differences in SCM. The SCM ranking of carbon dioxide reduction systems is the same as their ranking in detailed analysis and practice.

Harry W. Jones↗

New Effective Material Couple--Oxide Ceramic and Carbon Nanotube-- Developed for Aerospace Microsystem and Micromachine Technologies

The prime driving force for using microsystem and micromachine technologies in transport vehicles, such as spacecraft, aircraft, and automobiles, is to reduce the weight, power consumption, and volume of components and systems to lower costs and increase affordability and reliability. However, a number of specific issues need to be addressed with respect to using microsystems and micromachines in aerospace applications--such as the lack of understanding of material characteristics; methods for producing and testing the materials in small batches; the limited proven durability and lifetime of current microcomponents, packaging, and interconnections; a cultural change with respect to system designs; and the use of embedded software, which will require new product assurance guidelines. In regards to material characteristics, there are significant adhesion, friction, and wear issues in using microdevices. Because these issues are directly related to surface phenomena, they cannot be scaled down linearly and they become increasingly important as the devices become smaller. When microsystems have contacting surfaces in relative motion, the adhesion and friction affect performance, energy consumption, wear damage, maintenance, lifetime and catastrophic failure, and reliability. Ceramics, for the most part, do not have inherently good friction and wear properties. For example, coefficients of friction in excess of 0.7 have been reported for ceramics and ceramic composite materials. Under Alternate Fuels Foundation Technologies funding, two-phase oxide ceramics developed for superior high-temperature wear resistance in NASA's High Operating Temperature Propulsion Components (HOTPC) project and new two-layered carbon nanotube (CNT) coatings (CNT topcoat/iron bondcoat/quartz substrate) developed in NASA's Revolutionary Aeropropulsion Concepts (RAC) project have been chosen as a materials couple for aerospace applications, including micromachines, in the nanotechnology lubrication task because of their potential for superior friction and wearf properties in air and in an ultrahigh vacuum, spacelike environment. At the NASA Glenn Research Center, two-phase oxide ceramic eutectics, Al2O3/ZrO2(Y2O3), were directionally solidified using the laser-float-zone process, and carbon nanotubes were synthesized within a high-temperature tube furnace at 800 C. Physical vapor deposition was used to coat all quartz substrates with 5-nm-thick iron as catalyst and bondcoat, which formed iron islands resembling droplets and serving as catalyst particles on the quartz. A series of scanning electron micrographs showing multiwalled carbon nanotubes directionally grown as aligned "nanograss" on quartz is presented. Unidirectional sliding friction eperiments were conducted at Glenn with the two-layered CNT coatings in contact with the two-phase Al2O3/ZrO2(Y2O3) eutectics in air and in ultrachigh vacuum. The main criteria for judging the performance of the materials couple for solid lubrication and antistick applications in a space environment were the coefficient of friction and the wear resistance (reciprocal of wear rate), which had to be less than 0.2 and greater than 10(exp 5) N(raised dot)/cubic millimetes, respectively, in ultrahigh vacuum. In air, the coefficient of friction for the CNT coatings in contact with Al2O3/ZrO2 (Y2O3) eutectics was 0.04, one-fourth of that for quartz. In an ultrahigh vacuum, the coefficient of friction for CNT coatings in contact with Al2O3/ZrO2 (Y2O3) was one-third of that for quartz. The two-phase Al2O3/ZrO2 (Y2O3) eutectic coupled with the two-layered CNT coating met the coefficient of friction and wear resistance criteria both in air and in an ultrahigh vacuum, spacelike environment. This material's couple can dramatically improve the stiction (or adhesion), friction, and wear resistance of the contacting surfaces, which are major issues for microdevices and micromachines.

Miyoshi, Kazuhisa↗

A transient FETI methodology for large-scale parallel implicit computations in structural mechanics, part 2

