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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 181 records · Page 10

Effects Of Environmental And Operational Stresses On RF MEMS Switch Technologies For Space Applications

Micro Electro Mechanical Systems (MEMS) have been heralded for their ability to provide tremendous advantages in electronic systems through increased electrical performance, reduced power consumption, and higher levels of device integration with a reduction of board real estate. RF MEMS switch technology offers advantages such as low insertion loss (0.1- 0.5 dB), wide bandwidth (1 GHz-100 GHz), and compatibility with many different process technologies (quartz, high resistivity Si, GaAs) which can replace the use of traditional electronic switches, such as GaAs FETS and PIN Diodes, in microwave systems for low signal power (x < 500 mW) applications. Although the electrical characteristics of RF MEMS switches far surpass any existing technologies, the unknown reliability, due to the lack of information concerning failure modes and mechanisms inherent to MEMS devices, create an obstacle to insertion of MEMS technology into high reliability applications. All MEMS devices are sensitive to moisture and contaminants, issues easily resolved by hermetic or near-hermetic packaging. Two well-known failure modes of RF MEMS switches are charging in the dielectric layer of capacitive membrane switches and contact interface stiction of metal-metal switches. Determining the integrity of MEMS devices when subjected to the shock, vibration, temperature extremes, and radiation of the space environment is necessary to facilitate integration into space systems. This paper will explore the effects of different environmental stresses, operational life cycling, temperature, mechanical shock, and vibration on the first commercially available RF MEMS switches to identify relevant failure modes and mechanisms inherent to these device and packaging schemes for space applications. This paper will also describe RF MEMS Switch technology under development at NASA GSFC.

Jah, Muzar↗

Quasi-Linear Circuit

This work involved developing spacequalifiable switch mode DC/DC power supplies that improve performance with fewer components, and result in elimination of digital components and reduction in magnetics. This design is for missions where systems may be operating under extreme conditions, especially at elevated temperature levels from 200 to 300 degC. Prior art for radiation-tolerant DC/DC converters has been accomplished utilizing classical magnetic-based switch mode converter topologies; however, this requires specific shielding and component de-rating to meet the high-reliability specifications. It requires complex measurement and feedback components, and will not enable automatic re-optimization for larger changes in voltage supply or electrical loading condition. The innovation is a switch mode DC/DC power supply that eliminates the need for processors and most magnetics. It can provide a well-regulated voltage supply with a gain of 1:100 step-up to 8:1 step down, tolerating an up to 30% fluctuation of the voltage supply parameters. The circuit incorporates a ceramic core transformer in a manner that enables it to provide a well-regulated voltage output without use of any processor components or magnetic transformers. The circuit adjusts its internal parameters to re-optimize its performance for changes in supply voltage, environmental conditions, or electrical loading at the output

Bradley, William↗

Setup Aid for Electrical-Discharge Machining

Interlock assures that workpiece is correctly assembled in machining fixture. A Plunger in a Hollow Shaft actuates a switch, allowing a power supply to produce current for electrical-discharge machining. Plunger operates only when necessary parts are position.

Lines, G.↗

Autonomous Inspection of Electrical Transmission Structures with Airborne UV Sensors - NASA Report on Dominion Virginia Power Flights of November 2016

The report details test and measurement flights to demonstrate autonomous UAV inspection of high voltage electrical transmission structures. A UAV built with commercial, off-the-shelf hardware and software, supplemented with custom sensor logging software, measured ultraviolet emissions from a test generator placed on a low-altitude substation and a medium-altitude switching tower. Since corona discharge precedes catastrophic electrical faults on high-voltage structures, detection and geolocation of ultraviolet emissions is needed to develop a UAV-based self-diagnosing power grid. Signal readings from an onboard ultraviolet sensor were validated during flight with a commercial corona camera. Geolocation was accomplished with onboard GPS; the UAV position was logged to a local ground station and transmitted in real time to a NASA server for tracking in the national airspace.

Moore, Andrew J.↗

A study of power conditioning and power distribution and components

A comprehensive simulation and analysis performed on the operation of the regulator part of the Charger/Battery/Regulator Module (CBRM) are detailed. The CBRM is utilized as an integral component of the Skylab/Apollo Telescope Mount (ATM) electrical power system and contains a switching mode electronic regulator. Implementing circuit analysis techniques, pertinent voltages and currents are calculated; these, in turn, are incorporated into the regulator system study. Investigation of the turn-on and turn-off times associated with the switching circuitry is performed and an examination is made on these calculations. A simulation model computer program is utilized to generate graphs that relate various CBRM parameters to one another.

