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At least 181 records · Page 10

High-Temperature Electronics: A Role for Wide Bandgap Semiconductors?

It is increasingly recognized that semiconductor based electronics that can function at ambient temperatures higher than 150 C without external cooling could greatly benefit a variety of important applications, especially-in the automotive, aerospace, and energy production industries. The fact that wide bandgap semiconductors are capable of electronic functionality at much higher temperatures than silicon has partially fueled their development, particularly in the case of SiC. It appears unlikely that wide bandgap semiconductor devices will find much use in low-power transistor applications until the ambient temperature exceeds approximately 300 C, as commercially available silicon and silicon-on-insulator technologies are already satisfying requirements for digital and analog very large scale integrated circuits in this temperature range. However, practical operation of silicon power devices at ambient temperatures above 200 C appears problematic, as self-heating at higher power levels results in high internal junction temperatures and leakages. Thus, most electronic subsystems that simultaneously require high-temperature and high-power operation will necessarily be realized using wide bandgap devices, once the technology for realizing these devices become sufficiently developed that they become widely available. Technological challenges impeding the realization of beneficial wide bandgap high ambient temperature electronics, including material growth, contacts, and packaging, are briefly discussed.

Neudeck, Philip G.↗

Pulsed Operation of an Ion Accelerator

Electronic circuitry has been devised to enable operation of an ion accelerator in either a continuous mode or a highpeak power, low-average-power pulsed mode. In the original intended application, the ion accelerator would be used as a spacecraft thruster and the pulse mode would serve to generate small increments of impulse for precise control of trajectories and attitude. The present electronic drive circuitry generates the extraction voltage in pulses. Pulse-width modulation can affect rapid, fine control of time-averaged impulse or ion flux down to a minimum level much lower than that achievable in continuous operation.

Wirz, Richard↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗

Electron-cyclotron-resonance (ECR) plasma acceleration

A research effort directed at analytically and experimentally investigating electron-cyclotron-resonance (ECR) plasma acceleration is outlined. In addition, relevant past research is reviewed. Also, the prospects for application of ECR plasma acceleration to spacecraft propulsion are described. It is shown that previously unexplained losses in converting microwave power to directed kinetic power via ECR plasma acceleration can be understood in terms of diffusion of energized plasma to the physical walls of the accelerator. It is also argued that line radiation losses due to electron-ion and electron-atom inelastic collisions should be less than estimated in past research. Based on this new understanding, the expectation now exists that very efficient ECR plasma accelerators can be designed for application to high-specific-impulse spacecraft propulsion.

Sercel, Joel C.↗

Reproducible Growth of High-Quality Cubic-SiC Layers

Semiconductor electronic devices and circuits based on silicon carbide (SiC) are being developed for use in high-temperature, high-power, and/or high-radiation conditions under which devices made from conventional semiconductors cannot adequately perform. The ability of SiC-based devices to function under such extreme conditions is expected to enable significant improvements in a variety of applications and systems. These include greatly improved high-voltage switching for saving energy in public electric power distribution and electric motor drives; more powerful microwave electronic circuits for radar and communications; and sensors and controls for cleaner-burning, more fuel-efficient jet aircraft and automobile engines.

Neudeck, Philip G.↗

Projected progress in the engineering state-of-the-art

Projected advances in discipline areas associated with aerospace engineering are discussed. The areas examined are propulsion and power, materials and structures, aerothermodynamics, and electronics. Attention is directed to interdisciplinary relationships; one example would be the application of communications technology to the solution of propulsion problems. Examples involving projected technology changes are presented, and technology integration and societal effects are considered.

Nicks, O. W.↗

Ka-band MMIC beam steered transmitter array

A 32-GHz six-element linear transmitter array utilizing monolithic microwave integrated circuit (MMIC) phase shifters and power amplifiers was designed and tested as part of the development of a spacecraft array feed for NASA deep-space communications applications. Measurements of the performance of individual phase shifters, power amplifiers, and microstrip radiators were carried out, and electronic beam steering of the linear array was demonstrated. The switched-line phase shifters were accurate to within 7 percent on average and the power amplifier 1-dB compressed output power varied over 0.3 dB. The array had a beamwidth of 7.5 deg and demonstrated acceptable beam steering over + or - 8 deg. From the results, it can be concluded that this MMIC phased array has adequate beam-scanning capability for use in the two-dimensional array. The areas that need to be improved are the efficiency of the MMIC power amplifier and the insertion loss of the MMIC phase shifter.

Rascoe, D. L.↗

Electrical Actuation Technology Bridging

This document contains the proceedings of the NASA Electrical Actuation Technology Bridging (ELA-TB) Workshop held in Huntsville, Alabama, September 29-October 1, 1992. The workshop was sponsored by the NASA Office of Space Systems Development and Marshall Space Flight Center (MSFC). The workshop addressed key technologies bridging the entire field of electrical actuation including systems methodology, control electronics, power source systems, reliability, maintainability, and vehicle health management with special emphasis on thrust vector control (TVC) applications on NASA launch vehicles. Speakers were drawn primarily from industry with participation from universities and government. In addition, prototype hardware demonstrations were held at the MSFC Propulsion Laboratory each afternoon. Splinter sessions held on the final day afforded the opportunity to discuss key issues and to provide overall recommendations. Presentations are included in this document.