Explicit codes are often used to simulate the nonlinear dynamics of large-scale structural systems, even for low frequency response, because the storage and CPU requirements entailed by the repeated factorizations traditionally found in implicit codes rapidly overwhelm the available computing resources. With the advent of parallel processing, this trend is accelerating because explicit schemes are also easier to parallellize than implicit ones. However, the time step restriction imposed by the Courant stability condition on all explicit schemes cannot yet and perhaps will never be offset by the speed of parallel hardware. Therefore, it is essential to develop efficient and robust alternatives to direct methods that are also amenable to massively parallel processing because implicit codes using unconditionally stable time-integration algorithms are computationally more efficient than explicit codes when simulating low-frequency dynamics. Here we present a domain decomposition method for implicit schemes that requires significantly less storage than factorization algorithms, that is several times faster than other popular direct and iterative methods, that can be easily implemented on both shared and local memory parallel processors, and that is both computationally and communication-wise efficient. The proposed transient domain decomposition method is an extension of the method of Finite Element Tearing and Interconnecting (FETI) developed by Farhat and Roux for the solution of static problems. Serial and parallel performance results on the CRAY Y-MP/8 and the iPSC-860/128 systems are reported and analyzed for realistic structural dynamics problems. These results establish the superiority of the FETI method over both the serial/parallel conjugate gradient algorithm with diagonal scaling and the serial/parallel direct method, and contrast the computational power of the iPSC-860/128 parallel processor with that of the CRAY Y-MP/8 system.

Farhat, Charbel↗

A transient FETI methodology for large-scale parallel implicit computations in structural mechanics

Explicit codes are often used to simulate the nonlinear dynamics of large-scale structural systems, even for low frequency response, because the storage and CPU requirements entailed by the repeated factorizations traditionally found in implicit codes rapidly overwhelm the available computing resources. With the advent of parallel processing, this trend is accelerating because explicit schemes are also easier to parallelize than implicit ones. However, the time step restriction imposed by the Courant stability condition on all explicit schemes cannot yet -- and perhaps will never -- be offset by the speed of parallel hardware. Therefore, it is essential to develop efficient and robust alternatives to direct methods that are also amenable to massively parallel processing because implicit codes using unconditionally stable time-integration algorithms are computationally more efficient when simulating low-frequency dynamics. Here we present a domain decomposition method for implicit schemes that requires significantly less storage than factorization algorithms, that is several times faster than other popular direct and iterative methods, that can be easily implemented on both shared and local memory parallel processors, and that is both computationally and communication-wise efficient. The proposed transient domain decomposition method is an extension of the method of Finite Element Tearing and Interconnecting (FETI) developed by Farhat and Roux for the solution of static problems. Serial and parallel performance results on the CRAY Y-MP/8 and the iPSC-860/128 systems are reported and analyzed for realistic structural dynamics problems. These results establish the superiority of the FETI method over both the serial/parallel conjugate gradient algorithm with diagonal scaling and the serial/parallel direct method, and contrast the computational power of the iPSC-860/128 parallel processor with that of the CRAY Y-MP/8 system.

Farhat, Charbel↗

AMD Radeon e9173 Low Power PCIE GPU Single Event Effects Test Report

The AMD Radeon Embedded e9170 Graphics Processing Unit (GPU), notably the e9173 Peripheral Component Interconnect Express (PCIE) variant, is of interest to Artemis generation programs with requirements for graphics rendering, compute, artificial intelligence (Ai) with a constraints-requiring piece-part procurement and power consumption of less than 50W. In addition to collecting heavy ion data on this device, a secondary purpose of this test campaign was to validate video capture hardware and software workflows used with GPU, microprocessor and system-on-chip device testing. Five (5) test patterns from the NEPP Processor Enclave (NPE) test suite were used with the e9173. The test patterns covered the operating system’s (OS) idle contribution towards the cross section, matrix math using tensorflow-rocm, two artificial intelligence models developed at NASA GSFC, and an industry standard GPU benchmarking application called Mesa GLXGears.

NASA Technical Memorandum (TM) test report for pos↗

Intermediate power conditioners - Where are we now?

It has been recognized in the photovoltaic (PV) industry that even in the event of a dramatic reduction in the price of generating PV cells, the costs for the other components of the system represent still a major obstacle towards commercialization. A project was, therefore, initiated with the aim to develop baseline and conceptual power conditioner designs which would attempt to meet a specified set of cost and performance goals in the 30 to 200 kW (Intermediate) size. Resulting Intermediate Size Power Conditioner Studies led to a number of conclusions. There is a need for a set of guidelines or standards for utility interconnection. The advent of new devices with more power handling capability will change the desired topology.