Horton, H. M.↗

Diode step stress program for JANTX1N1202A

Power/temperature step stress was applied to the switching diode JANTX1N1202A manufactured by General Electric and International Rectifier. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are given.

Source record↗

Thermal and Mechanical Microspacecraft Technologies for X-2000 Future Deliveries

Thermal and mechanical technologies are an important part of the X-2000 Future Delivery (X-2000 FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by the X-2000 FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The X2000 FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. One of the key ideas used in the development of these technologies and architecture is that several functions be in included in each of the thermal and mechanical elements. One of the thermal architecture being explored for the X-2000 FD microspacecraft is integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to X-2000 FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper to be presented at the 1999 conference, will describe the progress made so far in the microspacecraft thermal and mechanical technologies and approaches for the X2000 Future Deliveries microspacecraft.

Birur, Gaj↗

Thermal and Mechanical Microspacecraft Technologies for Deep Space Systems Program X2000 Future Deliveries

Thermal and mechanical technologies are an important part of the Deep Space Systems Technology (DSST) Program X2000 Future Deliveries (FD) microspacecraft. A wide range of future space missions are expected to utilize the technologies and the architecture developed by DSST FD. These technologies, besides being small in physical size, make the tiny spacecraft robust and flexible. The DSST FD architecture is designed to be highly reliable and suitable for a wide range of missions such as planetary landers/orbiters/flybys, earth orbiters, cometary flybys/landers/sample returns, etc. Two of the key ideas used in the development of thermal and mechanical technologies and architectures are: 1) to include several of the thermal and mechanical functions in any given single spacecraft element and 2) the architecture be modular so that it can easily be adapted to any of the future missions. One of the thermal architectures being explored for the DSST FD microspacecraft is the integrated thermal energy management of the complete spacecraft using a fluid loop. The robustness and the simplicity of the loop and the flexibility with which it can be integrated in the spacecraft have made it attractive for applications to DSST FD. Some of the thermal technologies to be developed as a part of this architecture are passive and active cooling loops, electrically variable emittance surfaces, miniature thermal switches, and specific high density electronic cooling technologies. In the mechanical area, multifunction architecture for the structural elements will be developed. The multifunction aspect is expected to substantially reduce the mass and volume of the spacecraft. Some of the technologies that will be developed are composite material panels incorporating electronics, cabling, and thermal elements in them. The paper describes the current state of the technologies and progress to be made in the thermal and mechanical technologies and approaches for the DSST Future Deliveries microspacecraft.

Birur, Gajanana C.↗

Reliable Breakdown Obtained in Silicon Carbide Rectifiers

The High Temperature Integrated Electronics and Sensor (HTIES) Program at the NASA Lewis Research Center is currently developing silicon carbide (SiC) for use in harsh conditions where silicon, the semiconductor used in nearly all of today's electronics, cannot function. Silicon carbide's demonstrated ability to function under extreme high-temperature, high-power, and/or high-radiation conditions will enable significant improvements to a far-ranging variety of applications and systems. These range from improved high-voltage switching for energy savings in public electric power distribution and electric vehicles, to more powerful microwave electronics for radar and cellular communications, to sensor and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines.

Neudeck, Philip G.↗

Silicon Carbide High-Temperature Power Rectifiers Fabricated and Characterized

The High Temperature Integrated Electronics and Sensors (HTIES) team at the NASA Lewis Research Center is developing silicon carbide (SiC) for use in harsh conditions where silicon, the semiconductor used in nearly all of today's electronics, cannot function. Silicon carbide's demonstrated ability to function under extreme high-temperature, high power, and/or high-radiation conditions will enable significant improvements to a far ranging variety of applications and systems. These improvements range from improved high-voltage switching for energy savings in public electric power distribution and electric vehicles, to more powerful microwave electronics for radar and cellular communications, to sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines. In the case of jet engines, uncooled operation of 300 to 600 C SiC power actuator electronics mounted in key high-temperature areas would greatly enhance system performance and reliability. Because silicon cannot function at these elevated temperatures, the semiconductor device circuit components must be made of SiC. Lewis' HTIES group recently fabricated and characterized high-temperature SiC rectifier diodes whose record-breaking characteristics represent significant progress toward the realization of advanced high-temperature actuator control circuits. The first figure illustrates the 600 C probe-testing of a Lewis SiC pn-junction rectifier diode sitting on top of a glowing red-hot heating element. The second figure shows the current-versus voltage rectifying characteristics recorded at 600 C. At this high temperature, the diodes were able to "turn-on" to conduct 4 A of current when forward biased, and yet block the flow of current ($quot;turn-off") when reverse biases as high as 150 V were applied. This device represents a new record for semiconductor device operation, in that no previous semiconductor electronic device has ever simultaneously demonstrated 600 C functionality, and 4-A turn-on and 150-V rectification. The high operating current was achieved despite severe device size limitations imposed by present-day SiC wafer defect densities. Further substantial increases in device performance can be expected when SiC wafer defect densities decrease as SiC wafer production technology matures.