Hammond, Monica↗

Advanced Power Electronics Components

This paper will give a description and status of the Advanced Power Electronics Materials and Components Technology program being conducted by the NASA Glenn Research Center for future aerospace power applications. The focus of this research program is on the following: 1) New and/or significantly improved dielectric materials for the development of power capacitors with increased volumetric efficiency, energy density, and operating temperature. Materials being investigated include nanocrystalline and composite ceramic dielectrics and diamond-like carbon films; 2) New and/or significantly improved high frequency, high temperature, low loss soft magnetic materials for the development of transformers/inductors with increased power/energy density, electrical efficiency, and operating temperature. Materials being investigated include nanocrystalline and nanocomposite soft magnetic materials; 3) Packaged high temperature, high power density, high voltage, and low loss SiC diodes and switches. Development of high quality 4H- and 6H- SiC atomically smooth substrates to significantly improve device performance is a major emphasis of the SiC materials program; 4) Demonstration of high temperature (> 200 C) circuits using the components developed above.

Schwarze, Gene E.↗

Modular 5-kW Power-Processing Unit Being Developed for the Next-Generation Ion Engine

The NASA Glenn Research Center is developing a 5- to 10-kW ion engine for a broad range of mission applications. Simultaneously, a 5-kW breadboard power-processing unit (PPU) is being designed and fabricated by Boeing Electron Dynamic Devices, Torrance, California, under contract with Glenn. The beam supply, which processes up to 90 percent of the power into this unit, consists of four 1.1-kW power modules connected in parallel, equally sharing the output current. The modular design allows scalability to higher powers as well as the possibility of implementing an N + 1 redundant beam supply. A novel phaseshifted/pulse-width-modulated, dual full-bridge topology was chosen for this module design for its efficient switching characteristics. A breadboard version of the beam power supply module was assembled. Efficiencies ranging between 91.6 and 96.9 percent were measured for an input voltage range of 80 to 160 V, an output voltage range of 800 to 1500 V, and output powers from 0.3 to 1.0 kW. This beam supply could result in a PPU with a total efficiency between 93 and 95 percent at a nominal input voltage of 100 V. This is up to a 4-percent improvement over the state-of-the-art PPU used for the Deep Space 1 mission. A flight-packaged PPU is expected to weigh no more than 15 kg, which represents a 50-percent reduction in specific mass from the Deep Space 1 design. This will make 5-kW ion propulsion very attractive for many planetary missions.

Pinero, Luis R.↗

Thermal Interface Comparisons Under Flight Like Conditions

Thermal interface materials are used in bolted interfaces to promote good thermal conduction between the two. The mounting surface can include panels, heat pipes, electronics boxes, etc.. . On Lunar Reconnaissance Orbiter (LRO) project the results are directly applicable: a) Several high power avionics boxes b) Several interfaces from RWA to radiator through heat pipe network

Rodriquez-Ruiz, Juan↗

High Power Silicon Carbide (SiC) Power Processing Unit Development

NASA GRC successfully designed, built and tested a technology-push power processing unit for electric propulsion applications that utilizes high voltage silicon carbide (SiC) technology. The development specifically addresses the need for high power electronics to enable electric propulsion systems in the 100s of kilowatts. This unit demonstrated how high voltage combined with superior semiconductor components resulted in exceptional converter performance.

Power Processing↗

Applications of Self-Powered Modulating Retroreflectors

NASA Glenn Research Center, in partnership with the U.S. Naval Research Laboratory, has developed self-powered modulating retroreflectors (SMRR) for energy efficient, wireless communications applications. A modulating retroreflector (MRR) consists of a multiple quantum well (MQW) optical detector mounted in front of a retroreflector. The SMRR is integrated the MRR with monolithically integrated module (MIM) photovoltaic (PV) receivers to generate power from interrogating laser-light. SMRRs will provide self power capability that would eliminate batteries or other power sources for MRR drive electronics and sensors. The device can be applied to optical communications, wireless sensor and optical ID tags without a battery. Potential applications and preliminary tests based on a lunar surface communications and navigation simulation will be presented.