Klein, J. W.↗

Optical information processing at NASA Ames Research Center

The combination of analog optical processors with digital electronic systems offers the potential of tera-OPS computational performance, while often requiring less power and weight relative to all-digital systems. NASA is working to develop and demonstrate optical processing techniques for on-board, real time science and mission applications. Current research areas and applications under investigation include optical matrix processing for space structure vibration control and the analysis of Space Shuttle Main Engine plume spectra, optical correlation-based autonomous vision for robotic vehicles, analog computation for robotic path planning, free-space optical interconnections for information transfer within digital electronic computers, and multiplexed arrays of fiber optic interferometric sensors for acoustic and vibration measurements.

Reid, Max B.↗

Ka-Band MMIC Subarray Technology Program (Ka-Mist)

Ka-band monolithic microwave integrated circuit (MMIC) arrays have been considered as having high potential for increasing the capability of space, aircraft, and land mobile communication systems in terms of scan performance, data rate, link margin, and flexibility while offering a significant reduction in size, weight, and power consumption. Insertion of MMIC technology into antenna systems, particularly at millimeter wave frequencies using low power and low noise amplifiers in closed proximity to the radiating elements, offers a significant improvement in the array transmit efficiency, receive system noise figure, and overall array reliability. Application of active array technology also leads to the use of advanced beamforming techniques that can improve beam agility, diversity, and adaptivity to complex signal environments. The objective of this program was to demonstrate the technical feasibility of the 'tile' array packaging architecture at EHF via the insertion of 1990 MMIC technology into a functional tile array or subarray module. The means test of this objective was to demonstrate and deliver to NASA a minimum of two 4 x 4 (16 radiating element) subarray modules operating in a transmit mode at 29.6 GHz. Available (1990) MMIC technology was chosen to focus the program effort on the novel interconnect schemes and packaging requirements rather than focusing on MMIC development. Major technical achievements of this program include the successful integration of two 4 x 4 subarray modules into a single antenna array. This 32 element array demonstrates a transmit EIRP of over 300 watts yielding an effective directive power gain in excess of 55 dB at 29.63 GHz. The array has been actively used as the transmit link in airborne/terrestrial mobile communication experiments accomplished via the ACTS satellite launched in August 1993.

Pottinger, W.↗

PSAW/MicroSWIS [Microminiature Surface Acoustic Wave (SAW) based Wirelesss Instrumentation System]

This Final Report for the PSAW/MicroSWIS Program is provided in compliance with contract number NAS3-01118. This report documents the overall progress of the program and presents project objectives, work carried out, and results obtained. Program Conceptual Design Package stated the following objectives: To develop a sensor/transceiver network that can support networking operations within spacecraft with sufficient bandwidth so that (1) flight control data, (2) avionics data, (3) payload/experiment data, and (4) prognostic health monitoring sensory information can flow to appropriate locations at frequencies that contain the maximum amount of information content but require minimum interconnect and power: a very high speed, low power, programmable modulation, spread-spectrum radio sensor/transceiver.

Heermann, Doug↗

Power Actuation and Switching Module Test Results

The X2000 Power System Electronics (PSE) is a Jet Propulsion Laboratory (JPL) task to develop a new generation of power system building blocks for use on future deep-space missions. The effort includes the development of electronic components and modules that can be used as building blocks in the design of generic spacecraft power systems. All X2000 avionics components and modules are designed for use in centralized or distributed spacecraft architectures. The Power Actuation and Switching Module (PASM) has been developed under the X2000 program. This component enables a modular and scalable design approach for power switching applications, which can result in a wide variety of power switching architectures using this simple building block. The PASM is designed to provide most of the necessary power switching functions of spacecraft for various Deep Space missions including future missions to Mars, comets, Jupiter and its moons. It is fabricated using an ASIC process that is tolerant of high radiation. The development included two application specific integrated circuits (ASICs) and support circuitry all packaged using High Density Interconnect (HDI) technology. It can be operated in series or parallel with other PASMs. It can be used as a high-side or low-side switch and it can drive thruster valves, pyrotechnic devices such as NASA standard initiators, bus shunt resistors, and regular spacecraft component loads. Each PASM contains two independent switches with internal current limiting and over-current trip-off functions to protect the power subsystem from load faults. During turnon and turnoff each switch can limit the rate of current change (di/dt) to a value determined by the user. Three-way majority-voted On/Off commandability and full switch status telemetry (both analog and digital) are built into the module. This paper is a follow up to the one presented at he IECEC 2004 conference that will include the lessons learned and test results from the development.

X2000↗