Source record↗

Antenna reconfiguration verification and validation

A method of testing the electrical functionality of an optically controlled switch in a reconfigurable antenna is provided. The method includes configuring one or more conductive paths between one or more feed points and one or more test point with switches in the reconfigurable antenna. Applying one or more test signals to the one or more feed points. Monitoring the one or more test points in response to the one or more test signals and determining the functionality of the switch based upon the monitoring of the one or more test points.

Becker, Robert C.↗

Reproducible Growth of High-Quality Cubic-SiC Layers

Semiconductor electronic devices and circuits based on silicon carbide (SiC) are being developed for use in high-temperature, high-power, and/or high-radiation conditions under which devices made from conventional semiconductors cannot adequately perform. The ability of SiC-based devices to function under such extreme conditions is expected to enable significant improvements in a variety of applications and systems. These include greatly improved high-voltage switching for saving energy in public electric power distribution and electric motor drives; more powerful microwave electronic circuits for radar and communications; and sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines.

Neudeck, Philip G.↗

Autonomous Inspection of Electrical Transmission Structures with Airborne UV Sensors and Automated Air Traffic Management

This report details test and measurement flights to demonstrate autonomous UAV (Unmanned Aerial Vehicle) inspection of high-voltage electrical transmission structures. A UAV built with commercial, off-the-shelf hardware and software, supplemented with custom sensors and logging software, measured ultraviolet (UV) emissions from a test generator placed on a low-altitude substation and a medium-altitude switching tower. Since corona discharge precedes catastrophic electrical faults on high-voltage structures, detection and geolocation of ultraviolet emissions is needed to develop a UAV-based self-diagnosing power grid. Signal readings from an onboard ultraviolet sensor were validated during flight with a commercial corona camera. Geolocation was accomplished with onboard GPS; the UAV position was logged to a local ground station and transmitted in real time to a NASA server for tracking in the national airspace. The method has practicality and relevance but not adequacy; either improved UAV position determination technology or increased sensor range is needed to enable broad deployment of this method.

Moore, Andrew J.↗

System for automatically switching transformer coupled lines

A system is presented for automatically controlling transformer coupled alternating current electric lines. The secondary winding of each transformer is provided with a center tap. A switching circuit is connected to the center taps of a pair of secondary windings and includes a switch controller. An impedance is connected between the center taps of the opposite pair of secondary windings. The switching circuit has continuity when the AC lines are continuous and discontinuity with any disconnect of the AC lines. Normally open switching means are provided in at least one AC line. The switch controller automatically opens the switching means when the AC lines become separated.

Dwinell, W. S.↗

Release mechanism for releasing and reattaching experiments on the Space Shuttle

The release mechanism (REM) unlatches an experiment so that it can be moved about inside and outside the shuttle bay by the remote manipulator system (RMS), and then reattaches it to the REM base. Operated from the crew compartment after the RMS has been attached to the experiment, the REM releases the experiment by an electric motor driving a gear train and linkage which extracts four pins from holes in four plates. Electrical connectors on the REM are disengaged by the mechanical action of the structural pins retracting from the plates. When the REM releases the experiment, an unlatched indicator is actuated in the crew compartment, and then the experiment can be moved by using the RMS. To reattach the experiment to the REM, the RMS places the experiment with REM attachment angles against the flat, smooth surface of the REM; then the RMS moves the experiment into position for latchup. Actuation of an electric motor drives the four pins into the four holes in the plates. When fully latched, a switch actuated by the motion of the linkage, shuts the electric motor off and gives an indication to the crew compartment that the REM is latched.

Clark, A. V.↗

Two-Range Electrical Thermometer

Thermocouple and resistance thermometer expand thermometer scale. Switch thrown up to connect platinum resistance temperature detector or down to connect (platinum/rhodium)/platinum thermocouple to meter. Thermocouple integral part of platinum resistance temperature detector wiring.

Bridges, W. F.↗

Electrolytic Heat Switch

Experiments demonstrated feasibility of electrolytic device of electrically-controllable thermal conductivity. Device includes inner ionomeric layer of low thermal conductivity sandwiched between two metal-foil electrodes. Device's ionomeric layer will be conductive polymer - perhaps polyaniline. In effect, device will be metal/conductive-polymer secondary electrical cell.

Walsh, Miles↗