Chun, Kue↗

Slot-Antenna/Permanent-Magnet Device for Generating Plasma

A device that includes a rectangular-waveguide/slot-antenna structure and permanent magnets has been devised as a means of generating a substantially uniform plasma over a relatively large area, using relatively low input power and a low gas flow rate. The device utilizes electron cyclotron resonance (ECR) excited by microwave power to efficiently generate plasma in a manner that is completely electrodeless in the sense that, in principle, there is no electrical contact between the plasma and the antenna. Plasmas generated by devices like this one are suitable for use as sources of ions and/or electrons for diverse material-processing applications (e.g., etching or deposition) and for ion thrusters. The absence of plasma/electrode contact essentially prevents plasma-induced erosion of the antenna, thereby also helping to minimize contamination of the plasma and of objects exposed to the plasma. Consequently, the operational lifetime of the rectangular-waveguide/ slot-antenna structure is long and the lifetime of the plasma source is limited by the lifetime of the associated charged-particle-extraction grid (if used) or the lifetime of the microwave power source. The device includes a series of matched radiating slot pairs that are distributed along the length of a plasma-source discharge chamber (see figure). This arrangement enables the production of plasma in a distributed fashion, thereby giving rise to a uniform plasma profile. A uniform plasma profile is necessary for uniformity in any electron- or ion-extraction electrostatic optics. The slotted configuration of the waveguide/ antenna structure makes the device scalable to larger areas and higher powers. All that is needed for scaling up is the attachment of additional matched radiating slots along the length of the discharge chamber. If it is desired to make the power per slot remain constant in scaling up, then the input microwave power must be increased accordingly. Unlike in prior ECR microwave plasma-generating devices, there is no need for an insulating window on the antenna. Such windows are sources of contamination and gradually become ineffective as they become coated with erosion products over time. These characteristics relegate prior ECR microwave plasma-generating devices to non-ion beam, non-deposition plasma applications. In contrast, the lack of need for an insulating window in the present device makes it possible to use the device in both ion-beam (including deposition) and electron-beam applications. The device is designed so that ECR takes place above each slot and the gradient of the magnetic field at each slot is enough to prevent backflow of plasma.

Foster, John E.↗

Low Temperature Characterization of Ceramic and Film Power Capacitors

Among the key requirements for advanced electronic systems is the ability to withstand harsh environments while maintaining reliable and efficient operation. Exposures to low temperature as well as high temperature constitute such stresses. Applications where low temperatures are encountered include deep space missions, medical imaging equipment, and cryogenic instrumentation. Efforts were taken to design and develop power capacitors capable of wide temperature operation. In this work, ceramic and film power capacitors were developed and characterized as a function of temperature from 20 C to -185 C in terms of their dielectric properties. These properties included capacitance stability and dielectric loss in the frequency range of 50 Hz to 100 kHz. DC leakage current measurements were also performed on the capacitors. The manuscript presents the results that indicate good operational characteristic behavior and stability of the components tested at low temperatures.

Hammoud, Ahmad↗

The 10 kW power electronics for hydrogen arcjets

A combination of emerging mission considerations such as 'launch on schedule', resource limitations, and the development of higher power spacecraft busses has resulted in renewed interest in high power hydrogen arcjet systems with specific impulses greater than 1000 s for Earth-space orbit transfer and maneuver applications. Solar electric propulsion systems with about 10 kW of power appear to offer payload benefits at acceptable trip times. This work outlines the design and development of 10 kW hydrogen arcjet power electronics and results of arcjet integration testing. The power electronics incorporated a full bridge switching topology similar to that employed in state of the art 5 kW power electronics, and the output filter included an output current averaging inductor with an integral pulse generation winding for arcjet ignition. Phase shifted, pulse width modulation with current mode control was used to regulate the current delivered to arcjet, and a low inductance power stage minimized switching transients. Hybrid power Metal Oxide Semiconductor Field Effect Transistors were used to minimize conduction losses. Switching losses were minimized using a fast response, optically isolated, totem-pole gate drive circuit. The input bus voltage for the unit was 150 V, with a maximum output voltage of 225 V. The switching frequency of 20 kHz was a compromise between mass savings and higher efficiency. Power conversion efficiencies in excess of 0.94 were demonstrated, along with steady state load current regulation of 1 percent. The power electronics were successfully integrated with a 10 kW laboratory hydrogen arcjet, and reliable, nondestructive starts and transitions to steady state operation were demonstrated. The estimated specific mass for a flight packaged unit was 2 kg/kW.

Hamley, John A.↗

Nuclear Science Symposium, 31st and Symposium on Nuclear Power Systems, 16th, Orlando, FL, October 31-November 2, 1984, Proceedings

Topics related to physics instrumentation are discussed, taking into account cryostat and electronic development associated with multidetector spectrometer systems, the influence of materials and counting-rate effects on He-3 neutron spectrometry, a data acquisition system for time-resolved muscle experiments, and a sensitive null detector for precise measurements of integral linearity. Other subjects explored are concerned with space instrumentation, computer applications, detectors, instrumentation for high energy physics, instrumentation for nuclear medicine, environmental monitoring and health physics instrumentation, nuclear safeguards and reactor instrumentation, and a 1984 symposium on nuclear power systems. Attention is given to the application of multiprocessors to scientific problems, a large-scale computer facility for computational aerodynamics, a single-board 32-bit computer for the Fastbus, the integration of detector arrays and readout electronics on a single chip, and three-dimensional Monte Carlo simulation of the electron avalanche in a proportional counter.

Biggerstaff, J. A.↗